Yong Wu

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Liner for V-NAND word line stack
- Patent number 12,328,872
- Issue date Jun 10, 2025
- Applied Materials, Inc.
- Jacqueline S. Wrench
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of tuning film properties of metal nitride using plasma
- Patent number 11,646,226
- Issue date May 9, 2023
- Applied Materials, Inc.
- Wenyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene diffusion barrier
- Patent number 11,621,226
- Issue date Apr 4, 2023
- Applied Materials, Inc.
- Yong Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner for V-NAND word line stack
- Patent number 11,476,267
- Issue date Oct 18, 2022
- Applied Materials, Inc.
- Jacqueline S. Wrench
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nucleation-free gap fill ALD process
- Patent number 11,289,374
- Issue date Mar 29, 2022
- Applied Materials, Inc.
- Yihong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal doped amorphous silicon as nucleation layer for metal dep...
- Patent number 11,244,824
- Issue date Feb 8, 2022
- Applied Materials, Inc.
- Rui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective atomic layer deposition of ruthenium
- Patent number 11,066,743
- Issue date Jul 20, 2021
- Applied Materials, Inc.
- Yihong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ tungsten deposition without barrier layer
- Patent number 10,991,586
- Issue date Apr 27, 2021
- Applied Materials, Inc.
- Yong Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Linerless continuous amorphous metal films
- Patent number 10,930,493
- Issue date Feb 23, 2021
- Applied Materials, Inc.
- Susmit Singha Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene diffusion barrier
- Patent number 10,916,505
- Issue date Feb 9, 2021
- Applied Materials, Inc.
- Yong Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal deposition methods
- Patent number 10,851,454
- Issue date Dec 1, 2020
- Applied Materials, Inc.
- Yong Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tungsten deposition without barrier layer
- Patent number 10,854,461
- Issue date Dec 1, 2020
- Applied Materials, Inc.
- Yihong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of lowering wordline resistance
- Patent number 10,854,511
- Issue date Dec 1, 2020
- Applied Materials, Inc.
- Yihong Chen
- G11 - INFORMATION STORAGE
Information Patent Grant
Selective deposition for simplified process flow of pillar formation
- Patent number 10,636,659
- Issue date Apr 28, 2020
- Applied Materials, Inc.
- Yihong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seam healing using high pressure anneal
- Patent number 10,636,669
- Issue date Apr 28, 2020
- Applied Materials, Inc.
- Yihong Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Seamless tungsten fill by tungsten oxidation-reduction
- Patent number 10,559,497
- Issue date Feb 11, 2020
- Applied Materials, Inc.
- Yong Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal deposition methods
- Patent number 10,480,066
- Issue date Nov 19, 2019
- Applied Materials, Inc.
- Yong Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tungsten deposition without barrier layer
- Patent number 10,468,263
- Issue date Nov 5, 2019
- Applied Materials, Inc.
- Yihong Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF TUNING FILM PROPERTIES OF METAL NITRIDE USING PLASMA
- Publication number 20230245925
- Publication date Aug 3, 2023
- Applied Materials, Inc.
- Wenyi LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINER FOR V-NAND WORD LINE STACK
- Publication number 20230005945
- Publication date Jan 5, 2023
- Applied Materials, Inc.
- Jacqueline S. Wrench
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Nucleation-Free Gap Fill ALD Process
- Publication number 20220172989
- Publication date Jun 2, 2022
- Applied Materials, Inc.
- Yihong Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF TUNING FILM PROPERTIES OF METAL NITRIDE USING PLASMA
- Publication number 20210351071
- Publication date Nov 11, 2021
- Applied Materials, Inc.
- Wenyi LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Graphene Diffusion Barrier
- Publication number 20210167021
- Publication date Jun 3, 2021
- Applied Materials, Inc.
- Yong Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LINER FOR V-NAND WORD LINE STACK
- Publication number 20200373318
- Publication date Nov 26, 2020
- Applied Materials, Inc.
- Jacqueline S. Wrench
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conformal Doped Amorphous Silicon As Nucleation Layer For Metal Dep...
- Publication number 20200335334
- Publication date Oct 22, 2020
- Rui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU TUNGSTEN DEPOSITION WITHOUT BARRIER LAYER
- Publication number 20200243341
- Publication date Jul 30, 2020
- Applied Materials, Inc.
- Yong Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINERLESS CONTINUOUS AMORPHOUS METAL FILMS
- Publication number 20200135456
- Publication date Apr 30, 2020
- Applied Materials, Inc.
- Susmit Singha ROY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Graphene Diffusion Barrier
- Publication number 20200051920
- Publication date Feb 13, 2020
- Applied Materials, Inc.
- Yong Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METAL DEPOSITION METHODS
- Publication number 20200040448
- Publication date Feb 6, 2020
- Applied Materials, Inc.
- Yong Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Tungsten Deposition Without Barrier Layer
- Publication number 20200027738
- Publication date Jan 23, 2020
- Applied Materials, Inc.
- Yihong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nucleation-Free Gap Fill ALD Process
- Publication number 20190371662
- Publication date Dec 5, 2019
- Applied Materials, Inc.
- Yihong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Deposition Methods
- Publication number 20190271071
- Publication date Sep 5, 2019
- Applied Materials, Inc.
- Yong Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEAM HEALING USING HIGH PRESSURE ANNEAL
- Publication number 20190228982
- Publication date Jul 25, 2019
- Applied Materials, Inc.
- Yihong Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Selective Atomic Layer Deposition Of Ruthenium
- Publication number 20190185993
- Publication date Jun 20, 2019
- Applied Materials, Inc.
- Yihong Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Seamless Tungsten Fill By Tungsten Oxidation-Reduction
- Publication number 20180358264
- Publication date Dec 13, 2018
- Applied Materials, Inc.
- Yong Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods Of Lowering Wordline Resistance
- Publication number 20180350606
- Publication date Dec 6, 2018
- Applied Materials, Inc.
- Yihong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Deposition Of Tungsten For Simplified Process Flow Of Tun...
- Publication number 20180308694
- Publication date Oct 25, 2018
- Applied Materials, Inc.
- Yihong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tungsten Deposition Without Barrier Layer
- Publication number 20180247821
- Publication date Aug 30, 2018
- Applied Materials, Inc.
- Yihong Chen
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Liner for V-NAND word line stack

