Yong Rong Chang

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Acoustic transducer with high sensitivity
- Patent number 9,369,808
- Issue date Jun 14, 2016
- MERRY ELECTRONICS (SHENZHEN) CO., LTD.
- Jen-Yi Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-floor type MEMS microphone
- Patent number 9,319,772
- Issue date Apr 19, 2016
- Merry Electronics (Shenzhen) Co., Ltd.
- Jen-Yi Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS microphone package structure having an improved carrier and a...
- Patent number 9,193,581
- Issue date Nov 24, 2015
- Merry Electronics (Shenzhen) Co., Ltd.
- Chao-Sen Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS microphone package structure having non-planar substrate and m...
- Patent number 9,162,869
- Issue date Oct 20, 2015
- Merry Electronics (Shenzhen) Co., Ltd.
- Jen-Yi Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Dual-diaphragm acoustic transducer
- Patent number 9,036,838
- Issue date May 19, 2015
- Merry Electronics (Shenzhen) Co., Ltd.
- Jen-Yi Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensor having an RPO layer containing nitrogen
- Patent number 7,772,625
- Issue date Aug 10, 2010
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao Hsiang Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-tank etch method for oxide thickness control
- Patent number 7,405,165
- Issue date Jul 29, 2008
- Taiwan Semiconductor Manufacturing Co, Ltd.
- Yang Kai Fan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MEMS MICROPHONE PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE...
- Publication number 20180146302
- Publication date May 24, 2018
- MERRY ELECTRONICS (SHENZHEN) CO., LTD.
- Jen-Yi CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACOUSTIC TRANSDUCER
- Publication number 20170257708
- Publication date Sep 7, 2017
- Merry Electronics(Shenzhen) Co., Ltd.
- Jen-Yi Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MEMS MICROPHONE PACKAGE STRUCTURE HAVING A NON-PLANAR SUBSTRATE
- Publication number 20170064458
- Publication date Mar 2, 2017
- Jen-Yi Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MULTI-FLOOR TYPE MEMS MICROPHONE
- Publication number 20150373446
- Publication date Dec 24, 2015
- MERRY ELECTRONICS (SHENZHEN) CO., LTD.
- Jen-Yi CHEN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CHIP-STACKED MICROPHONE
- Publication number 20150304751
- Publication date Oct 22, 2015
- MERRY ELECTRONICS (SHENZHEN) CO., LTD.
- Jen-Yi CHEN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ACOUSTIC TRANSDUCER WITH HIGH SENSITIVITY
- Publication number 20150110302
- Publication date Apr 23, 2015
- MERRY ELECTRONICS (SHENZHEN) CO., LTD.
- Jen-Yi CHEN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ACOUSTIC TRANSDUCER WITH MEMBRANE SUPPORTING STRUCTURE
- Publication number 20150109889
- Publication date Apr 23, 2015
- MERRY ELECTRONICS (SHENZHEN) CO., LTD.
- Jen-Yi CHEN
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Application
DUAL-DIAPHRAGM ACOUSTIC TRANSDUCER
- Publication number 20150016656
- Publication date Jan 15, 2015
- MERRY ELECTRONICS (SHENZHEN) CO., LTD.
- Jen-Yi CHEN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMAGE SENSORS AND METHODS OF FABRICATING IMAGE SENSORS
- Publication number 20080083938
- Publication date Apr 10, 2008
- Taiwan Semiconductor Manufacturing Co., LTD
- Yao Hsiang Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual-tank etch method for oxide thickness control
- Publication number 20060099818
- Publication date May 11, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yang Kai Fan
- H01 - BASIC ELECTRIC ELEMENTS

Yong Rong Chang

Person

Patents Grantslast 30 patents

Acoustic transducer with high sensitivity

Multi-floor type MEMS microphone

MEMS microphone package structure having an improved carrier and a...

MEMS microphone package structure having non-planar substrate and m...

Dual-diaphragm acoustic transducer

Image sensor having an RPO layer containing nitrogen

Dual-tank etch method for oxide thickness control

Patents Applicationslast 30 patents

MEMS MICROPHONE PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE...

ACOUSTIC TRANSDUCER

MEMS MICROPHONE PACKAGE STRUCTURE HAVING A NON-PLANAR SUBSTRATE

MULTI-FLOOR TYPE MEMS MICROPHONE

CHIP-STACKED MICROPHONE

ACOUSTIC TRANSDUCER WITH HIGH SENSITIVITY

ACOUSTIC TRANSDUCER WITH MEMBRANE SUPPORTING STRUCTURE

DUAL-DIAPHRAGM ACOUSTIC TRANSDUCER

IMAGE SENSORS AND METHODS OF FABRICATING IMAGE SENSORS

Dual-tank etch method for oxide thickness control