Yoshihiro Saeki

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Occupant position detection system
- Patent number 11,628,789
- Issue date Apr 18, 2023
- Toyota Jidosha Kabushiki Kaisha
- Udara Manawadu
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Temperature environment regulating system, temperature preference e...
- Patent number 11,318,812
- Issue date May 3, 2022
- Toyota Jidosha Kabushiki Kaisha
- Yoshihiro Saeki
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method for setting conditions for heating semiconductor chip during...
- Patent number 11,201,132
- Issue date Dec 14, 2021
- Shinkawa Ltd.
- Tomonori Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,541,891
- Issue date Sep 24, 2013
- Lapis Semiconductor Co., Ltd.
- Yoshihiro Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device fabricating method and fabricating apparatus
- Patent number 8,484,820
- Issue date Jul 16, 2013
- Lapis Semiconductor Co., Ltd.
- Yoshihiro Saeki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Vehicle heat management device
- Patent number 8,475,337
- Issue date Jul 2, 2013
- Toyota Jidosha Kabushiki Kaisha
- Masahide Ishikawa
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device and plurality of dams
- Patent number 8,432,025
- Issue date Apr 30, 2013
- Lapis Semiconductor Co., Ltd.
- Yoshihiro Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing semiconductor device
- Patent number 8,329,561
- Issue date Dec 11, 2012
- Oki Semiconductor Co., Ltd.
- Yoshihiro Saeki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device fabricating method and fabricating apparatus
- Patent number 8,003,437
- Issue date Aug 23, 2011
- Oki Semiconductor Co., Ltd.
- Yoshihiro Saeki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device and dam for resin
- Patent number 7,804,161
- Issue date Sep 28, 2010
- Oki Semiconductor Co., Ltd.
- Yoshihiro Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including substrate and upper plate having red...
- Patent number 7,679,175
- Issue date Mar 16, 2010
- Oki Semiconductor Co., Ltd.
- Yoshihiro Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 7,662,671
- Issue date Feb 16, 2010
- Oki Semiconductor Co., Ltd.
- Yoshihiro Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Acceleration sensor chip package and method of producing the same
- Patent number 7,614,301
- Issue date Nov 10, 2009
- Oki Semiconductor Co., Ltd.
- Yoshihiro Saeki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor chip capable of being laminated and a semiconductor d...
- Patent number 7,514,796
- Issue date Apr 7, 2009
- Oki Semiconductor Co., Ltd.
- Yoshihiro Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,492,038
- Issue date Feb 17, 2009
- Oki Semiconductor Co., Ltd.
- Yoshihiro Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device
- Patent number 7,459,348
- Issue date Dec 2, 2008
- Oki Electric Industry Co., Ltd.
- Yoshihiro Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rearrangement sheet, semiconductor device and method of manufacturi...
- Patent number 7,435,626
- Issue date Oct 14, 2008
- Oki Electric Industry Co., Ltd.
- Yasufumi Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,372,137
- Issue date May 13, 2008
- Oki Electric Industry Co., Ltd.
- Yoshihiro Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Acceleration sensor chip package
- Patent number 7,299,696
- Issue date Nov 27, 2007
- Oki Electric Industry Co., Ltd.
- Yoshihiro Saeki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor chip and semiconductor device including lamination of...
- Patent number 7,132,752
- Issue date Nov 7, 2006
- Oki Electric Industry Co., Ltd.
- Yoshihiro Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device include relay chip connecting semiconductor ch...
- Patent number 6,836,010
- Issue date Dec 28, 2004
- Oki Electric Industry Co., Ltd.
- Yoshihiro Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rearrangement sheet, semiconductor device and method of manufacturi...
- Patent number 6,787,915
- Issue date Sep 7, 2004
- Oki Electric Industry Co., Ltd.
- Yasufumi Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,717,252
- Issue date Apr 6, 2004
- Oki Electric Industry Co., Ltd.
- Yoshihiro Saeki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OCCUPANT POSITION DETECTION SYSTEM
- Publication number 20210300274
- Publication date Sep 30, 2021
- Toyota Jidosha Kabushiki Kaisha
- Udara Manawadu
- B60 - VEHICLES IN GENERAL
Information Patent Application
TEMPERATURE ENVIRONMENT REGULATING SYSTEM, TEMPERATURE PREFERENCE E...
- Publication number 20200331320
- Publication date Oct 22, 2020
- Toyota Jidosha Kabushiki Kaisha
- Yoshihiro SAEKI
- B60 - VEHICLES IN GENERAL
Information Patent Application
METHOD FOR SETTING CONDITIONS FOR HEATING SEMICONDUCTOR CHIP DURING...
- Publication number 20200286854
- Publication date Sep 10, 2020
- SHINKAWA LTD.
- Tomonori NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VEHICLE HEAT MANAGEMENT DEVICE
- Publication number 20120037336
- Publication date Feb 16, 2012
