Yih-Jenn Jiang

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,159,821
- Issue date Dec 3, 2024
- Siliconware Precision Industries Co., Ltd.
- Ting-Yang Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and circuit structure thereof
- Patent number 11,791,300
- Issue date Oct 17, 2023
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 11,764,188
- Issue date Sep 19, 2023
- SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Meng-Huan Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of packaging substrate
- Patent number 10,192,838
- Issue date Jan 29, 2019
- Siliconware Precision Industries Co., Ltd.
- Chien-Lung Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor package
- Patent number 8,895,367
- Issue date Nov 25, 2014
- Siliconware Precision Industries Co., Ltd.
- Jung-Pang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabrication method thereof
- Patent number 8,519,526
- Issue date Aug 27, 2013
- Siliconware Precision Industries Co., Ltd.
- Jung-Pang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package fabrication method
- Patent number 7,993,967
- Issue date Aug 9, 2011
- Siliconware Precision Industries Co., Ltd.
- Yih-Jenn Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabrication method thereof
- Patent number 7,638,879
- Issue date Dec 29, 2009
- Siliconware Precision Industries Co., Ltd.
- Yih-Jenn Jiang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250038088
- Publication date Jan 30, 2025
- Siliconware Precision Industries Co., Ltd.
- Ting-Yang Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20240234272
- Publication date Jul 11, 2024
- Siliconware Precision Industries Co., Ltd.
- Hung-Kai WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240153884
- Publication date May 9, 2024
- Siliconware Precision Industries Co., Ltd.
- Yi-Min FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20240136263
- Publication date Apr 25, 2024
- Siliconware Precision Industries Co., Ltd.
- Hung-Kai WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230395571
- Publication date Dec 7, 2023
- Siliconware Precision Industries Co., Ltd.
- Meng-Huan Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230307339
- Publication date Sep 28, 2023
- Siliconware Precision Industries Co., Ltd.
- Ting-Yang Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE
- Publication number 20230066456
- Publication date Mar 2, 2023
- Siliconware Precision Industries Co., Ltd.
- Pei-Geng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230015721
- Publication date Jan 19, 2023
- Siliconware Precision Industries Co., Ltd.
- Meng-Huan Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20220189900
- Publication date Jun 16, 2022
- Siliconware Precision Industries Co., Ltd.
- Chia-Yu Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND CIRCUIT STRUCTURE THEREOF
- Publication number 20220148996
- Publication date May 12, 2022
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE HAVING A SHIELDING LAYER
- Publication number 20190214372
- Publication date Jul 11, 2019
- Siliconware Precision Industries Co., Ltd.
- Hong-Da Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20180068983
- Publication date Mar 8, 2018
- Siliconware Precision Industries Co., Ltd.
- Hong-Da Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF PACKAGING SUBSTRATE
- Publication number 20170133337
- Publication date May 11, 2017
- Siliconware Precision Industries Co., Ltd.
- Chien-Lung Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20130330883
- Publication date Dec 12, 2013
- Siliconware Precision Industries Co., Ltd.
- Jung-Pang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND FABRICATION METHOD THEREOF
- Publication number 20130113095
- Publication date May 9, 2013
- Siliconware Precision Industries Co., Ltd.
- Chien-Lung Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20120161301
- Publication date Jun 28, 2012
- Siliconware Precision Industries Co., Ltd.
- Jung-Pang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating semiconductor package
- Publication number 20120129315
- Publication date May 24, 2012
- Siliconware Precision Industries Co., Ltd.
- Yeh-Chang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20100052146
- Publication date Mar 4, 2010
- Siliconware Precision Industries Co., Ltd.
- Yih-Jenn Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and fabrication method thereof
- Publication number 20080116580
- Publication date May 22, 2008
- Siliconware Precision Industries Co., Ltd.
- Yih-Jenn Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-chip semiconductor device and method for fabricating the same
- Publication number 20070178627
- Publication date Aug 2, 2007
- Siliconware Precision Industries Co., Ltd.
- Yih Jenn Jiang
- H01 - BASIC ELECTRIC ELEMENTS

Yih-Jenn Jiang

Person

Patents Grantslast 30 patents

Electronic package and manufacturing method thereof

Electronic package and circuit structure thereof

Electronic package and manufacturing method thereof

Fabrication method of packaging substrate

Fabrication method of semiconductor package

Semiconductor package and fabrication method thereof

Semiconductor package fabrication method

Semiconductor package and fabrication method thereof

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SUBSTRATE STRUCTURE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

ELECTRONIC PACKAGE AND CIRCUIT STRUCTURE THEREOF

METHOD FOR FABRICATING ELECTRONIC PACKAGE HAVING A SHIELDING LAYER

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

FABRICATION METHOD OF PACKAGING SUBSTRATE

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE

PACKAGING SUBSTRATE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

Method for fabricating semiconductor package

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

Semiconductor package and fabrication method thereof

Flip-chip semiconductor device and method for fabricating the same