Yi-Tien Chu

Person

Taipei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing an optical sensor
- Patent number 12,125,934
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yi-Shin Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor sensor and methods thereof
- Patent number 12,015,099
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yin-Kai Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation layer for epitaxial semiconductor process
- Patent number 11,908,900
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yin-Kai Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and manufacturing method thereof
- Patent number 11,901,393
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jhy-Jyi Sze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Germanium-based sensor with junction-gate field effect transistor a...
- Patent number 11,855,237
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhy-Jyi Sze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with passivation layer for dark current reduction
- Patent number 11,848,345
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiang-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna effect protection and electrostatic discharge protection fo...
- Patent number 11,824,254
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hsiang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact to improve thermal dissipation away from semicondu...
- Patent number 11,756,936
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oversized via as through-substrate-via (TSV) stop layer
- Patent number 11,756,862
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Germanium-based sensor with junction-gate field effect transistor a...
- Patent number 11,600,737
- Issue date Mar 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhy-Jyi Sze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging device comprising a shield structure
- Patent number 11,552,027
- Issue date Jan 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation layer for epitaxial semiconductor process
- Patent number 11,508,817
- Issue date Nov 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yin-Kai Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal probe structure and method for fabricating the same
- Patent number 11,474,128
- Issue date Oct 18, 2022
- Princo Corp.
- Yi-Lin Chu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Antenna effect protection and electrostatic discharge protection fo...
- Patent number 11,437,708
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hsiang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method for the same
- Patent number 11,387,167
- Issue date Jul 12, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact to improve thermal dissipation away from semicondu...
- Patent number 11,289,455
- Issue date Mar 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oversized via as through-substrate-via (TSV) stop layer
- Patent number 11,282,769
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation method of light sensing device
- Patent number 11,233,082
- Issue date Jan 25, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging device comprising a shield structure
- Patent number 11,037,885
- Issue date Jun 15, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yu Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,018,179
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photography device
- Patent number 10,809,534
- Issue date Oct 20, 2020
- FASPRO SYSTEMS CO., LTD.
- Steve Tsao
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Seal-ring structure for stacking integrated circuits
- Patent number 10,777,539
- Issue date Sep 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Shin Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method for the same
- Patent number 10,727,164
- Issue date Jul 28, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 10,686,005
- Issue date Jun 16, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of light sensing device
- Patent number 10,651,217
- Issue date May 12, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Color filter uniformity for image sensor devices
- Patent number 10,553,631
- Issue date Feb 4, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Hsing Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elevated photodiode with a stacked scheme
- Patent number 10,510,791
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Hsun Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal-ring structure for stacking integrated circuits
- Patent number 10,475,772
- Issue date Nov 12, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Shin Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Color filter uniformity for image sensor devices
- Patent number 10,304,885
- Issue date May 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsing Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device
- Patent number 10,276,616
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kun-Huei Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LINER LAYER ALONG ABSORPTION STRUCTURE OF IR SENSOR
- Publication number 20240355843
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SENSOR AND METHODS THEREOF
- Publication number 20240339555
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yin-Kai LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING IMAGE SENSOR
- Publication number 20240145520
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JHY-JYI SZE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION LAYER FOR EPITAXIAL SEMICONDUCTOR PROCESS
- Publication number 20240136401
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yin-Kai Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240128378
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Cheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna Effect Protection and Electrostatic Discharge Protection fo...
- Publication number 20240120639
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hsiang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Germanium-Based Sensor with Junction-Gate Field Effect Transistor a...
- Publication number 20240105877
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhy-Jyi Sze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT, TRANSISTOR AND MEHTOD OF FABRICATING THE SAME
- Publication number 20230395673
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Cheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR WITH PASSIVATION LAYER FOR DARK CURRENT REDUCTION
- Publication number 20230387159
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT TO IMPROVE THERMAL DISSIPATION AWAY FROM SEMICONDU...
- Publication number 20230369293
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER
- Publication number 20230361005
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR STRUCTURE
- Publication number 20230343885
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING GERMANIUM REGION DISPOSED IN SEMICON...
- Publication number 20230207719
- Publication date Jun 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Germanium-Based Sensor with Junction-Gate Field Effect Transistor a...
- Publication number 20230163231
- Publication date May 25, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhy-Jyi Sze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR IMAGE SENSOR AND METHOD FOR FORMING THE SAME
- Publication number 20230069164
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- JHY-JYI SZE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Memory Device And Method Of Forming The Same
- Publication number 20220406992
- Publication date Dec 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Cheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION LAYER FOR EPITAXIAL SEMICONDUCTOR PROCESS
- Publication number 20220367638
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yin-Kai Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna Effect Protection and Electrostatic Discharge Protection fo...
- Publication number 20220368004
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hsiang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220310871
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- YI-SHIN CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Germanium-Based Sensor with Junction-Gate Field Effect Transistor a...
- Publication number 20220302336
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhy-Jyi Sze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20220271080
- Publication date Aug 25, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- JHY-JYI SZE
- G01 - MEASURING TESTING
Information Patent Application
BACKSIDE CONTACT TO IMPROVE THERMAL DISSIPATION AWAY FROM SEMICONDU...
- Publication number 20220216185
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER
- Publication number 20220208651
- Publication date Jun 30, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CELL SEARCH BASED ON SPATIAL-TEMPORAL STATISTICAL INFORMATION
- Publication number 20220191775
- Publication date Jun 16, 2022
- MEDIATEK INC.
- Pei-Tsung Wu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
LIGHT SENSING DEVICE WITH FILTER ELEMENT
- Publication number 20220109019
- Publication date Apr 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Wei CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR WITH PASSIVATION LAYER FOR DARK CURRENT REDUCTION
- Publication number 20220102410
- Publication date Mar 31, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiang-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER SUBSTRATE STRUCTURE WHICH CAN BE PEELED OFF PRECISELY A...
- Publication number 20220087027
- Publication date Mar 17, 2022
- Princo Corp.
- Pei-Liang CHIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR SENSOR AND METHODS THEREOF
- Publication number 20220037552
- Publication date Feb 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yin-Kai LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER
- Publication number 20210391237
- Publication date Dec 16, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT TO IMPROVE THERMAL DISSIPATION AWAY FROM SEMICONDU...
- Publication number 20210391302
- Publication date Dec 16, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS

