Yizhang Yang

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Dynamic refresh rate control
- Patent number 11,823,728
- Issue date Nov 21, 2023
- Apple Inc.
- Liang Deng
- G11 - INFORMATION STORAGE
Information Patent Grant
Coupled inductor structures utilizing magnetic films
- Patent number 11,430,606
- Issue date Aug 30, 2022
- Apple Inc.
- David P. Cappabianca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic refresh rate control
- Patent number 11,270,753
- Issue date Mar 8, 2022
- Apple Inc.
- Liang Deng
- G11 - INFORMATION STORAGE
Information Patent Grant
Dynamic refresh rate control
- Patent number 10,978,136
- Issue date Apr 13, 2021
- Apple Inc.
- Liang Deng
- G11 - INFORMATION STORAGE
Information Patent Grant
Systems and methods for determining temperatures of integrated circ...
- Patent number 10,001,800
- Issue date Jun 19, 2018
- Apple Inc.
- Toshinari Takayanagi
- G05 - CONTROLLING REGULATING
Information Patent Grant
Fan out system in package and method for forming the same
- Patent number 9,583,472
- Issue date Feb 28, 2017
- Apple Inc.
- Chih-Ming Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for calibrating temperatures sensor for integrate...
- Patent number 9,442,025
- Issue date Sep 13, 2016
- Apple Inc.
- Yizhang Yang
- G01 - MEASURING TESTING
Information Patent Grant
Stacked semiconductor chips with thermal management
- Patent number 9,385,055
- Issue date Jul 5, 2016
- ATI Technologies ULC
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced wafer level fan-out POP package
- Patent number 9,318,474
- Issue date Apr 19, 2016
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PoP structure with electrically insulating material between packages
- Patent number 9,263,426
- Issue date Feb 16, 2016
- Apple Inc.
- Jie-Hua Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material with support structure
- Patent number 9,263,364
- Issue date Feb 16, 2016
- Advanced Micro Devices, Inc.
- Maxat Touzelbaev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PoP structure with electrically insulating material between packages
- Patent number 8,963,311
- Issue date Feb 24, 2015
- Apple Inc.
- Jie-Hua Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transient thermal modeling of multisource power devices
- Patent number 8,635,044
- Issue date Jan 21, 2014
- Advanced Micro Devices, Inc.
- Maxat Touzelbaev
- G01 - MEASURING TESTING
Information Patent Grant
Thermal interface material with support structure
- Patent number 8,034,662
- Issue date Oct 11, 2011
- Advanced Micro Devices, Inc.
- Maxat Touzelbaev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device structures including phase-change storage cells
- Patent number 7,848,139
- Issue date Dec 7, 2010
- Seagate Technology LLC
- Yizhang Yang
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
Dynamic Refresh Rate Control
- Publication number 20240119991
- Publication date Apr 11, 2024
- Apple Inc.
- Liang Deng
- G11 - INFORMATION STORAGE
Information Patent Application
Structure and Method of Fabrication for High Performance Integrated...
- Publication number 20240088032
- Publication date Mar 14, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUPLED INDUCTOR STRUCTURES UTILIZING MAGNETIC FILMS
- Publication number 20220406522
- Publication date Dec 22, 2022
- Apple Inc.
- David P. Cappabianca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dynamic Refresh Rate Control
- Publication number 20220254410
- Publication date Aug 11, 2022
- Apple Inc.
- Liang Deng
- G11 - INFORMATION STORAGE
Information Patent Application
Dynamic Refresh Rate Control
- Publication number 20210201987
- Publication date Jul 1, 2021
- Apple Inc.
- Liang Deng
- G11 - INFORMATION STORAGE
Information Patent Application
Dynamic Refresh Rate Control
- Publication number 20210020231
- Publication date Jan 21, 2021
- Apple Inc.
- Liang Deng
- G11 - INFORMATION STORAGE
Information Patent Application
COUPLED INDUCTOR STRUCTURES UTILIZING MAGNETIC FILMS
- Publication number 20190221365
- Publication date Jul 18, 2019
- David P. Cappabianca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT SYSTEM IN PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20160260695
- Publication date Sep 8, 2016
- Apple Inc.
- Chih-Ming Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally Enhanced Wafer Level Fan-Out POP Package
- Publication number 20150171063
- Publication date Jun 18, 2015
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Calibrating Temperatures Sensor for Integrate...
- Publication number 20150117486
- Publication date Apr 30, 2015
- Apple Inc.
- Yizhang Yang
- G01 - MEASURING TESTING
Information Patent Application
PoP STRUCTURE WITH ELECTRICALLY INSULATING MATERIAL BETWEEN PACKAGES
- Publication number 20150118795
- Publication date Apr 30, 2015
- Apple Inc.
- Jie-Hua Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PoP STRUCTURE WITH ELECTRICALLY INSULATING MATERIAL BETWEEN PACKAGES
- Publication number 20140084487
- Publication date Mar 27, 2014
- Apple Inc.
- Jie-Hua Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transient Thermal Modeling of Multisource Power Devices
- Publication number 20120278029
- Publication date Nov 1, 2012
- ATI Technologies ULC
- Maxat Touzelbaev
- G01 - MEASURING TESTING
Information Patent Application
STACKED SEMICONDUCTOR CHIPS WITH THERMAL MANAGEMENT
- Publication number 20120043668
- Publication date Feb 23, 2012
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL WITH SUPPORT STRUCTURE
- Publication number 20110304051
- Publication date Dec 15, 2011
- Maxat Touzelbaev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Interface Material with Support Structure
- Publication number 20100237496
- Publication date Sep 23, 2010
- Maxat Touzelbaev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE STRUCTURES INCLUDING PHASE-CHANGE STORAGE CELLS
- Publication number 20100067288
- Publication date Mar 18, 2010
- Seagate Technology LLC
- Yizhang Yang
- G11 - INFORMATION STORAGE