Method of tuning film properties of metal nitride using plasma

Graphene diffusion barrier

Liner for V-NAND word line stack

Nucleation-free gap fill ALD process

Conformal doped amorphous silicon as nucleation layer for metal dep...

Selective atomic layer deposition of ruthenium

In-situ tungsten deposition without barrier layer

Linerless continuous amorphous metal films

Graphene diffusion barrier

Metal deposition methods

Tungsten deposition without barrier layer

Methods of lowering wordline resistance

Selective deposition for simplified process flow of pillar formation

Seam healing using high pressure anneal

Seamless tungsten fill by tungsten oxidation-reduction

Metal deposition methods

Tungsten deposition without barrier layer

Patents Applicationslast 30 patents

METHOD OF TUNING FILM PROPERTIES OF METAL NITRIDE USING PLASMA

LINER FOR V-NAND WORD LINE STACK

Nucleation-Free Gap Fill ALD Process

METHOD OF TUNING FILM PROPERTIES OF METAL NITRIDE USING PLASMA

Graphene Diffusion Barrier

LINER FOR V-NAND WORD LINE STACK

Conformal Doped Amorphous Silicon As Nucleation Layer For Metal Dep...

IN-SITU TUNGSTEN DEPOSITION WITHOUT BARRIER LAYER

LINERLESS CONTINUOUS AMORPHOUS METAL FILMS

Graphene Diffusion Barrier

METAL DEPOSITION METHODS

Tungsten Deposition Without Barrier Layer

Nucleation-Free Gap Fill ALD Process

Metal Deposition Methods

SEAM HEALING USING HIGH PRESSURE ANNEAL

Selective Atomic Layer Deposition Of Ruthenium

Seamless Tungsten Fill By Tungsten Oxidation-Reduction

Methods Of Lowering Wordline Resistance

Selective Deposition Of Tungsten For Simplified Process Flow Of Tun...

Tungsten Deposition Without Barrier Layer