Yoshihiko Takeuchi

Person

  • Osaka, JP

Patents Grantslast 30 patents

  • Information Patent Grant

    Wired-circuit-board assembly sheet

    • Patent number 7,649,143
    • Issue date Jan 19, 2010
    • Nitto Denko Corporation
    • Tetsuya Ohsawa
    • G11 - INFORMATION STORAGE
  • Information Patent Grant

    Identification mark for a wiring circuit board carrying sheet

    • Patent number D594425
    • Issue date Jun 16, 2009
    • Nitto Denko Corporation
    • Tetsuya Ohsawa
    • D13 - Equipment for production, distribution, or transformation of energy
  • Information Patent Grant

    Identification mark for a wiring circuit board carrying sheet

    • Patent number D580382
    • Issue date Nov 11, 2008
    • Nitto Denko Corporation
    • Tetsuya Ohsawa
    • D13 - Equipment for production, distribution, or transformation of energy
  • Information Patent Grant

    Wired circuit board assembly

    • Patent number 7,307,853
    • Issue date Dec 11, 2007
    • Nitto Denko Corporation
    • Yasuhito Funada
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wired circuit board

    • Patent number 7,288,725
    • Issue date Oct 30, 2007
    • Nitto Denko Corporation
    • Yoshihiko Takeuchi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wired circuit board

    • Patent number 7,067,912
    • Issue date Jun 27, 2006
    • Nitto Denko Corporation
    • Yoshihiko Takeuchi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    Wired-circuit-board assembly sheet

    • Publication number 20070170911
    • Publication date Jul 26, 2007
    • Nitto Denko Corporation
    • Tetsuya Ohsawa
    • G11 - INFORMATION STORAGE
  • Information Patent Application

    Wired circuit board

    • Publication number 20060266545
    • Publication date Nov 30, 2006
    • Nitto Denko Corporation
    • Yoshihiko Takeuchi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wired circuit board assembly

    • Publication number 20060169486
    • Publication date Aug 3, 2006
    • Nitto Denko Corporation
    • Yasuhito Funada
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wired circuit board

    • Publication number 20040245619
    • Publication date Dec 9, 2004
    • Yoshihiko Takeuchi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR