YONG HA WOO

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Kwang myung, KR

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Patents Grantslast 30 patents

Information Patent Grant
Coreless package structure and method for manufacturing same
- Patent number 9,362,248
- Issue date Jun 7, 2016
- Zhen Ding Technology Co., Ltd.
- Yong Ha Woo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging substrate, method for manufacturing same, and chip packag...
- Patent number 9,173,298
- Issue date Oct 27, 2015
- Zhen Ding Technology Co., Ltd.
- Yong Ha Woo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging substrate, method for manufacturing same, and chip packag...
- Patent number 9,165,790
- Issue date Oct 20, 2015
- Zhen Ding Technology Co., Ltd.
- Yong Ha Woo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAG...
- Publication number 20150380391
- Publication date Dec 31, 2015
- ZHEN DING TECHNOLOGY CO., LTD.
- YONG HA WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20150014849
- Publication date Jan 15, 2015
- ZHEN DING TECHNOLOGY CO., LTD.
- YONG HA WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAG...
- Publication number 20140185259
- Publication date Jul 3, 2014
- ZHEN DING TECHNOLOGY CO., LTD.
- YONG HA WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAG...
- Publication number 20140117553
- Publication date May 1, 2014
- ZHEN DING TECHNOLOGY CO., LTD.
- YONG HA WOO
- H01 - BASIC ELECTRIC ELEMENTS