Yoshihiro Bessho

Person

Yahata-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing electric element built-in module with seal...
- Patent number 7,134,198
- Issue date Nov 14, 2006
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Nakatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing mounting structure and mounting structure produ...
- Patent number 6,818,461
- Issue date Nov 16, 2004
- Matsushita Electric Industrial Co., Ltd.
- Kazuyoshi Amami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module with built-in electronic elements and method of manufacture...
- Patent number 6,798,121
- Issue date Sep 28, 2004
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Nakatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and production method thereof
- Patent number 6,774,316
- Issue date Aug 10, 2004
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device including wiring board with three dimensional...
- Patent number 6,756,663
- Issue date Jun 29, 2004
- Matsushita Electric Industrial Co., Ltd.
- Tsukasa Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing mounting structure for an electronic component
- Patent number 6,749,889
- Issue date Jun 15, 2004
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Takezawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface acoustic wave device, method for producing the same, and ci...
- Patent number 6,710,682
- Issue date Mar 23, 2004
- Matsushita Electric Industrial Co., Ltd.
- Keiji Onishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a printed-circuit board having projection elec...
- Patent number 6,694,613
- Issue date Feb 24, 2004
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing a circuit board
- Patent number 6,691,409
- Issue date Feb 17, 2004
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrode structure for semiconductor device, method for forming th...
- Patent number 6,603,207
- Issue date Aug 5, 2003
- Matsushita Electric Industrial Co., Ltd.
- Yoshihiro Bessho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure for an electronic component and method for produ...
- Patent number 6,569,512
- Issue date May 27, 2003
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Takezawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 6,538,315
- Issue date Mar 25, 2003
- Matsushita Electric Industrial Co., Ltd.
- Yoshihiro Bessho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a wiring board and semiconductor ele...
- Patent number 6,525,414
- Issue date Feb 25, 2003
- Matsushita Electric Industrial Co., Ltd.
- Tsukasa Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and production of the same
- Patent number 6,518,514
- Issue date Feb 11, 2003
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive paste, its manufacturing method, and printed wiring boar...
- Patent number 6,488,869
- Issue date Dec 3, 2002
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Takezawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stress relaxation electronic part, stress relaxation wiring board,...
- Patent number 6,465,082
- Issue date Oct 15, 2002
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Takezawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip semiconductor apparatus with projecting electrodes and me...
- Patent number 6,452,280
- Issue date Sep 17, 2002
- Matsushita Electric Industrial Co., Ltd.
- Tsukasa Shiraishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical mounting structure having an elution preventive film
- Patent number 6,429,382
- Issue date Aug 6, 2002
- Matsushita Electric Industrial Co., Ltd.
- Kazuyoshi Amami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode structure for semiconductor device, method for forming th...
- Patent number 6,387,794
- Issue date May 14, 2002
- Matsushita Electric Industrial Co., Ltd.
- Yoshihiro Bessho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure for an electronic component and method for produ...
- Patent number 6,376,051
- Issue date Apr 23, 2002
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Takezawa
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for manufacturing electronic device with resin layer between...
- Patent number 6,372,547
- Issue date Apr 16, 2002
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor package with a semiconductor...
- Patent number 6,372,548
- Issue date Apr 16, 2002
- Matsushita Electric Industrial Co., Ltd.
- Yoshihiro Bessho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing mounting structure and mounting structure produ...
- Patent number 6,369,450
- Issue date Apr 9, 2002
- Matsushita Electric Industrial Co., Ltd.
- Kazuyoshi Amani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier and method of manufacturing and mounting the same
- Patent number 6,365,499
- Issue date Apr 2, 2002
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric circuit and package for semiconductor
- Patent number 6,310,393
- Issue date Oct 30, 2001
- Matsushita Electric Industrial Co., Ltd.
- Tetsuyosi Ogura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed-circuit board having projection electrodes and method for p...
- Patent number 6,300,576
- Issue date Oct 9, 2001
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor device, mounting method of s...
- Patent number 6,284,640
- Issue date Sep 4, 2001
- Matsushita Electric Industrial Co., Ltd.
- Masahiro Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier
- Patent number 6,229,209
- Issue date May 8, 2001
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating bump electrodes with a leveling step for uni...
- Patent number 6,207,550
- Issue date Mar 27, 2001
- Matsushita Electric Industrial Co., Ltd.
- Nobuhiro Hase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic part and a method of production thereof
- Patent number 6,154,940
- Issue date Dec 5, 2000
- Matsushita Electric Industrial Co., Ltd.
- Keiji Onishi
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
Display apparatus and its manufacturing method
- Publication number 20050017268
- Publication date Jan 27, 2005
- Masahide Tsukamoto
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
Semiconductor device including a wiring board with a three-dimensio...
- Publication number 20040212075
- Publication date Oct 28, 2004
- Tsukasa Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electric element built-in module and method for manufacturing the same
- Publication number 20040040740
- Publication date Mar 4, 2004
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Nakatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mounting structure for an electronic component and method for produ...
- Publication number 20030207073
- Publication date Nov 6, 2003
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Takezawa
- B32 - LAYERED PRODUCTS
Information Patent Application
Semiconductor device and module of the same
- Publication number 20030094685
- Publication date May 22, 2003
- Tsukasa Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board and production of the same
- Publication number 20030066683
- Publication date Apr 10, 2003
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Module with built-in electronic elements and method of manufacture...
- Publication number 20020159242
- Publication date Oct 31, 2002
- Seiichi Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface accoustic wave device, method for producing the same, and c...
- Publication number 20020101304
- Publication date Aug 1, 2002
- Matsushita Electric Industrial Co., Ltd.
- Keiji Onishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrode structure for semiconductor device, method for forming th...
- Publication number 20020081830
- Publication date Jun 27, 2002
- Matsushita Electric Industrial Co., Ltd.
- Yoshihiro Bessho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of producing mounting structure and mounting structure produ...
- Publication number 20020072151
- Publication date Jun 13, 2002
- Matsushita Electric Industrial Co., Ltd.
- Kazuyoshi Amami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board and production of the same
- Publication number 20020038725
- Publication date Apr 4, 2002
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Takeshi Suzuki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Mounting structure for an electronic component and method for produ...
- Publication number 20020034620
- Publication date Mar 21, 2002
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Takezawa
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR PACKAGE WITH A SEMICONDUCTOR...
- Publication number 20020017712
- Publication date Feb 14, 2002
- Yoshihiro Bessho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PASTE, ITS MANUFACTURING METHOD, AND PRINTED WIRING BOAR...
- Publication number 20020008228
- Publication date Jan 24, 2002
- HIROAKI TAKEZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP CARRIER AND METHOD OF MANUFACTURING AND MOUNTING THE SAME
- Publication number 20020003299
- Publication date Jan 10, 2002
- YOSHIFUMI NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method for semiconductor device, mounting method of s...
- Publication number 20010033032
- Publication date Oct 25, 2001
- Matsushita Electric Industrial Co., Ltd.
- Masahiro Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed-circuit board having projection electrodes and method for p...
- Publication number 20010029666
- Publication date Oct 18, 2001
- Yoshifumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODE STRUCTURE FOR SEMICONDUCTOR DEVICE, METHOD FOR FORMING TH...
- Publication number 20010014523
- Publication date Aug 16, 2001
- Matsushita Electric Industrial Co., Ltd.
- YOSHIHIRO BESSHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing same
- Publication number 20010002733
- Publication date Jun 7, 2001
- Yoshihiro Bessho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and module of the same
- Publication number 20010002727
- Publication date Jun 7, 2001
- Tsukasa Shiraishi
- H01 - BASIC ELECTRIC ELEMENTS

