Yoichi Harayama

Person

Nagano, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electrostatic chuck and substrate fixing device
- Patent number 12,230,527
- Issue date Feb 18, 2025
- Shinko Electric Industries Co., Ltd.
- Yusuke Muramatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate fixing device, electrostatic chuck, and method of manufac...
- Patent number 11,830,752
- Issue date Nov 28, 2023
- Shinko Electric Industries Co., Ltd.
- Yoichi Harayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate fixing device, electrostatic chuck and electrostatic chuc...
- Patent number 11,699,612
- Issue date Jul 11, 2023
- Shinko Electric Industries Co., Ltd.
- Keiichi Takemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate fixing device
- Patent number 11,631,598
- Issue date Apr 18, 2023
- Shinko Electric Industries Co., Ltd.
- Nobuyuki Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate fixing device
- Patent number 10,535,545
- Issue date Jan 14, 2020
- Shinko Electric Industries Co., Ltd.
- Yoichi Harayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate holding apparatus
- Patent number 10,361,110
- Issue date Jul 23, 2019
- Shinko Electric Industries Co., Ltd.
- Keiichi Takemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, method for manufacturing wiring substrate, and me...
- Patent number 9,538,668
- Issue date Jan 3, 2017
- Shinko Electric Industries Co., Ltd.
- Hideki Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of preparing a substrate with forming and remo...
- Patent number 8,129,259
- Issue date Mar 6, 2012
- Shinko Electric Industries Co., Ltd.
- Yoichi Harayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 7,811,857
- Issue date Oct 12, 2010
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintered body for manufacturing ceramic substrate
- Patent number 5,997,999
- Issue date Dec 7, 1999
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and process for mounting semiconductor chip
- Patent number 5,737,191
- Issue date Apr 7, 1998
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fired body for manufacturing a substrate
- Patent number 5,733,640
- Issue date Mar 31, 1998
- Shinko Electric Industries, Co., Ltd.
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic circuit board and manufacturing method thereof
- Patent number 5,702,807
- Issue date Dec 30, 1997
- Shiko Electric Industries Co., Ltd.
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic oxide circuit board
- Patent number 5,683,791
- Issue date Nov 4, 1997
- Shinko Electric Industries, Co., Ltd.
- Michio Horiuchi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Ceramic oxide circuit board
- Patent number 5,604,018
- Issue date Feb 18, 1997
- Shinko Electric Industries, Co., Ltd.
- Michio Horiuchi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 5,602,059
- Issue date Feb 11, 1997
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum nitride circuit board and method of producing same
- Patent number 5,464,950
- Issue date Nov 7, 1995
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum nitride circuit board
- Patent number 5,229,213
- Issue date Jul 20, 1993
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTROSTATIC CHUCK AND SUBSTRATE FIXING DEVICE
- Publication number 20220310434
- Publication date Sep 29, 2022
- Shinko Electric Industries Co., Ltd.
- Yusuke Muramatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FIXING DEVICE, ELECTROSTATIC CHUCK AND ELECTROSTATIC CHUC...
- Publication number 20220157636
- Publication date May 19, 2022
- Shinko Electric Industries Co., Ltd.
- Keiichi Takemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FIXING DEVICE, ELECTROSTATIC CHUCK, AND METHOD OF MANUFAC...
- Publication number 20210391203
- Publication date Dec 16, 2021
- Shinko Electric Industries Co., Ltd.
- Yoichi Harayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FIXING DEVICE
- Publication number 20200176282
- Publication date Jun 4, 2020
- Shinko Electric Industries Co., Ltd.
- Nobuyuki IIJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HOLDING APPARATUS
- Publication number 20180047604
- Publication date Feb 15, 2018
- Shinko Electric Industries Co., Ltd.
- Keiichi TAKEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FIXING DEVICE
- Publication number 20180040497
- Publication date Feb 8, 2018
- Shinko Electric Industries Co., Ltd.
- Yoichi HARAYAMA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
WIRING SUBSTRATE, METHOD FOR MANUFACTURING WIRING SUBSTRATE, AND ME...
- Publication number 20150250051
- Publication date Sep 3, 2015
- Shinko Electric Industries Co., Ltd.
- Hideki YUMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20110003433
- Publication date Jan 6, 2011
- Shinko Electric Industries Co., Ltd.
- Yoichi HARAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20060014320
- Publication date Jan 19, 2006
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H01 - BASIC ELECTRIC ELEMENTS

Yoichi Harayama

Person

Patents Grantslast 30 patents

Electrostatic chuck and substrate fixing device

Substrate fixing device, electrostatic chuck, and method of manufac...

Substrate fixing device, electrostatic chuck and electrostatic chuc...

Substrate fixing device

Substrate fixing device

Substrate holding apparatus

Wiring substrate, method for manufacturing wiring substrate, and me...

Manufacturing method of preparing a substrate with forming and remo...

Method of manufacturing semiconductor device

Sintered body for manufacturing ceramic substrate

Structure and process for mounting semiconductor chip

Fired body for manufacturing a substrate

Ceramic circuit board and manufacturing method thereof

Ceramic oxide circuit board

Ceramic oxide circuit board

Semiconductor device and method for manufacturing same

Aluminum nitride circuit board and method of producing same

Aluminum nitride circuit board

Patents Applicationslast 30 patents

ELECTROSTATIC CHUCK AND SUBSTRATE FIXING DEVICE

SUBSTRATE FIXING DEVICE, ELECTROSTATIC CHUCK AND ELECTROSTATIC CHUC...

SUBSTRATE FIXING DEVICE, ELECTROSTATIC CHUCK, AND METHOD OF MANUFAC...

SUBSTRATE FIXING DEVICE

SUBSTRATE HOLDING APPARATUS

SUBSTRATE FIXING DEVICE

WIRING SUBSTRATE, METHOD FOR MANUFACTURING WIRING SUBSTRATE, AND ME...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Method of manufacturing semiconductor device