Yoshihiro HOSOI

Person

Kirishima-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate, electronic device, and electronic module
- Patent number 11,823,966
- Issue date Nov 21, 2023
- Kyocera Corporation
- Kyohei Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, electronic device, and electronic module
- Patent number 11,792,930
- Issue date Oct 17, 2023
- Kyocera Corporation
- Yuki Takeshima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and electronic device using the same
- Patent number 9,426,887
- Issue date Aug 23, 2016
- Kyocera Corporation
- Yoshihiro Hosoi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board, mount structure thereof, and methods of prod...
- Patent number 8,957,321
- Issue date Feb 17, 2015
- KYOCERA SLC Technologies Corporation
- Masaaki Harazono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and mounting structure using the same
- Patent number 8,890,001
- Issue date Nov 18, 2014
- KYOCERA SLC Technologies Corporation
- Takayuki Nejime
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and mounting structure using the same
- Patent number 8,735,741
- Issue date May 27, 2014
- Kyocera Corporation
- Masaaki Harazono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing wiring substrate
- Patent number 7,011,862
- Issue date Mar 14, 2006
- Kyocera Corporation
- Yoshihiro Hosoi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 6,841,885
- Issue date Jan 11, 2005
- Kyocera Corporation
- Yoshihiro Hosoi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having improved heat resistance
- Patent number 5,760,466
- Issue date Jun 2, 1998
- Kyocera Corporation
- Kenji Masuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Covering metal structure for metallized metal layer in electronic part
- Patent number 4,626,479
- Issue date Dec 2, 1986
- Kyocera Corporation
- Yoshihiro Hosoi
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
- Publication number 20230403793
- Publication date Dec 14, 2023
- KYOCERA CORPORATION
- Yuki TAKESHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
- Publication number 20220192022
- Publication date Jun 16, 2022
- KYOCERA CORPORATION
- Yuki TAKESHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
- Publication number 20220037220
- Publication date Feb 3, 2022
- KYOCERA CORPORATION
- Kyohei YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND ELECTRONIC DEVICE USING THE SAME
- Publication number 20140000946
- Publication date Jan 2, 2014
- Yoshihiro HOSOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND MOUNTING STRUCTURE USING THE SAME
- Publication number 20130192882
- Publication date Aug 1, 2013
- KYOCERA SLC TECHNOLOGIES CORPORATION
- Takayuki NEJIME
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD, MOUNT STRUCTURE THEREOF, AND METHODS OF PROD...
- Publication number 20130081861
- Publication date Apr 4, 2013
- KYOCERA SLC TECHNOLOGIES CORPORATION
- Masaaki HARAZONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND MOUNTING STRUCTURE USING THE SAME
- Publication number 20120132462
- Publication date May 31, 2012
- Kyocera Corporation
- Masaaki Harazono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring substrate and method for producing the same
- Publication number 20050084661
- Publication date Apr 21, 2005
- KYOCERA CORPORATION
- Yoshihiro Hosoi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring substrate and method for producing the same
- Publication number 20020175397
- Publication date Nov 28, 2002
- KYOCERA CORPORATION
- Yoshihiro Hosoi
- H01 - BASIC ELECTRIC ELEMENTS

Yoshihiro HOSOI

Person

Patents Grantslast 30 patents

Wiring substrate, electronic device, and electronic module

Wiring substrate, electronic device, and electronic module

Wiring board and electronic device using the same

Printed circuit board, mount structure thereof, and methods of prod...

Wiring board and mounting structure using the same

Circuit board and mounting structure using the same

Method for producing wiring substrate

Wiring substrate

Semiconductor device having improved heat resistance

Covering metal structure for metallized metal layer in electronic part

Patents Applicationslast 30 patents

WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

WIRING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

WIRING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

WIRING BOARD AND ELECTRONIC DEVICE USING THE SAME

WIRING BOARD AND MOUNTING STRUCTURE USING THE SAME

PRINTED CIRCUIT BOARD, MOUNT STRUCTURE THEREOF, AND METHODS OF PROD...

CIRCUIT BOARD AND MOUNTING STRUCTURE USING THE SAME

Wiring substrate and method for producing the same

Wiring substrate and method for producing the same