Yoko Sekihara

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Ibaraki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Through-mold structures
- Patent number 10,636,716
- Issue date Apr 28, 2020
- Intel Corporation
- Sasha Oster
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THROUGH-MOLD STRUCTURES
- Publication number 20180277458
- Publication date Sep 27, 2018
- Intel Corporation
- Sasha Oster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package on Package Structure Having Package To Package Interconnect...
- Publication number 20180090471
- Publication date Mar 29, 2018
- Intel Corporation
- Chia-Pin CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-MOLD STRUCTURES
- Publication number 20170178990
- Publication date Jun 22, 2017
- Intel Corporation
- Sasha Oster
- H01 - BASIC ELECTRIC ELEMENTS