Yongkoon LEE

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including antenna
- Patent number 12,183,694
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Yongkoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including antenna
- Patent number 12,154,873
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Yongkoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including heat spreader layer
- Patent number 12,040,248
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Jingu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 12,040,299
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Sangkyu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,935,847
- Issue date Mar 19, 2024
- Samsung Electronics Co., Ltd.
- Myungsam Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with an antenna substrate
- Patent number 11,935,849
- Issue date Mar 19, 2024
- Samsung Electronics Co., Ltd.
- Myungsam Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 11,735,553
- Issue date Aug 22, 2023
- Samsung Electronics Co., Ltd.
- Sangkyu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including antenna
- Patent number 11,637,079
- Issue date Apr 25, 2023
- Samsung Electronics Co., Ltd.
- Yongkoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and method of manufacturing semiconductor pa...
- Patent number 11,569,563
- Issue date Jan 31, 2023
- Samsung Electronics Co., Ltd.
- Yongkoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including heat spreader layer
- Patent number 11,562,939
- Issue date Jan 24, 2023
- Samsung Electronics Co., Ltd.
- Jingu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with an antenna substrate
- Patent number 11,527,495
- Issue date Dec 13, 2022
- Samsung Electronics Co., Ltd.
- Myungsam Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,329,014
- Issue date May 10, 2022
- Samsung Electronics Co., Ltd.
- Myungsam Kang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240421034
- Publication date Dec 19, 2024
- Samsung Electronics Co., LTD
- Byungho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER LAYER
- Publication number 20240347409
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Jingu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME
- Publication number 20240222280
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- MyungDo CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20240063070
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Youngchan Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240055338
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Byungho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240021531
- Publication date Jan 18, 2024
- Samsung Electronics Co., Ltd.
- Yongkoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240014197
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- Yongkoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20230352432
- Publication date Nov 2, 2023
- Samsung Electronics Co., Ltd.
- Sangkyu LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING ANTENNA
- Publication number 20230230943
- Publication date Jul 20, 2023
- Yongkoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER LAYER
- Publication number 20230163038
- Publication date May 25, 2023
- Samsung Electronics Co., Ltd.
- Jingu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230148143
- Publication date May 11, 2023
- Samsung Electronics Co., Ltd.
- Yongkoon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with an antenna substrate
- Publication number 20230096506
- Publication date Mar 30, 2023
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230016061
- Publication date Jan 19, 2023
- Samsung Electronics Co., Ltd.
- Yongkoon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220262748
- Publication date Aug 18, 2022
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER LAYER
- Publication number 20220102236
- Publication date Mar 31, 2022
- Samsung Electronics Co., Ltd.
- Jingu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20220102309
- Publication date Mar 31, 2022
- Samsung Electronics Co., Ltd.
- Sangkyu LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING ANTENNA
- Publication number 20220051996
- Publication date Feb 17, 2022
- Samsung Electronics Co., Ltd.
- Yongkoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURING SEMICONDUCTOR PA...
- Publication number 20220006173
- Publication date Jan 6, 2022
- Samsung Electronics Co., Ltd.
- Yongkoon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210398923
- Publication date Dec 23, 2021
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200312797
- Publication date Oct 1, 2020
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS

Yongkoon LEE

Person

Patents Grantslast 30 patents

Semiconductor package including antenna

Semiconductor package including antenna

Semiconductor package including heat spreader layer

Semiconductor package and method of manufacturing the semiconductor...

Semiconductor package

Semiconductor package with an antenna substrate

Semiconductor package and method of manufacturing the semiconductor...

Semiconductor package including antenna

Semiconductor packages and method of manufacturing semiconductor pa...

Semiconductor package including heat spreader layer

Semiconductor package with an antenna substrate

Semiconductor package

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER LAYER

SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE INCLUDING ANTENNA

SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER LAYER

SEMICONDUCTOR PACKAGE

Semiconductor package with an antenna substrate

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER LAYER

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE INCLUDING ANTENNA

SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURING SEMICONDUCTOR PA...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE