Yorio Iwasaki

Person

Shimodate, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate for holding a chip of semi-conductor package, semi-conduc...
- Patent number 6,236,108
- Issue date May 22, 2001
- Hitachi Chemical Company, Ltd.
- Yoshiki Sota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for holding a chip of semi-conductor package, semi-conduc...
- Patent number 6,064,111
- Issue date May 16, 2000
- Hitachi Company, Ltd.
- Yoshiki Sota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Current protector
- Patent number 5,929,741
- Issue date Jul 27, 1999
- Hitachi Chemical Company, Ltd.
- Atsushi Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing multiple wire wiring board
- Patent number 5,584,121
- Issue date Dec 17, 1996
- Hitachi Chemical Company, Ltd.
- Shigeharu Arike
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Multiple wire adhesive on a multiple wire wiring board
- Patent number 5,486,655
- Issue date Jan 23, 1996
- Hitachi Chemical Co., Ltd.
- Shigeharu Arike
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive of epoxy resins, epoxy-modified polybutadiene and photoini...
- Patent number 5,403,869
- Issue date Apr 4, 1995
- Hitachi Chemical Company, Ltd.
- Shigeharu Arike
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for producing coaxial conductor interconnection wiring board
- Patent number 5,323,534
- Issue date Jun 28, 1994
- Hitachi, Ltd.
- Yorio Iwasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing printed wiring board
- Patent number 5,309,632
- Issue date May 10, 1994
- Hitachi Chemical Co., Ltd.
- Hiroshi Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coaxial conductor interconnection wiring board
- Patent number 5,233,133
- Issue date Aug 3, 1993
- Hitachi Chemical Company Ltd.
- Yorio Iwasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive composition for printed wiring boards with acrylonitrile-b...
- Patent number 5,053,280
- Issue date Oct 1, 1991
- Hitachi Chemical Co., Ltd.
- Shin Takanezawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High-density wired circuit board using insulated wires
- Patent number 4,791,238
- Issue date Dec 13, 1988
- Hitachi Chemical Company, Ltd.
- Masao Kanno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of improving adhesion between insulating substrates and meta...
- Patent number 4,216,246
- Issue date Aug 5, 1980
- Hitachi Chemical Company, Ltd.
- Yorio Iwasaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Yorio Iwasaki

Person

Patents Grantslast 30 patents

Substrate for holding a chip of semi-conductor package, semi-conduc...

Substrate for holding a chip of semi-conductor package, semi-conduc...

Current protector

Process for producing multiple wire wiring board

Multiple wire adhesive on a multiple wire wiring board

Adhesive of epoxy resins, epoxy-modified polybutadiene and photoini...

Process for producing coaxial conductor interconnection wiring board

Process for producing printed wiring board

Coaxial conductor interconnection wiring board

Adhesive composition for printed wiring boards with acrylonitrile-b...

High-density wired circuit board using insulated wires

Method of improving adhesion between insulating substrates and meta...