Yonghyuk Jeong

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Incheon, KR

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Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR ATTACHING A HEAT SPREADER TO A SEMICONDUCTOR PACKAGE AND...
- Publication number 20250125158
- Publication date Apr 17, 2025
- STATS ChipPAC Pte Ltd.
- YongHyuk JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACAKGE AND METHOD FOR FORMING THE SAME
- Publication number 20250054925
- Publication date Feb 13, 2025
- STATS ChipPAC Pte Ltd.
- YongHyuk JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Envelope Analysis for the Thermal Optimization of Multi-Chip...
- Publication number 20240037308
- Publication date Feb 1, 2024
- STATS ChipPAC Pte Ltd.
- Chien Ouyang
- G06 - COMPUTING CALCULATING COUNTING