Yoshifumi Nakamura

Person

Neyagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring board, semiconductor device and method for manufacturing the...
- Patent number 8,283,775
- Issue date Oct 9, 2012
- Panasonic Corporation
- Nozomi Shimoishizaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for manufacturing the same, and semico...
- Patent number 7,851,904
- Issue date Dec 14, 2010
- Panasonic Corporation
- Yukihiro Kozaka
- G02 - OPTICS
Information Patent Grant
Wiring board and method for manufacturing the same, and semiconduct...
- Patent number 7,847,198
- Issue date Dec 7, 2010
- Panasonic Corporation
- Nozomi Shimoishizaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,642,646
- Issue date Jan 5, 2010
- Panasonic Corporation
- Yoshifumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, semiconductor device using the same, and method for m...
- Patent number 7,508,073
- Issue date Mar 24, 2009
- Panasonic Corporation
- Yoshifumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method for producing the same
- Patent number 7,442,074
- Issue date Oct 28, 2008
- Matsushita Electric Industrial Co., Ltd.
- Nozomi Shimoishizaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with auxiliary wiring configuration to suppress break...
- Patent number 7,439,611
- Issue date Oct 21, 2008
- Matsushita Electric Industrial Co., Ltd.
- Hiroyuki Imamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating a chip-scale-packaging (CSP) having an inductor
- Patent number 7,279,357
- Issue date Oct 9, 2007
- Matsushita Electric Industrial Co., Ltd.
- Nozomi Shimoishizaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, semiconductor device and display module
- Patent number 7,250,575
- Issue date Jul 31, 2007
- Matsushita Electric Industrial Co., Ltd.
- Kouichi Nagao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device including a diffusion layer
- Patent number 6,954,001
- Issue date Oct 11, 2005
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for the fabrication thereof
- Patent number 6,924,173
- Issue date Aug 2, 2005
- Matsushita Electric Industrial Co., Ltd.
- Kazumi Watase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an inductor formed on a region of an in...
- Patent number 6,914,331
- Issue date Jul 5, 2005
- Matsushita Electric Industrial Co., Ltd.
- Nozomi Shimoishizaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 6,812,573
- Issue date Nov 2, 2004
- Matsushita Electric Industrial Co., Ltd.
- Nozomi Shimoishizaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a diffusion layer formed between ele...
- Patent number 6,784,557
- Issue date Aug 31, 2004
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a printed-circuit board having projection elec...
- Patent number 6,694,613
- Issue date Feb 24, 2004
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for the fabrication thereof
- Patent number 6,559,528
- Issue date May 6, 2003
- Matsushita Electric Industrial Co., Ltd.
- Kazumi Watase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic device with resin layer between...
- Patent number 6,372,547
- Issue date Apr 16, 2002
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier and method of manufacturing and mounting the same
- Patent number 6,365,499
- Issue date Apr 2, 2002
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 6,313,532
- Issue date Nov 6, 2001
- Matsushita Electric Industrial Co., Ltd.
- Nozomi Shimoishizaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed-circuit board having projection electrodes and method for p...
- Patent number 6,300,576
- Issue date Oct 9, 2001
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier
- Patent number 6,229,209
- Issue date May 8, 2001
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating bump electrodes with a leveling step for uni...
- Patent number 6,207,550
- Issue date Mar 27, 2001
- Matsushita Electric Industrial Co., Ltd.
- Nobuhiro Hase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of checking electric circuits of semiconductor device and co...
- Patent number 5,940,679
- Issue date Aug 17, 1999
- Matsushita Electric Industrial Co., Ltd.
- Yoshihiro Tomura
- G01 - MEASURING TESTING
Information Patent Grant
Method of making multi-layered ceramic substrates
- Patent number 5,662,755
- Issue date Sep 2, 1997
- Matsushita Electric Industrial Co., Ltd.
- Kazuhiro Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a ceramic substrate
- Patent number 5,547,530
- Issue date Aug 20, 1996
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic substrate and manufacturing method thereof
- Patent number 5,525,402
- Issue date Jun 11, 1996
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive ink
- Patent number 5,407,473
- Issue date Apr 18, 1995
- Matsushita Electric Industrial Co., Ltd.
- Kazuhiro Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing multilayered ceramic substrate
- Patent number 5,370,759
- Issue date Dec 6, 1994
- Matsushita Electric Industrial Co., Ltd.
- Yasuhiko Hakotani
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE...
- Publication number 20110163436
- Publication date Jul 7, 2011
- PANASONIC CORPORATION
- Nozomi SHIMOISHIZAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090091021
- Publication date Apr 9, 2009
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board, and semiconductor device
- Publication number 20090020318
- Publication date Jan 22, 2009
- Matsushita Electric Industrial Co., Ltd.
- Hiroyuki IMAMURA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
TAPE CARRIER SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20090020858
- Publication date Jan 22, 2009
- Matsushita Electric Industrial Co., Ltd.
- Yukihiro Kozaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20080136025
- Publication date Jun 12, 2008
- Matsushita Elec. Indus.Co., Ltd.
- Yoshifumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, AND SEMICO...
- Publication number 20080136017
- Publication date Jun 12, 2008
- Matsushita Electric Industrial Co., Ltd.
- Yukihiro KOZAKA
- G02 - OPTICS
Information Patent Application
WIRING BOARD METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR D...
- Publication number 20070284738
- Publication date Dec 13, 2007
- Matsushita Electric Industrial Co., Ltd.
- Nozomi SHIMOISHIZAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE USING THE SAME, AND METHOD FOR M...
- Publication number 20070241462
- Publication date Oct 18, 2007
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR PRODUCING THE SAME
- Publication number 20070119614
- Publication date May 31, 2007
- Matsushita Electric Industrial Co., Ltd.
- Nozomi SHIMOISHIZAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE
- Publication number 20070075439
- Publication date Apr 5, 2007
- Matsushita Electric Industrial Co., Ltd.
- Hiroyuki IMAMURA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Wiring board and semiconductor device
- Publication number 20060267219
- Publication date Nov 30, 2006
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring board, semiconductor device and display module
- Publication number 20060268530
- Publication date Nov 30, 2006
- Matsushita Electric Industrial Co., Ltd.
- Kouichi Nagao
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor device
- Publication number 20050263885
- Publication date Dec 1, 2005
- Matsushita Elec. Indus.Co., Ltd.
- Yoshifumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20050199979
- Publication date Sep 15, 2005
- Matsushita Electric Industrial Co., Ltd.
- Nozomi Shimoishizaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20050173798
- Publication date Aug 11, 2005
- Matsushita Elec. Ind. Co. Ltd.
- Yoshifumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20050012214
- Publication date Jan 20, 2005
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20050006749
- Publication date Jan 13, 2005
- Matsushita Electric Industrial Co., Ltd.
- Nozomi Shimoishizaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20030218247
- Publication date Nov 27, 2003
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Nozomi Shimoishizaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for the fabrication thereof
- Publication number 20030194834
- Publication date Oct 16, 2003
- Matsushita Electric Industrial Co., Ltd.
- Kazumi Watase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20030116867
- Publication date Jun 26, 2003
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP CARRIER AND METHOD OF MANUFACTURING AND MOUNTING THE SAME
- Publication number 20020003299
- Publication date Jan 10, 2002
- YOSHIFUMI NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20020000655
- Publication date Jan 3, 2002
- Nozomi Shimoishizaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20010033021
- Publication date Oct 25, 2001
- Nozomi Shimoishizaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed-circuit board having projection electrodes and method for p...
- Publication number 20010029666
- Publication date Oct 18, 2001
- Yoshifumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for the fabrication thereof
- Publication number 20010015496
- Publication date Aug 23, 2001
- Kazumi Watase
- H01 - BASIC ELECTRIC ELEMENTS

Yoshifumi Nakamura

Person

Patents Grantslast 30 patents

Wiring board, semiconductor device and method for manufacturing the...

Semiconductor device, method for manufacturing the same, and semico...

Wiring board and method for manufacturing the same, and semiconduct...

Semiconductor device and method of manufacturing the same

Wiring board, semiconductor device using the same, and method for m...

Wiring board and method for producing the same

Circuit board with auxiliary wiring configuration to suppress break...

Method for fabricating a chip-scale-packaging (CSP) having an inductor

Wiring board, semiconductor device and display module

Semiconductor device including a diffusion layer

Semiconductor device and method for the fabrication thereof

Semiconductor device having an inductor formed on a region of an in...

Semiconductor device and method for manufacturing the same

Semiconductor device including a diffusion layer formed between ele...

Method for producing a printed-circuit board having projection elec...

Semiconductor device and method for the fabrication thereof

Method for manufacturing electronic device with resin layer between...

Chip carrier and method of manufacturing and mounting the same

Semiconductor device and method for manufacturing the same

Printed-circuit board having projection electrodes and method for p...

Chip carrier

Method for fabricating bump electrodes with a leveling step for uni...

Method of checking electric circuits of semiconductor device and co...

Method of making multi-layered ceramic substrates

Method of manufacturing a ceramic substrate

Ceramic substrate and manufacturing method thereof

Conductive ink

Method for producing multilayered ceramic substrate

Patents Applicationslast 30 patents

WIRING BOARD, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Circuit board, and semiconductor device

TAPE CARRIER SUBSTRATE AND SEMICONDUCTOR DEVICE

Semiconductor device

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, AND SEMICO...

WIRING BOARD METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR D...

WIRING BOARD, SEMICONDUCTOR DEVICE USING THE SAME, AND METHOD FOR M...

WIRING BOARD AND METHOD FOR PRODUCING THE SAME

CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE

Wiring board and semiconductor device

Wiring board, semiconductor device and display module

Semiconductor device

Semiconductor device and method for fabricating the same

Semiconductor device and method of manufacturing the same

Semiconductor device and manufacturing method thereof

Semiconductor device and method for manufacturing the same

Semiconductor device and method for fabricating the same

Semiconductor device and method for the fabrication thereof

Semiconductor device and manufacturing method thereof

CHIP CARRIER AND METHOD OF MANUFACTURING AND MOUNTING THE SAME

Semiconductor device and method for manufacturing the same

Semiconductor device and method for manufacturing the same

Printed-circuit board having projection electrodes and method for p...

Semiconductor device and method for the fabrication thereof