Yong-Cheng Chuang

Person

Hsinchu County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 10,304,716
- Issue date May 28, 2019
- Powertech Technology Inc.
- Hsing-Te Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin fan-out multi-chip stacked package structure and manufacturing...
- Patent number 10,128,211
- Issue date Nov 13, 2018
- Powertech Technology Inc.
- Chia-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package structure and manufacturing method thereof
- Patent number 10,079,222
- Issue date Sep 18, 2018
- Powertech Technology Inc.
- Chien-Wei Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array package with protective circuitry layout and a subs...
- Patent number 9,859,187
- Issue date Jan 2, 2018
- Powertech Technology Inc.
- Yong-Cheng Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package structure
- Patent number 9,831,219
- Issue date Nov 28, 2017
- Powertech Technology Inc.
- Yong-Cheng Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin fan-out multi-chip stacked packages and the method for manufac...
- Patent number 9,761,568
- Issue date Sep 12, 2017
- Powertech Technology Inc.
- Li-Chih Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin fan-out multi-chip stacked package structure and manufacturing...
- Patent number 9,716,080
- Issue date Jul 25, 2017
- Powertech Technology Inc.
- Yong-Cheng Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming package structure with dummy pads for bonding
- Patent number 9,673,178
- Issue date Jun 6, 2017
- Powertech Technology Inc.
- Chia-Hsiang Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 9,659,911
- Issue date May 23, 2017
- Powertech Technology Inc.
- Chia-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20190189494
- Publication date Jun 20, 2019
- Powertech Technology Inc.
- Hsing-Te Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FAN-OUT MULTI-CHIP STACKED PACKAGE STRUCTURE AND MANUFACTURING...
- Publication number 20180211936
- Publication date Jul 26, 2018
- Powertech Technology Inc.
- Chia-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180138149
- Publication date May 17, 2018
- Powertech Technology Inc.
- Chien-Wei Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE
- Publication number 20170309597
- Publication date Oct 26, 2017
- Powertech Technology Inc.
- Yong-Cheng Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY PACKAGE WITH PROTECTIVE CIRCUITRY LAYOUT AND A SUBS...
- Publication number 20170194231
- Publication date Jul 6, 2017
- Powertech Technology Inc.
- Yong-Cheng CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FAN-OUT MULTI-CHIP STACKED PACKAGES AND THE METHOD FOR MANUFAC...
- Publication number 20170186737
- Publication date Jun 29, 2017
- Powertech Technology Inc.
- Li-Chih FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170110439
- Publication date Apr 20, 2017
- Powertech Technology Inc.
- Chia-Hsiang Yuan
- H01 - BASIC ELECTRIC ELEMENTS

Yong-Cheng Chuang

Person

Patents Grantslast 30 patents

Package structure and manufacturing method thereof

Thin fan-out multi-chip stacked package structure and manufacturing...

Package-on-package structure and manufacturing method thereof

Ball grid array package with protective circuitry layout and a subs...

Manufacturing method of package structure

Thin fan-out multi-chip stacked packages and the method for manufac...

Thin fan-out multi-chip stacked package structure and manufacturing...

Method of forming package structure with dummy pads for bonding

Package structure and manufacturing method thereof

Patents Applicationslast 30 patents

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

THIN FAN-OUT MULTI-CHIP STACKED PACKAGE STRUCTURE AND MANUFACTURING...

PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF PACKAGE STRUCTURE

BALL GRID ARRAY PACKAGE WITH PROTECTIVE CIRCUITRY LAYOUT AND A SUBS...

THIN FAN-OUT MULTI-CHIP STACKED PACKAGES AND THE METHOD FOR MANUFAC...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF