Yongki Min

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods to pattern TFC and incorporation in the ODI architecture an...
- Patent number 11,581,271
- Issue date Feb 14, 2023
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate integrated inductor with composite magnetic resin layer
- Patent number 11,335,616
- Issue date May 17, 2022
- Intel Corporation
- Malavarayan Sankarasubramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic small footprint inductor array module for on-package volta...
- Patent number 10,741,536
- Issue date Aug 11, 2020
- Intel Corporation
- Yongki Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic small footprint inductor array module for on-package volta...
- Patent number 10,340,260
- Issue date Jul 2, 2019
- Intel Corporation
- Yongki Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component stiffener architectures for microelectronic package struc...
- Patent number 10,157,860
- Issue date Dec 18, 2018
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic small footprint inductor array module for on-package volta...
- Patent number 9,911,723
- Issue date Mar 6, 2018
- Intel Corporation
- Yongki Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sol-gel and mask patterning for thin-film capacitor fabrication, th...
- Patent number 8,623,737
- Issue date Jan 7, 2014
- Intel Corporation
- Huankiat Seh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Low temperature deposition and ultra fast annealing of integrated c...
- Patent number 8,618,593
- Issue date Dec 31, 2013
- Intel Corporation
- Islam A. Salama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedding thin film resistors in substrates in power delivery networks
- Patent number 8,228,680
- Issue date Jul 24, 2012
- Intel Corporation
- Myitzu Soe Myat
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method, apparatus, and system for low temperature deposition and ir...
- Patent number 8,143,697
- Issue date Mar 27, 2012
- Intel Corporation
- Huankiat Seh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low temperature deposition and ultra fast annealing of integrated c...
- Patent number 8,003,479
- Issue date Aug 23, 2011
- Intel Corporation
- Islam A. Salama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carbon nanotube coated capacitor electrodes
- Patent number 7,983,020
- Issue date Jul 19, 2011
- Intel Corporation
- Yongki Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods to laminate passives onto substrate
- Patent number 7,981,758
- Issue date Jul 19, 2011
- Intel Corporation
- Huankiat Seh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods to laminate passives onto substrate
- Patent number 7,838,419
- Issue date Nov 23, 2010
- Intel Corporation
- Huankiat Seh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic device including bridging interconnect to top condu...
- Patent number 7,738,257
- Issue date Jun 15, 2010
- Intel Corporation
- Islam Salama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Passive device structure
- Patent number 7,733,626
- Issue date Jun 8, 2010
- Intel Corporation
- Cengiz A. Palanduz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic package interconnect and method of fabrication thereof
- Patent number 7,727,814
- Issue date Jun 1, 2010
- Intel Corporation
- Daewoong Suh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carbon nanotube coated capacitor electrodes
- Patent number 7,710,709
- Issue date May 4, 2010
- Intel Corporation
- Yongki Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bulk metallic glass solders, foamed bulk metallic glass solders, fo...
- Patent number 7,705,458
- Issue date Apr 27, 2010
- Intel Corporation
- Daewoong Suh
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Pre-patterned thin film capacitor and method for embedding same in...
- Patent number 7,687,366
- Issue date Mar 30, 2010
- Intel Corporation
- Yongki Min
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated thin-film capacitor with etch-stop layer, process of mak...
- Patent number 7,588,992
- Issue date Sep 15, 2009
- Intel Corporation
- Yongki Min
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method, apparatus, and system for low temperature deposition and ir...
- Patent number 7,572,709
- Issue date Aug 11, 2009
- Intel Corporation
- Huankiat Seh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a microelectronic device including embedded t...
- Patent number 7,553,738
- Issue date Jun 30, 2009
- Intel Corporation
- Yongki Min
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated thin film capacitors with adhesion holes for the improve...
- Patent number 7,525,140
- Issue date Apr 28, 2009
- Intel Corporation
- Yongki Min
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of providing a pre-patterned high-k dielectric film
- Patent number 7,435,675
- Issue date Oct 14, 2008
- Intel Corporation
- Huankiat Seh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inkjet patterning for thin-film capacitor fabrication, thin-film ca...
- Patent number 7,416,938
- Issue date Aug 26, 2008
- Intel Corporation
- Huankiat Seh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic package interconnect and method of fabrication thereof
- Patent number 7,402,909
- Issue date Jul 22, 2008
- Intel Corporation
- Daewoong Suh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making a passive device structure
- Patent number 7,290,315
- Issue date Nov 6, 2007
- Intel Corporation
- Cengiz A. Palanduz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE INTEGRATED INDUCTOR
- Publication number 20210098326
- Publication date Apr 1, 2021
- Intel Corporation
- Malavarayan Sankarasubramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS TO PATTERN TFC AND INCORPORATION IN THE ODI ARCHITECTURE AN...
