Yong Poo Chia

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Packaged integrated circuit devices with through-body conductive vi...
- Patent number 12,087,738
- Issue date Sep 10, 2024
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit devices with through-body conductive vi...
- Patent number 11,594,525
- Issue date Feb 28, 2023
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit devices with through-body conductive vi...
- Patent number 11,398,457
- Issue date Jul 26, 2022
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor assemblies and methods for manufacturing suc...
- Patent number 10,622,308
- Issue date Apr 14, 2020
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit devices with through-body conductive vi...
- Patent number 10,593,653
- Issue date Mar 17, 2020
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor dies with recesses, associated leadframes, and associ...
- Patent number 10,431,531
- Issue date Oct 1, 2019
- Micron Technology, Inc.
- Chua Swee Kwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic die packages with metal leads, including metal lead...
- Patent number 10,396,059
- Issue date Aug 27, 2019
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor dies with recesses, associated leadframes, and associ...
- Patent number 10,074,599
- Issue date Sep 11, 2018
- Micron Technology, Inc.
- Chua Swee Kwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic die packages with metal leads, including metal lead...
- Patent number 10,056,359
- Issue date Aug 21, 2018
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor assemblies and methods for manufacturing suc...
- Patent number 9,911,696
- Issue date Mar 6, 2018
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor dies with recesses, associated leadframes, and associ...
- Patent number 9,679,834
- Issue date Jun 13, 2017
- Micron Technology, Inc.
- Chua Swee Kwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic die packages with metal leads, including metal lead...
- Patent number 9,653,444
- Issue date May 16, 2017
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic components
- Patent number 9,418,872
- Issue date Aug 16, 2016
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic die packages with metal leads, including metal lead...
- Patent number 9,165,910
- Issue date Oct 20, 2015
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit devices with through-body conductive vi...
- Patent number 9,099,571
- Issue date Aug 4, 2015
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic die packages with metal leads, including metal lead...
- Patent number 8,906,744
- Issue date Dec 9, 2014
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit devices with through-body conductive vi...
- Patent number 8,723,307
- Issue date May 13, 2014
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Super high-density module with integrated wafer level packages
- Patent number 8,698,295
- Issue date Apr 15, 2014
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging
- Patent number 8,564,106
- Issue date Oct 22, 2013
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging circuits
- Patent number 8,555,495
- Issue date Oct 15, 2013
- Micron Technology, Inc.
- Yong Poo Chia
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Microelectronic die packages with metal leads, including metal lead...
- Patent number 8,536,702
- Issue date Sep 17, 2013
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic die packages with leadframes, including leadframe-b...
- Patent number 8,525,320
- Issue date Sep 3, 2013
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects for packaged semiconductor devices and methods for ma...
- Patent number 8,445,330
- Issue date May 21, 2013
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies and methods of manufacturing such assembli...
- Patent number 8,362,594
- Issue date Jan 29, 2013
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Super high-density module with integrated wafer level packages
- Patent number 8,304,894
- Issue date Nov 6, 2012
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor assemblies and methods for manufacturing suc...
- Patent number 8,232,657
- Issue date Jul 31, 2012
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic die packages with metal leads, including metal lead...
- Patent number 8,198,720
- Issue date Jun 12, 2012
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging
- Patent number 8,106,488
- Issue date Jan 31, 2012
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging circuits
- Patent number 8,065,792
- Issue date Nov 29, 2011
- Micron Technology, Inc.
- Yong Poo Chia
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device assemblies and packages
- Patent number 8,063,493
- Issue date Nov 22, 2011
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...
- Publication number 20240421131
- Publication date Dec 19, 2024
- Lodestar Licensing Group LLC
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...
- Publication number 20230197690
- Publication date Jun 22, 2023
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...
- Publication number 20220285325
- Publication date Sep 8, 2022
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...
- Publication number 20220013460
- Publication date Jan 13, 2022
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...
- Publication number 20200279834
- Publication date Sep 3, 2020
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...
- Publication number 20200243444
- Publication date Jul 30, 2020
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIES WITH RECESSES, ASSOCIATED LEADFRAMES, AND ASSOCI...
- Publication number 20180350730
- Publication date Dec 6, 2018
- Micron Technology, Inc.
- Chua Swee Kwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...
- Publication number 20180323179
- Publication date Nov 8, 2018
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...
- Publication number 20180158778
- Publication date Jun 7, 2018
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIES WITH RECESSES, ASSOCIATED LEADFRAMES, AND ASSOCI...
- Publication number 20170278775
- Publication date Sep 28, 2017
- Micron Technology, Inc.
- Chua Swee Kwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...
- Publication number 20170207206
- Publication date Jul 20, 2017
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIES WITH RECESSES, ASSOCIATED LEADFRAMES, AND ASSOCI...
- Publication number 20160247749
- Publication date Aug 25, 2016
- Micron Technology, Inc.
- Chua Swee Kwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...
- Publication number 20160099237
- Publication date Apr 7, 2016
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...
- Publication number 20150325554
- Publication date Nov 12, 2015
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...
- Publication number 20150091166
- Publication date Apr 2, 2015
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...
- Publication number 20140242751
- Publication date Aug 28, 2014
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC COMPONENTS
- Publication number 20140141544
- Publication date May 22, 2014
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...
- Publication number 20140124960
- Publication date May 8, 2014
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...
- Publication number 20140015130
- Publication date Jan 16, 2014
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGING
- Publication number 20120119263
- Publication date May 17, 2012
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PACKAGING CIRCUITS
- Publication number 20120064697
- Publication date Mar 15, 2012
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGING
- Publication number 20110018143
- Publication date Jan 27, 2011
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PACKAGING CIRCUITS AND PACKAGED CIRCUITS
- Publication number 20100146780
- Publication date Jun 17, 2010
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES AND PACKAGES WITH EDGE CONTACTS AND...
- Publication number 20100072603
- Publication date Mar 25, 2010
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR ASSEMBLIES AND ASSOCIATED SYSTEMS AND METHODS
- Publication number 20090102002
- Publication date Apr 23, 2009
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...
- Publication number 20090014858
- Publication date Jan 15, 2009
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGING
- Publication number 20080211113
- Publication date Sep 4, 2008
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Super High Density Module with Integrated Wafer Level Packages
- Publication number 20070264751
- Publication date Nov 15, 2007
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Super high density module with integrated wafer level packages
- Publication number 20070152327
- Publication date Jul 5, 2007
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Super high density module with integrated wafer level packages
- Publication number 20070145558
- Publication date Jun 28, 2007
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS

