Yimin Huang

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices for image sensing
- Patent number 12,136,638
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Chia Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance image sensor
- Patent number 12,100,726
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tung-Ting Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device crack-stop structure to prevent damage due to dicing crack
- Patent number 12,057,412
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tung-Ting Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor imaging device having improved dark current performance
- Patent number 12,040,336
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Seiji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including an epitaxy region
- Patent number 11,955,547
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Te-Jen Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal reflector grounding for noise reduction in light detector
- Patent number 11,705,474
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Ting Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance image sensor
- Patent number 11,670,663
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tung-Ting Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photo diode with dual backside deep trench isolation depth
- Patent number 11,600,644
- Issue date Mar 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yimin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal capacitor structure to increase capacitance d...
- Patent number 11,574,940
- Issue date Feb 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yimin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor imaging device having improved dark current performance
- Patent number 11,538,837
- Issue date Dec 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Seiji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor image sensor
- Patent number 11,522,002
- Issue date Dec 6, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jhy-Jyi Sze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device crack-stop structure to prevent damage due to dicing crack
- Patent number 11,348,881
- Issue date May 31, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tung-Ting Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density image sensor
- Patent number 11,309,348
- Issue date Apr 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Seiji Takahashi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensor structure and manufacturing method thereof
- Patent number 11,189,650
- Issue date Nov 30, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yimin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density MIM capacitor structure
- Patent number 11,139,367
- Issue date Oct 5, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Seiji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal reflector grounding for noise reduction in light detector
- Patent number 11,088,196
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Ting Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices for image sensing
- Patent number 11,075,242
- Issue date Jul 27, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Chia Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implant damage free image sensor and method of the same
- Patent number 11,063,080
- Issue date Jul 13, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Alexander Kalnitsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal capacitor structure to increase capacitance d...
- Patent number 11,018,169
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yimin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor imaging device having improved dark current performance
- Patent number 11,004,880
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Seiji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance image sensor
- Patent number 10,991,746
- Issue date Apr 27, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tung-Ting Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor image sensor
- Patent number 10,868,071
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jhy-Jyi Sze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photo diode with dual backside deep trench isolation depth
- Patent number 10,854,647
- Issue date Dec 1, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yimin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor imaging device having improved dark current performance
- Patent number 10,797,091
- Issue date Oct 6, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Seiji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for MOS capacitors in replacement gate process
- Patent number 10,720,361
- Issue date Jul 21, 2020
- Taiwan Semiconductor Manufacturing Company
- Pai-Chieh Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implant damage free image sensor and method of the same
- Patent number 10,692,914
- Issue date Jun 23, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Alexander Kalnitsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor image sensor and method for forming the same
- Patent number 10,468,448
- Issue date Nov 5, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Sze Jhy-Jyi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Methods and apparatus for MOS capacitors in replacement gate process
- Patent number 10,354,920
- Issue date Jul 16, 2019
- Taiwan Semiconductor Manufacturing Company
- Pai-Chieh Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implant damage free image sensor and method of the same
- Patent number 10,177,187
- Issue date Jan 8, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Alexander Kalnitsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including an epitaxy region
- Patent number 10,164,093
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Jen Pan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES FOR IMAGE SENSING
- Publication number 20240371900
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Chia Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE CRACK-STOP STRUCTURE TO PREVENT DAMAGE DUE TO DICING CRACK
- Publication number 20240355764
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Ting Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE IMAGE SENSOR
- Publication number 20240332338
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Ting Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR IMAGING DEVICE HAVING IMPROVED DARK CURRENT PERFORMANCE
- Publication number 20240313010
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Seiji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE IMAGE SENSOR
- Publication number 20230253434
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Ting Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTO DIODE WITH DUAL BACKSIDE DEEP TRENCH ISOLATION DEPTH
- Publication number 20230207582
- Publication date Jun 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yimin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR IMAGING DEVICE HAVING IMPROVED DARK CURRENT PERFORMANCE
- Publication number 20230109829
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Seiji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE CRACK-STOP STRUCTURE TO PREVENT DAMAGE DUE TO DICING CRACK
- Publication number 20220246549
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Ting Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY IMAGE SENSOR
- Publication number 20220216262
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Seiji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES FOR IMAGE SENSING
- Publication number 20210351218
- Publication date Nov 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Chia Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL REFLECTOR GROUNDING FOR NOISE REDUCTION IN LIGHT DETECTOR
- Publication number 20210313383
- Publication date Oct 7, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Ting Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR IMAGING DEVICE HAVING IMPROVED DARK CURRENT PERFORMANCE
- Publication number 20210280620
- Publication date Sep 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Seiji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR STRUCTURE TO INCREASE CAPACITANCE D...
- Publication number 20210272991
- Publication date Sep 2, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Yimin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE IMAGE SENSOR
- Publication number 20210265412
- Publication date Aug 26, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Tung-Ting Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL REFLECTOR GROUNDING FOR NOISE REDUCTION IN LIGHT DETECTOR
- Publication number 20210151495
- Publication date May 20, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Yen-Ting Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR IMAGE SENSOR
- Publication number 20210118933
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- JHY-JYI SZE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE CRACK-STOP STRUCTURE TO PREVENT DAMAGE DUE TO DICING CRACK
- Publication number 20210098392
- Publication date Apr 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tung-Ting Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY IMAGE SENSOR
- Publication number 20210074758
- Publication date Mar 11, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Seiji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR STRUCTURE TO INCREASE CAPACITANCE D...
- Publication number 20210057469
- Publication date Feb 25, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Yimin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTO DIODE WITH DUAL BACKSIDE DEEP TRENCH ISOLATION DEPTH
- Publication number 20210028208
- Publication date Jan 28, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Yimin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR IMAGING DEVICE HAVING IMPROVED DARK CURRENT PERFORMANCE
- Publication number 20210005649
- Publication date Jan 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Seiji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200343283
- Publication date Oct 29, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- YIMIN HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPLANT DAMAGE FREE IMAGE SENSOR AND METHOD OF THE SAME
- Publication number 20200303431
- Publication date Sep 24, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- ALEXANDER KALNITSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTO DIODE WITH DUAL BACKSIDE DEEP TRENCH ISOLATION DEPTH
- Publication number 20200176492
- Publication date Jun 4, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Yimin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY MIM CAPACITOR STRUCTURE
- Publication number 20200135844
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Seiji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE IMAGE SENSOR
- Publication number 20200135792
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Tung-Ting Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR IMAGE SENSOR
- Publication number 20200043967
- Publication date Feb 6, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- JHY-JYI SZE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR IMAGING DEVICE HAVING IMPROVED DARK CURRENT PERFORMANCE
- Publication number 20190371838
- Publication date Dec 5, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Seiji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus for MOS Capacitors in Replacement Gate Process
- Publication number 20190341310
- Publication date Nov 7, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pai-Chieh Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR IMAGE SENSOR AND METHOD FOR FORMING THE SAME
- Publication number 20190165025
- Publication date May 30, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- SZE JHY-JYI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Yimin Huang

