Yin Wei LIM

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Singapore, SG

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Patents Applicationslast 30 patents

Information Patent Application
DIE BACKSIDE PROFILE for SEMICONDUCTOR DEVICES
- Publication number 20250062129
- Publication date Feb 20, 2025
- Applied Materials, Inc.
- Yin Wei LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Grain Structure Engineering for Metal Gapfill Materials
- Publication number 20250038137
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Prayudi LIANTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATION METHOD FOR DEFECT CHARACTERIZATION FOR HYBRID BONDING AP...
- Publication number 20240330671
- Publication date Oct 3, 2024
- Rahul Reddy KOMATIREDDI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRE-BONDING AUTOMATIC OPTICAL INSPECTION DEFECT CLASSIFICATION
- Publication number 20240331131
- Publication date Oct 3, 2024
- Rahul Reddy KOMATIREDDI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POST BONDING AOI DEFECT CLASSIFICATION
- Publication number 20240331126
- Publication date Oct 3, 2024
- Rahul Reddy KOMATIREDDI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WATER VAPOR PLASMA TO ENHANCE SURFACE HYDROPHILICITY
- Publication number 20230100863
- Publication date Mar 30, 2023
- Prayudi LIANTO
- H01 - BASIC ELECTRIC ELEMENTS