Yong Poo Chia

Person

Patents Grantslast 30 patents

Packaged integrated circuit devices with through-body conductive vi...

Packaged integrated circuit devices with through-body conductive vi...

Packaged integrated circuit devices with through-body conductive vi...

Packaged semiconductor assemblies and methods for manufacturing suc...

Packaged integrated circuit devices with through-body conductive vi...

Semiconductor dies with recesses, associated leadframes, and associ...

Microelectronic die packages with metal leads, including metal lead...

Semiconductor dies with recesses, associated leadframes, and associ...

Microelectronic die packages with metal leads, including metal lead...

Packaged semiconductor assemblies and methods for manufacturing suc...

Semiconductor dies with recesses, associated leadframes, and associ...

Microelectronic die packages with metal leads, including metal lead...

Packaged microelectronic components

Microelectronic die packages with metal leads, including metal lead...

Packaged integrated circuit devices with through-body conductive vi...

Microelectronic die packages with metal leads, including metal lead...

Packaged integrated circuit devices with through-body conductive vi...

Super high-density module with integrated wafer level packages

Wafer level packaging

Method for packaging circuits

Microelectronic die packages with metal leads, including metal lead...

Microelectronic die packages with leadframes, including leadframe-b...

Interconnects for packaged semiconductor devices and methods for ma...

Semiconductor assemblies and methods of manufacturing such assembli...

Super high-density module with integrated wafer level packages

Packaged semiconductor assemblies and methods for manufacturing suc...

Microelectronic die packages with metal leads, including metal lead...

Wafer level packaging

Method for packaging circuits

Semiconductor device assemblies and packages

Patents Applicationslast 30 patents

PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...

PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...

PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

SEMICONDUCTOR DIES WITH RECESSES, ASSOCIATED LEADFRAMES, AND ASSOCI...

MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

SEMICONDUCTOR DIES WITH RECESSES, ASSOCIATED LEADFRAMES, AND ASSOCI...

MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...

SEMICONDUCTOR DIES WITH RECESSES, ASSOCIATED LEADFRAMES, AND ASSOCI...

MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...

PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...

MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...

PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...

PACKAGED MICROELECTRONIC COMPONENTS

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...

WAFER LEVEL PACKAGING

METHOD FOR PACKAGING CIRCUITS

WAFER LEVEL PACKAGING

METHOD FOR PACKAGING CIRCUITS AND PACKAGED CIRCUITS

SEMICONDUCTOR DEVICE ASSEMBLIES AND PACKAGES WITH EDGE CONTACTS AND...

PACKAGED SEMICONDUCTOR ASSEMBLIES AND ASSOCIATED SYSTEMS AND METHODS

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

WAFER LEVEL PACKAGING

Super High Density Module with Integrated Wafer Level Packages

Super high density module with integrated wafer level packages

Super high density module with integrated wafer level packages