- Publication number 20200294938
- Publication date Sep 17, 2020
- Intel Corporation
- Rahul JAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC MOLD MATERIAL INDUCTORS FOR ELECTRONIC PACKAGES
- Publication number 20200203470
- Publication date Jun 25, 2020
- Intel Corporation
- Kedar Dhane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC CORE/SHELL PARTICLES FOR INDUCTOR ARRAYS
- Publication number 20200203067
- Publication date Jun 25, 2020
- Intel Corporation
- Malavarayan Sankarasubramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC SOLDER MASK ON PACKAGE SUBSTRATE ABOVE MAGNETIC INDUCTOR A...
- Publication number 20200013533
- Publication date Jan 9, 2020
- Intel Corporation
- Malavarayan SANKARASUBRAMANIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC ENCAPSULANT FOR PACKAGE MAGNETIC INDUCTORS
- Publication number 20200005983
- Publication date Jan 2, 2020
- Intel Corporation
- Malavarayan SANKARASUBRAMANIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC SMALL FOOTPRINT INDUCTOR ARRAY MODULE FOR ON-PACKAGE VOLTA...
- Publication number 20190279973
- Publication date Sep 12, 2019
- Intel Corporation
- Yongki Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC SMALL FOOTPRINT INDUCTOR ARRAY MODULE FOR ON-PACKAGE VOLTA...
- Publication number 20180197845
- Publication date Jul 12, 2018
- Intel Corporation
- Yongki Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT STIFFENER ARCHITECTURES FOR MICROELECTRONIC PACKAGE STRUC...
- Publication number 20180182718
- Publication date Jun 28, 2018
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC SMALL FOOTPRINT INDUCTOR ARRAY MODULE FOR ON-PACKAGE VOLTA...
- Publication number 20170179094
- Publication date Jun 22, 2017
- Yongki Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOL-GEL AND MASK PATTERNING FOR THIN-FILM CAPACITOR FABRICATION, TH...
- Publication number 20140111924
- Publication date Apr 24, 2014
- Huankiat Seh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LOW TEMPERATURE DEPOSITION AND ULTRA FAST ANNEALING OF INTEGRATED C...
- Publication number 20110304018
- Publication date Dec 15, 2011
- Islam A. Salama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS TO LAMINATE PASSIVES ONTO SUBSTRATE
- Publication number 20110034002
- Publication date Feb 10, 2011
- Huankiat Seh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Carbon nanotube coated capacitor electrodes
- Publication number 20100177475
- Publication date Jul 15, 2010
- Yongki Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedding Thin Film Resistors in Substrates in Power Delivery Networks
- Publication number 20100134992
- Publication date Jun 3, 2010
- Myitzu Soe Myat
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD, APPARATUS, AND SYSTEM FOR LOW TEMPERATURE DEPOSITION AND IR...
- Publication number 20090273057
- Publication date Nov 5, 2009
- Huankiat Seh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Microelectronic package interconnect and method of fabrication thereof
- Publication number 20090068830
- Publication date Mar 12, 2009
- Intel Corporation
- Daewoong Suh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARBON NANOTUBE COATED CAPACITOR ELECTRODES
- Publication number 20080239620
- Publication date Oct 2, 2008
- Yongki Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and methods to laminate passives onto substrate
- Publication number 20080148560
- Publication date Jun 26, 2008
- Huankiat Seh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
POLYMER-BASED INTEGRATED THIN FILM CAPACITORS, PACKAGES CONTAINING...
- Publication number 20080145622
- Publication date Jun 19, 2008
- Mihir K. Roy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTRONIC DEVICE INCLUDING BRIDGING INTERCONNECT TO TOP CONDU...
- Publication number 20080142253
- Publication date Jun 19, 2008
- Islam Salama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FABRICATING A MICROELECTRONIC DEVICE INCLUDLING EMBEDDED...
- Publication number 20080137263
- Publication date Jun 12, 2008
- Yongki Min
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of providing a pre-patterned high-k dielectric film
- Publication number 20080003764
- Publication date Jan 3, 2008
- Huankiat Seh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD, APPARATUS, AND SYSTEM FOR LOW TEMPERATURE DEPOSITION AND IR...
- Publication number 20080003765
- Publication date Jan 3, 2008
- Huankiat Seh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BULK METALLIC GLASS SOLDERS, FOAMED BULK METALLIC GLASS SOLDERS, FO...
- Publication number 20070290339
- Publication date Dec 20, 2007
- Daewoong Suh
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Passive device structure
- Publication number 20070271752
- Publication date Nov 29, 2007
- Cengiz A. Palanduz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Inkjet patterning for thin-film capacitor fabrication, thin-film ca...
- Publication number 20070242414
- Publication date Oct 18, 2007
- Huankiat Seh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROOM TEMPERATURE JOINING PROCESS WITH PIEZOELECTRIC CERAMIC-ACTIVAT...
- Publication number 20070235500
- Publication date Oct 11, 2007
- Daewoong Suh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Sol-gel and mask patterning for thin-film capacitor fabrication, th...
- Publication number 20070228517
- Publication date Oct 4, 2007
- Huankiat Seh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LOW TEMPERATURE DEPOSITION AND ULTRA FAST ANNEALING OF INTEGRATED C...
- Publication number 20070222030
- Publication date Sep 27, 2007
- Islam A. Salama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Methods to pattern TFC and incorporation in the ODI architecture an...

