Patent Abstracts Of Japan, vol. 12, No. 219 (C-506), Jun. 22, 1988 & JP-A-63 015866 (Copal Co Ltd), Jan. 22, 1988. |
Patent Abstracts Of Japan, vol. 14, No. 414 (E-0975), Sep. 7, 1990 & JP-A-02 159096 (Fujitsu Ltd), Jun. 19, 1990. |
Patent Abstracts Of Japan, vol. 16, No. 23 (E-1157), Jan. 21, 1992 & JP-A-03 240289 (Fujitsu Ltd), Oct. 25, 1991. |
Patent Abstracts Of Japan, vol. 16, No. 97 (E-1176), Mar. 10, 1992 & JP-A-03 276797 (Fujitsu Ltd), Dec. 6, 1991. |
Patent Abstracts Of Japan, vol. 16, No. 196 (E-1200), May 12, 1992 & JP-A-04 028294 (Ibiden Co Ltd), Jan. 30, 1992. |
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Database WPI, Week 8847, Derwent Publications Ltd., London, GB; AN 88-332648 & JP-A-63 244521 (Murata Mfg Co), Oct. 12, 1988. |
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Database WPI, "Copper Paste For Printed Circuit Boards--Prepared By Kneading Solid Component Contg. Glass Powder With Vehicle Component And Copper Powder For Improved Attached Strength", Week 9115, Derwent Publications Ltd., London, GB. |
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