Yoshihiko Koike

Person

Hitachinaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor module
- Patent number 9,000,601
- Issue date Apr 7, 2015
- Hitachi Power Semiconductor Device, Ltd.
- Katsunori Azuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and fabrication method thereof
- Patent number 8,304,889
- Issue date Nov 6, 2012
- Hitachi, Ltd.
- Kazuhiro Oyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor module and fabrication method thereof
- Patent number 8,283,763
- Issue date Oct 9, 2012
- Hitachi, Ltd.
- Kazuhiro Oyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 7,141,741
- Issue date Nov 28, 2006
- Hitachi, Ltd.
- Kazuji Yamada
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Composite material including copper and cuprous oxide and applicati...
- Patent number 6,909,185
- Issue date Jun 21, 2005
- Hitachi, Ltd.
- Yasuo Kondo
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Composite material including copper and cuprous oxide and applicati...
- Patent number 6,833,617
- Issue date Dec 21, 2004
- Hitachi, Ltd.
- Yasuo Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite material, and manufacturing method and uses of same
- Patent number 6,646,344
- Issue date Nov 11, 2003
- Hitachi, Ltd.
- Kazutaka Okamoto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Composite material, and manufacturing method and uses of same
- Patent number 6,630,734
- Issue date Oct 7, 2003
- Hitachi, Ltd.
- Kazutaka Okamoto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Composite material, and manufacturing method and uses of same
- Patent number 6,611,056
- Issue date Aug 26, 2003
- Hitachi, Ltd.
- Kazutaka Okamoto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Semiconductor module and inverter device
- Patent number 6,441,317
- Issue date Aug 27, 2002
- Hitachi, Ltd.
- Akira Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,434,008
- Issue date Aug 13, 2002
- Hitachi, Ltd.
- Kazuji Yamada
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device having power semiconductor elements
- Patent number 5,956,231
- Issue date Sep 21, 1999
- Hitachi, Ltd.
- Kazuji Yamada
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor module including switching device chips and diode chips
- Patent number 5,929,519
- Issue date Jul 27, 1999
- Hitchi, Ltd.
- Mutsuhiro Mori
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor module for a power conversion device
- Patent number 5,801,936
- Issue date Sep 1, 1998
- Hitachi, Ltd.
- Mutsuhiro Mori
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Power conversion device and semiconductor module suitable for use i...
- Patent number 5,731,970
- Issue date Mar 24, 1998
- Hitachi, Ltd.
- Mutsuhiro Mori
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device having thermal stress resistance structure
- Patent number 5,621,243
- Issue date Apr 15, 1997
- Hitachi, Ltd.
- Noboru Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with an improved heat sink/insulation plate ar...
- Patent number 5,585,672
- Issue date Dec 17, 1996
- Hitachi, Ltd.
- Yoshihiko Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Neutral-point clamped inverter device using semiconductor modules
- Patent number 5,459,655
- Issue date Oct 17, 1995
- Hitachi, Ltd.
- Mutsuhiro Mori
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor module with a plurality of power devices mounted on a...
- Patent number 5,446,318
- Issue date Aug 29, 1995
- Hitachi, Ltd.
- Yoshihiko Koike
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20130001805
- Publication date Jan 3, 2013
- Katsunori AZUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND FABRICATION METHOD THEREOF
- Publication number 20100176505
- Publication date Jul 15, 2010
- Kazuhiro Oyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power Semiconductor Module and Fabrication Method Thereof
- Publication number 20070290305
- Publication date Dec 20, 2007
- Kazuhiro Oyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board
- Publication number 20040056349
- Publication date Mar 25, 2004
- Kazuji Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composite material, and manufacturing method and uses of same
- Publication number 20040031545
- Publication date Feb 19, 2004
- Kazutaka Okamoto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Composite material including copper and cuprous oxide and applicati...
- Publication number 20030146498
- Publication date Aug 7, 2003
- Yasuo Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composite material including copper and cuprous oxide and applicati...
- Publication number 20030146499
- Publication date Aug 7, 2003
- Yasuo Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20030016502
- Publication date Jan 23, 2003
- Kazuji Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composite material, and manufacturing method and uses of same
- Publication number 20020145195
- Publication date Oct 10, 2002
- Kazutaka Okamoto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Composite material, and manufacturing method and uses of same
- Publication number 20020135061
- Publication date Sep 26, 2002
- Kazutaka Okamoto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Yoshihiko Koike

Person

Patents Grantslast 30 patents

Power semiconductor module

Power semiconductor module and fabrication method thereof

Power semiconductor module and fabrication method thereof

Circuit board

Composite material including copper and cuprous oxide and applicati...

Composite material including copper and cuprous oxide and applicati...

Composite material, and manufacturing method and uses of same

Composite material, and manufacturing method and uses of same

Composite material, and manufacturing method and uses of same

Semiconductor module and inverter device

Semiconductor device

Semiconductor device having power semiconductor elements

Semiconductor module including switching device chips and diode chips

Semiconductor module for a power conversion device

Power conversion device and semiconductor module suitable for use i...

Semiconductor device having thermal stress resistance structure

Semiconductor module with an improved heat sink/insulation plate ar...

Neutral-point clamped inverter device using semiconductor modules

Semiconductor module with a plurality of power devices mounted on a...

Patents Applicationslast 30 patents

POWER SEMICONDUCTOR MODULE

POWER SEMICONDUCTOR MODULE AND FABRICATION METHOD THEREOF

Power Semiconductor Module and Fabrication Method Thereof

Circuit board

Composite material, and manufacturing method and uses of same

Composite material including copper and cuprous oxide and applicati...

Composite material including copper and cuprous oxide and applicati...

Semiconductor device

Composite material, and manufacturing method and uses of same

Composite material, and manufacturing method and uses of same