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Yiming Li
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Cupertino, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Voltage switchable dielectric for die-level electrostatic discharge...
Patent number
8,691,707
Issue date
Apr 8, 2014
QUALCOMM Incorporated
Shiqun Gu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Voltage switchable dielectric for die-level electrostatic discharge...
Patent number
8,633,562
Issue date
Jan 21, 2014
QUALCOMM Incorporated
Shiqun Gu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
VOLTAGE SWITCHABLE DIELECTRIC FOR DIE-LEVEL ELECTROSTATIC DISCHARGE...
Publication number
20130316526
Publication date
Nov 28, 2013
QUALCOMM Incorporated
Shiqun Gu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Voltage Switchable Dielectric for Die-Level Electrostatic Discharge...
Publication number
20120248582
Publication date
Oct 4, 2012
QUALCOMM Incorporated
Shiqun Gu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Selective Patterning for Low Cost through Vias
Publication number
20110248405
Publication date
Oct 13, 2011
QUALCOMM Incorporated
Yiming Li
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Through Glass Via Manufacturing Process
Publication number
20110229687
Publication date
Sep 22, 2011
QUALCOMM Incorporated
Shiqun Gu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
THROUGH-SILICON VIA FABRICATION WITH ETCH STOP FILM
Publication number
20110227230
Publication date
Sep 22, 2011
QUALCOMM Incorporated
Shiqun Gu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device with Vias Having More Than One Material
Publication number
20110204517
Publication date
Aug 25, 2011
QUALCOMM Incorporated
Shiqun Gu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Barrier Layer On Polymer Passivation For Integrated Circuit Packaging
Publication number
20110012239
Publication date
Jan 20, 2011
QUALCOMM Incorporated
Shiqun Gu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stress Balance Layer on Semiconductor Wafer Backside
Publication number
20100314725
Publication date
Dec 16, 2010
QUALCOMM Incorporated
Shiqun Gu
H01 - BASIC ELECTRIC ELEMENTS