Person

Patents Grantslast 30 patents

Semiconductor devices for image sensing

High performance image sensor

Device crack-stop structure to prevent damage due to dicing crack

Semiconductor imaging device having improved dark current performance

Semiconductor device including an epitaxy region

Metal reflector grounding for noise reduction in light detector

High performance image sensor

Photo diode with dual backside deep trench isolation depth

Metal-insulator-metal capacitor structure to increase capacitance d...

Semiconductor imaging device having improved dark current performance

Method for forming semiconductor image sensor

Device crack-stop structure to prevent damage due to dicing crack

High density image sensor

Image sensor structure and manufacturing method thereof

High density MIM capacitor structure

Metal reflector grounding for noise reduction in light detector

Semiconductor devices for image sensing

Implant damage free image sensor and method of the same

Metal-insulator-metal capacitor structure to increase capacitance d...

Semiconductor imaging device having improved dark current performance

High performance image sensor

Method for forming semiconductor image sensor

Photo diode with dual backside deep trench isolation depth

Semiconductor imaging device having improved dark current performance

Methods and apparatus for MOS capacitors in replacement gate process

Implant damage free image sensor and method of the same

Semiconductor image sensor and method for forming the same

Methods and apparatus for MOS capacitors in replacement gate process

Implant damage free image sensor and method of the same

Semiconductor device including an epitaxy region

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES FOR IMAGE SENSING

DEVICE CRACK-STOP STRUCTURE TO PREVENT DAMAGE DUE TO DICING CRACK

HIGH PERFORMANCE IMAGE SENSOR

SEMICONDUCTOR IMAGING DEVICE HAVING IMPROVED DARK CURRENT PERFORMANCE

HIGH PERFORMANCE IMAGE SENSOR

PHOTO DIODE WITH DUAL BACKSIDE DEEP TRENCH ISOLATION DEPTH

SEMICONDUCTOR IMAGING DEVICE HAVING IMPROVED DARK CURRENT PERFORMANCE

DEVICE CRACK-STOP STRUCTURE TO PREVENT DAMAGE DUE TO DICING CRACK

HIGH DENSITY IMAGE SENSOR

SEMICONDUCTOR DEVICES FOR IMAGE SENSING

METAL REFLECTOR GROUNDING FOR NOISE REDUCTION IN LIGHT DETECTOR

SEMICONDUCTOR IMAGING DEVICE HAVING IMPROVED DARK CURRENT PERFORMANCE

METAL-INSULATOR-METAL CAPACITOR STRUCTURE TO INCREASE CAPACITANCE D...

HIGH PERFORMANCE IMAGE SENSOR

METAL REFLECTOR GROUNDING FOR NOISE REDUCTION IN LIGHT DETECTOR

METHOD FOR FORMING SEMICONDUCTOR IMAGE SENSOR

DEVICE CRACK-STOP STRUCTURE TO PREVENT DAMAGE DUE TO DICING CRACK

HIGH DENSITY IMAGE SENSOR

METAL-INSULATOR-METAL CAPACITOR STRUCTURE TO INCREASE CAPACITANCE D...

PHOTO DIODE WITH DUAL BACKSIDE DEEP TRENCH ISOLATION DEPTH

SEMICONDUCTOR IMAGING DEVICE HAVING IMPROVED DARK CURRENT PERFORMANCE

IMAGE SENSOR STRUCTURE AND MANUFACTURING METHOD THEREOF

IMPLANT DAMAGE FREE IMAGE SENSOR AND METHOD OF THE SAME

PHOTO DIODE WITH DUAL BACKSIDE DEEP TRENCH ISOLATION DEPTH

HIGH DENSITY MIM CAPACITOR STRUCTURE

HIGH PERFORMANCE IMAGE SENSOR

METHOD FOR FORMING SEMICONDUCTOR IMAGE SENSOR

SEMICONDUCTOR IMAGING DEVICE HAVING IMPROVED DARK CURRENT PERFORMANCE

Methods and Apparatus for MOS Capacitors in Replacement Gate Process

SEMICONDUCTOR IMAGE SENSOR AND METHOD FOR FORMING THE SAME