Yoji Ueda

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electrode bonding structure, and manufacturing method for electrode...
- Patent number 8,867,228
- Issue date Oct 21, 2014
- Panasonic Corporation
- Hiroaki Katsura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer circuit board
- Patent number 7,423,884
- Issue date Sep 9, 2008
- Matsushita Electric Industrial Co., Ltd.
- Kouhei Enchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed circuit board
- Patent number 7,155,820
- Issue date Jan 2, 2007
- Matsushita Electric Industrial Co., Ltd.
- Daizo Andoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method for producing the same
- Patent number 6,799,369
- Issue date Oct 5, 2004
- Matsushita Electric Industrial Co., Ltd.
- Shozo Ochi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 6,753,483
- Issue date Jun 22, 2004
- Matsushita Electric Industrial Co., Ltd.
- Daizo Andoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing a circuit board
- Patent number 6,691,409
- Issue date Feb 17, 2004
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and production of the same
- Patent number 6,518,514
- Issue date Feb 11, 2003
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method for producing the same
- Patent number 6,459,046
- Issue date Oct 1, 2002
- Matsushita Electric Industrial Co., Ltd.
- Shozo Ochi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRODE BONDING STRUCTURE, AND MANUFACTURING METHOD FOR ELECTRODE...
- Publication number 20120285731
- Publication date Nov 15, 2012
- PANASONIC CORPORATION
- Hiroaki KATSURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER CIRCUIT SUBSTRATE MANUFACTURING METHOD AND MULTI-LAYER...
- Publication number 20090032285
- Publication date Feb 5, 2009
- Matsushita Electric Industrial Co., Ltd.
- Yoji Ueda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board and method for manufacturing the same, semiconductor...
- Publication number 20080185178
- Publication date Aug 7, 2008
- Matsushita Electric Industrial Co., Ltd.
- Rikiya Okimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TEST MARK STRUCTURE, SUBSTRATE SHEET LAMINATE, MULTILAYERED CIRCUIT...
- Publication number 20080186045
- Publication date Aug 7, 2008
- Matsushita Electric Industrial Co., Ltd.
- Yoji UEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer circuit board
- Publication number 20060081397
- Publication date Apr 20, 2006
- Matsushita Electric Industrial Co., Ltd.
- Kouhei Enchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board and method for manufacturing the same, semiconductor...
- Publication number 20050124197
- Publication date Jun 9, 2005
- Matsushita Electric Industrial Co., Ltd.
- Rikiya Okimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring substrate for intermediate connection and multi-layered wiri...
- Publication number 20050016764
- Publication date Jan 27, 2005
- Fumio Echigo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Member for a circuit board, method of manufacturing the same, and m...
- Publication number 20040214006
- Publication date Oct 28, 2004
- Matsushita Electric Industrial Co., Ltd.
- Kumiko Hirayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board and method of manufacturing the same
- Publication number 20040089471
- Publication date May 13, 2004
- Matsushita Electric Industrial Co., Ltd.
- Daizo Andoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board and method of manufacturing the same
- Publication number 20030137815
- Publication date Jul 24, 2003
- Matsushita Electric Industrial Co., Ltd.
- Shozo Ochi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board and production of the same
- Publication number 20030066683
- Publication date Apr 10, 2003
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Printed circuit board and method for producing the same
- Publication number 20020192485
- Publication date Dec 19, 2002
- Matsushita Electric Industrial Co., Ltd.
- Shozo Ochi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Circuit board and production of the same
- Publication number 20020038725
- Publication date Apr 4, 2002
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Takeshi Suzuki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Printed circuit board and method for producing the same
- Publication number 20020023777
- Publication date Feb 28, 2002
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Shozo Ochi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Printed circuit board and method of manufacturing the same
- Publication number 20010052425
- Publication date Dec 20, 2001
- Matsushita Electric Industrial Co., Ltd.,
- Daizo Andoh
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Person

Patents Grantslast 30 patents

Electrode bonding structure, and manufacturing method for electrode...

Multilayer circuit board

Method for manufacturing printed circuit board

Printed circuit board and method for producing the same

Printed circuit board and method of manufacturing the same

Method of producing a circuit board

Circuit board and production of the same

Printed circuit board and method for producing the same

Patents Applicationslast 30 patents

ELECTRODE BONDING STRUCTURE, AND MANUFACTURING METHOD FOR ELECTRODE...

MULTI-LAYER CIRCUIT SUBSTRATE MANUFACTURING METHOD AND MULTI-LAYER...

Circuit board and method for manufacturing the same, semiconductor...

TEST MARK STRUCTURE, SUBSTRATE SHEET LAMINATE, MULTILAYERED CIRCUIT...

Multilayer circuit board

Circuit board and method for manufacturing the same, semiconductor...

Wiring substrate for intermediate connection and multi-layered wiri...

Member for a circuit board, method of manufacturing the same, and m...

Printed circuit board and method of manufacturing the same

Printed wiring board and method of manufacturing the same

Circuit board and production of the same

Printed circuit board and method for producing the same

Circuit board and production of the same

Printed circuit board and method for producing the same

Printed circuit board and method of manufacturing the same