Yogesh M. Desai

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San Jose, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Microcap wafer-level package
- Patent number 6,429,511
- Issue date Aug 6, 2002
- Agilent Technologies, Inc.
- Richard C. Ruby
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microcap wafer-level package
- Patent number 6,376,280
- Issue date Apr 23, 2002
- Agilent Technologies, Inc.
- Richard C. Ruby
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microcap wafer-level package
- Patent number 6,265,246
- Issue date Jul 24, 2001
- Agilent Technologies, Inc.
- Richard C. Ruby
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microcap wafer-level package with vias
- Patent number 6,228,675
- Issue date May 8, 2001
- Agilent Technologies, Inc.
- Richard C. Ruby
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
SBAR structures and method of fabrication of SBAR.FBAR film process...
- Patent number 6,060,818
- Issue date May 9, 2000
- Hewlett-Packard Company
- Richard C. Ruby
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
Microcap wafer-level package
- Publication number 20020017713
- Publication date Feb 14, 2002
- Richard C. Ruby
- B81 - MICRO-STRUCTURAL TECHNOLOGY