Substrate integrated inductor with composite magnetic resin layer

Magnetic small footprint inductor array module for on-package volta...

Magnetic small footprint inductor array module for on-package volta...

Component stiffener architectures for microelectronic package struc...

Magnetic small footprint inductor array module for on-package volta...

Sol-gel and mask patterning for thin-film capacitor fabrication, th...

Low temperature deposition and ultra fast annealing of integrated c...

Embedding thin film resistors in substrates in power delivery networks

Method, apparatus, and system for low temperature deposition and ir...

Low temperature deposition and ultra fast annealing of integrated c...

Carbon nanotube coated capacitor electrodes

Systems and methods to laminate passives onto substrate

Systems and methods to laminate passives onto substrate

Microelectronic device including bridging interconnect to top condu...

Passive device structure

Microelectronic package interconnect and method of fabrication thereof

Carbon nanotube coated capacitor electrodes

Bulk metallic glass solders, foamed bulk metallic glass solders, fo...

Pre-patterned thin film capacitor and method for embedding same in...

Integrated thin-film capacitor with etch-stop layer, process of mak...

Method, apparatus, and system for low temperature deposition and ir...

Method of fabricating a microelectronic device including embedded t...

Integrated thin film capacitors with adhesion holes for the improve...

Method of providing a pre-patterned high-k dielectric film

Inkjet patterning for thin-film capacitor fabrication, thin-film ca...

Microelectronic package interconnect and method of fabrication thereof

Method for making a passive device structure

Patents Applicationslast 30 patents

SUBSTRATE INTEGRATED INDUCTOR

METHODS TO PATTERN TFC AND INCORPORATION IN THE ODI ARCHITECTURE AN...

MAGNETIC MOLD MATERIAL INDUCTORS FOR ELECTRONIC PACKAGES

MAGNETIC CORE/SHELL PARTICLES FOR INDUCTOR ARRAYS

MAGNETIC SOLDER MASK ON PACKAGE SUBSTRATE ABOVE MAGNETIC INDUCTOR A...

MAGNETIC ENCAPSULANT FOR PACKAGE MAGNETIC INDUCTORS

MAGNETIC SMALL FOOTPRINT INDUCTOR ARRAY MODULE FOR ON-PACKAGE VOLTA...

MAGNETIC SMALL FOOTPRINT INDUCTOR ARRAY MODULE FOR ON-PACKAGE VOLTA...

COMPONENT STIFFENER ARCHITECTURES FOR MICROELECTRONIC PACKAGE STRUC...

MAGNETIC SMALL FOOTPRINT INDUCTOR ARRAY MODULE FOR ON-PACKAGE VOLTA...

SOL-GEL AND MASK PATTERNING FOR THIN-FILM CAPACITOR FABRICATION, TH...

LOW TEMPERATURE DEPOSITION AND ULTRA FAST ANNEALING OF INTEGRATED C...

SYSTEMS AND METHODS TO LAMINATE PASSIVES ONTO SUBSTRATE

Carbon nanotube coated capacitor electrodes

Embedding Thin Film Resistors in Substrates in Power Delivery Networks

METHOD, APPARATUS, AND SYSTEM FOR LOW TEMPERATURE DEPOSITION AND IR...

Microelectronic package interconnect and method of fabrication thereof

CARBON NANOTUBE COATED CAPACITOR ELECTRODES

System and methods to laminate passives onto substrate

POLYMER-BASED INTEGRATED THIN FILM CAPACITORS, PACKAGES CONTAINING...

MICROELECTRONIC DEVICE INCLUDING BRIDGING INTERCONNECT TO TOP CONDU...

METHOD OF FABRICATING A MICROELECTRONIC DEVICE INCLUDLING EMBEDDED...

Method of providing a pre-patterned high-k dielectric film

METHOD, APPARATUS, AND SYSTEM FOR LOW TEMPERATURE DEPOSITION AND IR...

BULK METALLIC GLASS SOLDERS, FOAMED BULK METALLIC GLASS SOLDERS, FO...

Passive device structure

Inkjet patterning for thin-film capacitor fabrication, thin-film ca...

ROOM TEMPERATURE JOINING PROCESS WITH PIEZOELECTRIC CERAMIC-ACTIVAT...

Sol-gel and mask patterning for thin-film capacitor fabrication, th...

LOW TEMPERATURE DEPOSITION AND ULTRA FAST ANNEALING OF INTEGRATED C...