Yong Lam Wai

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Ipoh, MY

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Patents Grantslast 30 patents

Information Patent Grant
Light emitting diode (LED) packages
- Patent number 8,674,488
- Issue date Mar 18, 2014
- Carsem (M) Sdn. Bhd.
- Yong Lam Wai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Large panel leadframe
- Patent number 8,535,988
- Issue date Sep 17, 2013
- Carsem (M) Sdn. Bhd.
- Yong Lam Wai
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Manufacturing light emitting diode (LED) packages
- Patent number 8,394,675
- Issue date Mar 12, 2013
- Carsem (M) SDN. BHD.
- Yong Lam Wai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package with recessed cavity for LED
- Patent number 8,314,479
- Issue date Nov 20, 2012
- Carsem (M) SDN. BHD.
- Yong Lam Wai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package using stud bump coated with solder
- Patent number 8,071,470
- Issue date Dec 6, 2011
- Carsem (M) SDN. BHD.
- Lily Khor
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING LIGHT EMITTING DIODE (LED) PACKAGES
- Publication number 20130221382
- Publication date Aug 29, 2013
- Carsem (M) Sdn.Bhd.
- Yong Lam Wai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LARGE PANEL LEADFRAME
- Publication number 20130109137
- Publication date May 2, 2013
- CARSEM (M) SDN. BHD.
- Yong Lam Wai
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
LEADFRAME PACKAGE WITH RECESSED CAVITY FOR LED
- Publication number 20120104421
- Publication date May 3, 2012
- Carsem (M) Sdn.Bhd.
- Yong Lam Wai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING LIGHT EMITTING DIODE (LED) PACKAGES
- Publication number 20120107974
- Publication date May 3, 2012
- Carsem (M) Sdn.Bhd.
- Yong Lam Wai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE USING STUD BUMP COATED WITH SOLDER
- Publication number 20120043655
- Publication date Feb 23, 2012
- CARSEM (M) SDN. BHD.
- Lily Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE USING STUD BUMP COATED WITH SOLDER
- Publication number 20100102444
- Publication date Apr 29, 2010
- CARSEM (M) SDN. BHD.
- Lily Khor
- H01 - BASIC ELECTRIC ELEMENTS