Yohei Onishi

Person

Kyoto-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Resin molding apparatus and method of manufacturing resin molded pr...
- Patent number 11,833,722
- Issue date Dec 5, 2023
- Towa Corporation
- Hayato Yasui
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Molding die for compression molding with resin leakage prevention m...
- Patent number 11,712,823
- Issue date Aug 1, 2023
- Towa Corporation
- Yusuke Yoshida
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Resin sealing apparatus and resin sealing method
- Patent number 10,170,346
- Issue date Jan 1, 2019
- Towa Corporation
- Yohei Onishi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Manufacturing method of optical electronic components and optical e...
- Patent number 8,771,563
- Issue date Jul 8, 2014
- Towa Corporation
- Shinji Takase
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Manufacturing method of optical electronic components and optical e...
- Patent number 8,696,951
- Issue date Apr 15, 2014
- Towa Corporation
- Shinji Takase
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Optical electronic component
- Patent number 8,193,558
- Issue date Jun 5, 2012
- Towa Corporation
- Shinji Takase
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of resin-sealing and molding an optical device
- Patent number 7,985,357
- Issue date Jul 26, 2011
- Towa Corporation
- Shinji Takase
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for manufacturing optical electronic component
- Patent number 7,811,491
- Issue date Oct 12, 2010
- Towa Corporation
- Shinji Takase
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Resin sealing method for electronic part and mold used for the method
- Patent number 7,618,573
- Issue date Nov 17, 2009
- Towa Corporation
- Shinji Takase
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of introducing resin for electronic component and apparatus...
- Patent number 6,929,977
- Issue date Aug 16, 2005
- Towa Corporation
- Shinji Takase
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COMPRESSION MOLD, RESIN MOLDING APPARATUS, RESIN MOLDING SYSTEM, AN...
- Publication number 20240009899
- Publication date Jan 11, 2024
- TOWA CORPORATION
- Yusuke YOSHIDA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
RESIN LEAKAGE PREVENTION MEMBER, RESIN LEAKAGE PREVENTION MEMBER SU...
- Publication number 20220063151
- Publication date Mar 3, 2022
- TOWA CORPORATION
- Yusuke YOSHIDA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
RESIN MOLDING APPARATUS AND METHOD OF MANUFACTURING RESIN MOLDED PR...
- Publication number 20220063149
- Publication date Mar 3, 2022
- TOWA CORPORATION
- Hayato Yasui
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
RESIN MOLDING APPARATUS AND MANUFACTURING METHOD OF RESIN MOLDED PR...
- Publication number 20220055261
- Publication date Feb 24, 2022
- TOWA CORPORATION
- Hayato YASUI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
RESIN SEALING APPARATUS AND RESIN SEALING METHOD
- Publication number 20160284576
- Publication date Sep 29, 2016
- TOWA CORPORATION
- Yohei ONISHI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
MOLDED ARTICLE PRODUCTION SYSTEM AND MOLDED ARTICLE PRODUCTION METHOD
- Publication number 20160151946
- Publication date Jun 2, 2016
- TOWA CORPORATION
- Takeaki TAKA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD OF RESIN ENCAPSULATION MOLDING FOR ELECTRONIC PART
- Publication number 20090291532
- Publication date Nov 26, 2009
- Shinji Takase
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
OPTICAL ELECTRONIC COMPONENT
- Publication number 20090258189
- Publication date Oct 15, 2009
- Shinji TAKASE
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD OF SEALING AND MOLDING ELECTRONIC COMPONENT WITH RESIN AND MOLD
- Publication number 20090102093
- Publication date Apr 23, 2009
- Hideki TOKUYAMA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Manufacturing method of optical electronic components and optical e...
- Publication number 20070138696
- Publication date Jun 21, 2007
- TOWA CORPORATION
- Shinji Takase
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Manufacturing method of optical electronic components and optical e...
- Publication number 20070132135
- Publication date Jun 14, 2007
- TOWA CORPORATION
- Shinji Takase
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Resin-sealing and molding apparatus of optical device
- Publication number 20070110839
- Publication date May 17, 2007
- Shinji Takase
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Resin sealing and molding method of electronic component
- Publication number 20070085237
- Publication date Apr 19, 2007
- TOWA CORPORATION
- Yohei Onishi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method of resin-sealing and molding an optical device
- Publication number 20070013090
- Publication date Jan 18, 2007
- Shinji Takase
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Resin sealing method for electronic part and mold used for the method
- Publication number 20060186576
- Publication date Aug 24, 2006
- Shinji Takase
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method of resin-sealing and molding an optical device
- Publication number 20050242452
- Publication date Nov 3, 2005
- TOWA CORPORATION
- Shinji Takase
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method of introducing resin for electronic component and apparatus...
- Publication number 20040063234
- Publication date Apr 1, 2004
- TOWA CORPORATION
- Shinji Takase
- H01 - BASIC ELECTRIC ELEMENTS

Yohei Onishi

Person

Patents Grantslast 30 patents

Resin molding apparatus and method of manufacturing resin molded pr...

Molding die for compression molding with resin leakage prevention m...

Resin sealing apparatus and resin sealing method

Manufacturing method of optical electronic components and optical e...

Manufacturing method of optical electronic components and optical e...

Optical electronic component

Method of resin-sealing and molding an optical device

Method for manufacturing optical electronic component

Resin sealing method for electronic part and mold used for the method

Method of introducing resin for electronic component and apparatus...

Patents Applicationslast 30 patents

COMPRESSION MOLD, RESIN MOLDING APPARATUS, RESIN MOLDING SYSTEM, AN...

RESIN LEAKAGE PREVENTION MEMBER, RESIN LEAKAGE PREVENTION MEMBER SU...

RESIN MOLDING APPARATUS AND METHOD OF MANUFACTURING RESIN MOLDED PR...

RESIN MOLDING APPARATUS AND MANUFACTURING METHOD OF RESIN MOLDED PR...

RESIN SEALING APPARATUS AND RESIN SEALING METHOD

MOLDED ARTICLE PRODUCTION SYSTEM AND MOLDED ARTICLE PRODUCTION METHOD

METHOD OF RESIN ENCAPSULATION MOLDING FOR ELECTRONIC PART

OPTICAL ELECTRONIC COMPONENT

METHOD OF SEALING AND MOLDING ELECTRONIC COMPONENT WITH RESIN AND MOLD

Manufacturing method of optical electronic components and optical e...

Manufacturing method of optical electronic components and optical e...

Resin-sealing and molding apparatus of optical device

Resin sealing and molding method of electronic component

Method of resin-sealing and molding an optical device

Resin sealing method for electronic part and mold used for the method

Method of resin-sealing and molding an optical device

Method of introducing resin for electronic component and apparatus...