-
-
DATA SHARING ARCHITECTURE
-
Publication number 20220300625
-
Publication date Sep 22, 2022
-
Helios Data Inc.
-
Yi Sun
-
G06 - COMPUTING CALCULATING COUNTING
-
-
OPTICAL SENSOR PACKAGING SYSTEM
-
Publication number 20200335359
-
Publication date Oct 22, 2020
-
Maxim Integrated Products, Inc.
-
Saurabh Nilkanth Athavale
-
H01 - BASIC ELECTRIC ELEMENTS
-
DATA SHARING ARCHITECTURE
-
Publication number 20200233968
-
Publication date Jul 23, 2020
-
Helios Data Inc.
-
Yi Sun
-
G06 - COMPUTING CALCULATING COUNTING
-
DATA MANAGEMENT PLATFORM
-
Publication number 20200236143
-
Publication date Jul 23, 2020
-
Helios Data Inc.
-
Fei Zou
-
G06 - COMPUTING CALCULATING COUNTING
-
DATA SEGMENTATION
-
Publication number 20200236124
-
Publication date Jul 23, 2020
-
Helios Data Inc.
-
Yi Sun
-
G06 - COMPUTING CALCULATING COUNTING
-
OPTICAL SENSOR PACKAGING SYSTEM
-
Publication number 20190295858
-
Publication date Sep 26, 2019
-
Maxim Integrated Products, Inc.
-
Saurabh Nilkanth Athavale
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
CONTEXT AWARE MICROSEGMENTATION
-
Publication number 20170063933
-
Publication date Mar 2, 2017
-
vArmour Networks, Inc.
-
Choung-Yaw Shieh
-
G06 - COMPUTING CALCULATING COUNTING
-
-
-
-
-
-
-
-
-
-
-
-
-
-
STACKED WAFER-LEVEL PACKAGE DEVICE
-
Publication number 20130056866
-
Publication date Mar 7, 2013
-
MAXIM INTEGRATED PRODUCTS, INC.
-
Arkadii V. Samoilov
-
H01 - BASIC ELECTRIC ELEMENTS
-
INTERPOSER FOR SEMICONDUCTOR PACKAGE
-
Publication number 20100109142
-
Publication date May 6, 2010
-
United Test & Assembly Center Ltd.
-
Chin Hock Toh
-
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
-
-
3D MEMS/MOEMS package
-
Publication number 20040140475
-
Publication date Jul 22, 2004
-
United Test & Assembly Center Limited
-
Yi-Sheng Sun
-
B81 - MICRO-STRUCTURAL TECHNOLOGY
-
Wl-bga for MEMS/MOEMS devices
-
Publication number 20040140557
-
Publication date Jul 22, 2004
-
United Test & Assembly Center Limited
-
Yi-Sheng Sun
-
B81 - MICRO-STRUCTURAL TECHNOLOGY