Yongkwan LEE

Person

Hwaseong-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,132,007
- Issue date Oct 29, 2024
- Samsung Electronics Co., Ltd.
- Jongwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and semiconductor package including the same
- Patent number 12,087,650
- Issue date Sep 10, 2024
- Samsung Electronics Co., Ltd.
- Junyoung Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including plurality of recesses and molding m...
- Patent number 12,057,357
- Issue date Aug 6, 2024
- Samsung Electronics Co, Ltd.
- Kyong Hwan Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposers and semiconductor packages including the same
- Patent number 11,742,294
- Issue date Aug 29, 2023
- Samsung Electronics Co., Ltd.
- Jongho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,742,329
- Issue date Aug 29, 2023
- Samsung Electronics Co., Ltd.
- Jongho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for conducting plasma surface treatment, board treatment...
- Patent number 11,728,142
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Junyoung Oh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Interposer and semiconductor package including the same
- Patent number 11,710,673
- Issue date Jul 25, 2023
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and semiconductor package including the same
- Patent number 11,688,656
- Issue date Jun 27, 2023
- Samsung Electronics Co., Ltd.
- Junyoung Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,581,266
- Issue date Feb 14, 2023
- Samsung Electronics Co., Ltd.
- Jongwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,538,801
- Issue date Dec 27, 2022
- Samsung Electronics Co., Ltd.
- Jongho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor package and package-on-package
- Patent number 11,508,713
- Issue date Nov 22, 2022
- Samsung Electronics Co., Ltd.
- Junyoung Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for discharging heat generated by semiconduct...
- Patent number 11,469,156
- Issue date Oct 11, 2022
- Samsung Electronics Co., Ltd.
- Hyunki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,101,243
- Issue date Aug 24, 2021
- Samsung Electronics Co., Ltd.
- Jongho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for discharging heat generated by semiconduct...
- Patent number 10,978,374
- Issue date Apr 13, 2021
- Samsung Electronics Co., Ltd.
- Hyunki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module adapted to be inserted into connector of exter...
- Patent number 10,008,488
- Issue date Jun 26, 2018
- Samsung Electronics Co., Inc.
- Yongkwan Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240347401
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- KYONG HWAN KOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240128190
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Seunghwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PROTECTION DEVICE
- Publication number 20240096748
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Taejun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND A METHOD OF FABRICATING THE SAME
- Publication number 20240079342
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Taejun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230411259
- Publication date Dec 21, 2023
- Samsung Electronics Co., Ltd.
- Sunchul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230395482
- Publication date Dec 7, 2023
- Samsung Electronics Co., Ltd.
- Jungjoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE HAVING THE SAME
- Publication number 20230378094
- Publication date Nov 23, 2023
- Samsung Electronics Co., Ltd.
- Junwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR CONDUCTING PLASMA SURFACE TREATMENT, BOARD TREATMENT...
- Publication number 20230343560
- Publication date Oct 26, 2023
- New Power Plasma Co., Ltd.
- Junyoung Oh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230282533
- Publication date Sep 7, 2023
- Samsung Electronics Co., Ltd.
- Junyoung Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING FIXING MEMBERS
- Publication number 20230260926
- Publication date Aug 17, 2023
- Samsung Electronics Co., Ltd.
- Yongkwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230170310
- Publication date Jun 1, 2023
- Samsung Electronics Co., Ltd.
- JONGWAN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PRODUCT FOR SEMICONDUCTOR STRIP AND METHOD OF MANUFACTURING...
- Publication number 20230127641
- Publication date Apr 27, 2023
- Samsung Electronics Co., Ltd.
- Seunghwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230131730
- Publication date Apr 27, 2023
- Samsung Electronics Co., Ltd.
- Junwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING ELECTROMAGNETIC SHIELD STRUCTURE
- Publication number 20230114892
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- JONGWAN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230082412
- Publication date Mar 16, 2023
- Samsung Electronics Co., Ltd.
- Yongkwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220415778
- Publication date Dec 29, 2022
- Samsung Electronics Co., Ltd.
- JUNWOO PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING PACKAGE SUBSTRATE
- Publication number 20220367416
- Publication date Nov 17, 2022
- Samsung Electronics Co., Ltd.
- Yongkwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20220189835
- Publication date Jun 16, 2022
- Samsung Electronics Co., Ltd.
- Choongbin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSERS AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME
- Publication number 20220093519
- Publication date Mar 24, 2022
- Samsung Electronics Co., Ltd.
- Jongho PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220068904
- Publication date Mar 3, 2022
- Samsung Electronics Co., Ltd.
- Jongho PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220068835
- Publication date Mar 3, 2022
- Samsung Electronics Co., Ltd.
- JONGWAN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220051957
- Publication date Feb 17, 2022
- Samsung Electronics Co., Ltd.
- KYONG HWAN KOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210375831
- Publication date Dec 2, 2021
- Samsung Electronics Co., Ltd.
- Jongho PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20210320042
- Publication date Oct 14, 2021
- Samsung Electronics Co., Ltd.
- Junyoung Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE
- Publication number 20210242190
- Publication date Aug 5, 2021
- Samsung Electronics Co., Ltd.
- Junyoung Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FOR DISCHARGING HEAT GENERATED BY SEMICONDUCT...
- Publication number 20210202352
- Publication date Jul 1, 2021
- Samsung Electronics Co., Ltd.
- Hyunki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR CONDUCTING PLASMA SURFACE TREATMENT, BOARD TREATMENT...
- Publication number 20210066046
- Publication date Mar 4, 2021
- New Power Plasma Co., Ltd.
- Junyoung Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200350288
- Publication date Nov 5, 2020
- Samsung Electronics Co., Ltd.
- Jongho PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200027818
- Publication date Jan 23, 2020
- Samsung Electronics Co., Ltd.
- Hyunki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE SUBSTRATE AND SEMICONDUCTOR MODULE
- Publication number 20170309606
- Publication date Oct 26, 2017
- Samsung Electronics Co., Ltd.
- Yongkwan LEE
- H01 - BASIC ELECTRIC ELEMENTS

Yongkwan LEE

Person

Patents Grantslast 30 patents

Semiconductor package

Interposer and semiconductor package including the same

Semiconductor package including plurality of recesses and molding m...

Interposers and semiconductor packages including the same

Semiconductor package

Apparatus for conducting plasma surface treatment, board treatment...

Interposer and semiconductor package including the same

Interposer and semiconductor package including the same

Semiconductor package

Semiconductor package

Methods of manufacturing semiconductor package and package-on-package

Semiconductor package for discharging heat generated by semiconduct...

Semiconductor package

Semiconductor package for discharging heat generated by semiconduct...

Semiconductor module adapted to be inserted into connector of exter...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

CHIP PROTECTION DEVICE

SEMICONDUCTOR PACKAGE AND A METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE HAVING THE SAME

APPARATUS FOR CONDUCTING PLASMA SURFACE TREATMENT, BOARD TREATMENT...

INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGES HAVING FIXING MEMBERS

SEMICONDUCTOR PACKAGE

MOLDED PRODUCT FOR SEMICONDUCTOR STRIP AND METHOD OF MANUFACTURING...

PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING ELECTROMAGNETIC SHIELD STRUCTURE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE HAVING PACKAGE SUBSTRATE

INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

INTERPOSERS AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE

SEMICONDUCTOR PACKAGE FOR DISCHARGING HEAT GENERATED BY SEMICONDUCT...

APPARATUS FOR CONDUCTING PLASMA SURFACE TREATMENT, BOARD TREATMENT...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

MODULE SUBSTRATE AND SEMICONDUCTOR MODULE