Yi-Tien Chu

Person

Patents Grantslast 30 patents

Method of manufacturing an optical sensor

Semiconductor sensor and methods thereof

Passivation layer for epitaxial semiconductor process

Image sensor and manufacturing method thereof

Germanium-based sensor with junction-gate field effect transistor a...

Image sensor with passivation layer for dark current reduction

Antenna effect protection and electrostatic discharge protection fo...

Backside contact to improve thermal dissipation away from semicondu...

Oversized via as through-substrate-via (TSV) stop layer

Germanium-based sensor with junction-gate field effect transistor a...

Semiconductor packaging device comprising a shield structure

Passivation layer for epitaxial semiconductor process

Metal probe structure and method for fabricating the same

Antenna effect protection and electrostatic discharge protection fo...

Semiconductor structure and manufacturing method for the same

Backside contact to improve thermal dissipation away from semicondu...

Oversized via as through-substrate-via (TSV) stop layer

Formation method of light sensing device

Semiconductor packaging device comprising a shield structure

Semiconductor structure

Photography device

Seal-ring structure for stacking integrated circuits

Semiconductor structure and manufacturing method for the same

Semiconductor structure

Structure and formation method of light sensing device

Color filter uniformity for image sensor devices

Elevated photodiode with a stacked scheme

Seal-ring structure for stacking integrated circuits

Color filter uniformity for image sensor devices

Image sensor device

Patents Applicationslast 30 patents

LINER LAYER ALONG ABSORPTION STRUCTURE OF IR SENSOR

SEMICONDUCTOR SENSOR AND METHODS THEREOF

METHODS FOR FABRICATING IMAGE SENSOR

PASSIVATION LAYER FOR EPITAXIAL SEMICONDUCTOR PROCESS

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Antenna Effect Protection and Electrostatic Discharge Protection fo...

Germanium-Based Sensor with Junction-Gate Field Effect Transistor a...

INTEGRATED CIRCUIT, TRANSISTOR AND MEHTOD OF FABRICATING THE SAME

IMAGE SENSOR WITH PASSIVATION LAYER FOR DARK CURRENT REDUCTION

BACKSIDE CONTACT TO IMPROVE THERMAL DISSIPATION AWAY FROM SEMICONDU...

OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER

IMAGE SENSOR STRUCTURE

SEMICONDUCTOR DEVICE INCLUDING GERMANIUM REGION DISPOSED IN SEMICON...

Germanium-Based Sensor with Junction-Gate Field Effect Transistor a...

SEMICONDUCTOR IMAGE SENSOR AND METHOD FOR FORMING THE SAME

Semiconductor Memory Device And Method Of Forming The Same

PASSIVATION LAYER FOR EPITAXIAL SEMICONDUCTOR PROCESS

Antenna Effect Protection and Electrostatic Discharge Protection fo...

OPTICAL SENSOR AND METHOD OF MANUFACTURING THE SAME

Germanium-Based Sensor with Junction-Gate Field Effect Transistor a...

IMAGE SENSOR AND MANUFACTURING METHOD THEREOF

BACKSIDE CONTACT TO IMPROVE THERMAL DISSIPATION AWAY FROM SEMICONDU...

OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER

CELL SEARCH BASED ON SPATIAL-TEMPORAL STATISTICAL INFORMATION

LIGHT SENSING DEVICE WITH FILTER ELEMENT

IMAGE SENSOR WITH PASSIVATION LAYER FOR DARK CURRENT REDUCTION

MULTI-LAYER SUBSTRATE STRUCTURE WHICH CAN BE PEELED OFF PRECISELY A...

SEMICONDUCTOR SENSOR AND METHODS THEREOF

OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER

BACKSIDE CONTACT TO IMPROVE THERMAL DISSIPATION AWAY FROM SEMICONDU...