Yizhang Yang

Person

Patents Grantslast 30 patents

Dynamic refresh rate control

Coupled inductor structures utilizing magnetic films

Dynamic refresh rate control

Dynamic refresh rate control

Systems and methods for determining temperatures of integrated circ...

Fan out system in package and method for forming the same

System and method for calibrating temperatures sensor for integrate...

Stacked semiconductor chips with thermal management

Thermally enhanced wafer level fan-out POP package

PoP structure with electrically insulating material between packages

Thermal interface material with support structure

PoP structure with electrically insulating material between packages

Transient thermal modeling of multisource power devices

Thermal interface material with support structure

Memory device structures including phase-change storage cells

Patents Applicationslast 30 patents

Dynamic Refresh Rate Control

Structure and Method of Fabrication for High Performance Integrated...

COUPLED INDUCTOR STRUCTURES UTILIZING MAGNETIC FILMS

Dynamic Refresh Rate Control

Dynamic Refresh Rate Control

Dynamic Refresh Rate Control

COUPLED INDUCTOR STRUCTURES UTILIZING MAGNETIC FILMS

FAN OUT SYSTEM IN PACKAGE AND METHOD FOR FORMING THE SAME

Thermally Enhanced Wafer Level Fan-Out POP Package

System and Method for Calibrating Temperatures Sensor for Integrate...

PoP STRUCTURE WITH ELECTRICALLY INSULATING MATERIAL BETWEEN PACKAGES

PoP STRUCTURE WITH ELECTRICALLY INSULATING MATERIAL BETWEEN PACKAGES

Transient Thermal Modeling of Multisource Power Devices

STACKED SEMICONDUCTOR CHIPS WITH THERMAL MANAGEMENT

THERMAL INTERFACE MATERIAL WITH SUPPORT STRUCTURE

Thermal Interface Material with Support Structure

MEMORY DEVICE STRUCTURES INCLUDING PHASE-CHANGE STORAGE CELLS