Yoshihiro Bessho

Person

Patents Grantslast 30 patents

Method for manufacturing electric element built-in module with seal...

Method of producing mounting structure and mounting structure produ...

Module with built-in electronic elements and method of manufacture...

Wiring board and production method thereof

Semiconductor device including wiring board with three dimensional...

Method for producing mounting structure for an electronic component

Surface acoustic wave device, method for producing the same, and ci...

Method for producing a printed-circuit board having projection elec...

Method of producing a circuit board

Electrode structure for semiconductor device, method for forming th...

Mounting structure for an electronic component and method for produ...

Semiconductor device and method of manufacturing same

Semiconductor device including a wiring board and semiconductor ele...

Circuit board and production of the same

Conductive paste, its manufacturing method, and printed wiring boar...

Stress relaxation electronic part, stress relaxation wiring board,...

Flip chip semiconductor apparatus with projecting electrodes and me...

Electrical mounting structure having an elution preventive film

Electrode structure for semiconductor device, method for forming th...

Mounting structure for an electronic component and method for produ...

Method for manufacturing electronic device with resin layer between...

Method for fabricating a semiconductor package with a semiconductor...

Method of producing mounting structure and mounting structure produ...

Chip carrier and method of manufacturing and mounting the same

Electric circuit and package for semiconductor

Printed-circuit board having projection electrodes and method for p...

Manufacturing method for semiconductor device, mounting method of s...

Chip carrier

Method for fabricating bump electrodes with a leveling step for uni...

Electronic part and a method of production thereof

Patents Applicationslast 30 patents

Display apparatus and its manufacturing method

Semiconductor device including a wiring board with a three-dimensio...

Electric element built-in module and method for manufacturing the same

Mounting structure for an electronic component and method for produ...

Semiconductor device and module of the same

Circuit board and production of the same

Module with built-in electronic elements and method of manufacture...

Surface accoustic wave device, method for producing the same, and c...

Electrode structure for semiconductor device, method for forming th...

Method of producing mounting structure and mounting structure produ...

Circuit board and production of the same

Mounting structure for an electronic component and method for produ...

METHOD FOR FABRICATING A SEMICONDUCTOR PACKAGE WITH A SEMICONDUCTOR...

CONDUCTIVE PASTE, ITS MANUFACTURING METHOD, AND PRINTED WIRING BOAR...

CHIP CARRIER AND METHOD OF MANUFACTURING AND MOUNTING THE SAME

Manufacturing method for semiconductor device, mounting method of s...

Printed-circuit board having projection electrodes and method for p...

ELECTRODE STRUCTURE FOR SEMICONDUCTOR DEVICE, METHOD FOR FORMING TH...

Semiconductor device and method of manufacturing same

Semiconductor device and module of the same