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last 30 patents
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Patent Application
PACKAGING STRUCTURE, ELECTRONIC DEVICE, AND CHIP PACKAGING METHOD
Publication number
20230037617
Publication date
Feb 9, 2023
Huawei Technologies Co., Ltd
Jiantao ZHENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-SIDE POWER DELIVERY IN STACKED MEMORY PACKAGING
Publication number
20220189901
Publication date
Jun 16, 2022
Huawei Technologies Co., Ltd
Shiqun Gu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGING APPARATUS AND PREPARATION METHOD THEREOF
Publication number
20220077018
Publication date
Mar 10, 2022
Huawei Technologies Co.,Ltd.
Mao Guo
H01 - BASIC ELECTRIC ELEMENTS