- Toyota Jidosha Kabushiki Kaisha
- Masahide Ishikawa
- B60 - VEHICLES IN GENERAL
Information Patent Application
Semiconductor device fabricating method and fabricating apparatus
- Publication number 20110258849
- Publication date Oct 27, 2011
- Yoshihiro Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20100320581
- Publication date Dec 23, 2010
- OKI SEMICONDUCTOR CO., LTD.
- Yoshihiro Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20100248450
- Publication date Sep 30, 2010
- Yoshihiro SAEKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device fabricating method and fabricating apparatus
- Publication number 20090155953
- Publication date Jun 18, 2009
- Oki Semiconductor Co., Ltd.
- Yoshihiro Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Rearrangement sheet, semiconductor device and method of manufacturi...
- Publication number 20090031563
- Publication date Feb 5, 2009
- Yasufumi Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20080237892
- Publication date Oct 2, 2008
- Oki Electric Industry Co., Ltd.
- Yoshihiro Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20080237895
- Publication date Oct 2, 2008
- Oki Electric Industry Co., Ltd.
- Yoshihiro Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Acceleration sensor chip package and method of producing the same
- Publication number 20080047345
- Publication date Feb 28, 2008
- Yoshihiro Saeki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor chip and semiconductor device
- Publication number 20070257374
- Publication date Nov 8, 2007
- Oki Electric Industry Co., Ltd.
- Yoshihiro Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20070072345
- Publication date Mar 29, 2007
- Oki Electric Industry Co., Ltd.
- Yoshihiro Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Jig for manufacturing semiconductor devices and method for manufact...
- Publication number 20070068454
- Publication date Mar 29, 2007
- Oki Electric Industry Co., Ltd.
- Yoshihiro Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20070045791
- Publication date Mar 1, 2007
- Yoshihiro Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20060214277
- Publication date Sep 28, 2006
- Yoshihiro Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LAMINATING CHIPS AND METHOD FOR MANUFACTURING SEMICONDUC...
- Publication number 20060207086
- Publication date Sep 21, 2006
- Oki Electric Industry Co., Ltd.
- Yoshihiro Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing a semiconductor device
- Publication number 20060088957
- Publication date Apr 27, 2006
- Yoshihiro Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Acceleration sensor chip package and method of producing the same
- Publication number 20060081047
- Publication date Apr 20, 2006
- Yoshihiro Saeki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Electrical inspection method and apparatus for printed wiring board...
- Publication number 20050200363
- Publication date Sep 15, 2005
- MITSUI MINING AND SMELTING CO., LTD
- Hiroshi Hasegawa
- G01 - MEASURING TESTING
Information Patent Application
Semi conductor device
- Publication number 20050127526
- Publication date Jun 16, 2005
- Oki Electric Industry Co., Ltd.
- Yoshihiro Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip and semiconductor device
- Publication number 20050093167
- Publication date May 5, 2005
- Oki Electric Industry Co., Ltd.
- Yoshihiro Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Rearrangemet sheet, semiconductor device and method of manufacturin...
- Publication number 20040232539
- Publication date Nov 25, 2004
- Yasufumi Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of producing the same
- Publication number 20040017003
- Publication date Jan 29, 2004
- Yoshihiro Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20030122237
- Publication date Jul 3, 2003
- Yoshihiro Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Rearrangement sheet, semiconductor device and method of manufacturi...
- Publication number 20020121686
- Publication date Sep 5, 2002
- Yasufumi Uchida
- H01 - BASIC ELECTRIC ELEMENTS

Yoshihiro Saeki

Person

Patents Grantslast 30 patents

Occupant position detection system

Temperature environment regulating system, temperature preference e...

Method for setting conditions for heating semiconductor chip during...

Semiconductor device

Semiconductor device fabricating method and fabricating apparatus

Vehicle heat management device

Semiconductor device and plurality of dams

Method of producing semiconductor device

Semiconductor device fabricating method and fabricating apparatus

Semiconductor device and dam for resin

Semiconductor device including substrate and upper plate having red...

Semiconductor device and method for manufacturing the same

Acceleration sensor chip package and method of producing the same

Semiconductor chip capable of being laminated and a semiconductor d...

Semiconductor device

Method for manufacturing a semiconductor device

Rearrangement sheet, semiconductor device and method of manufacturi...

Semiconductor device and manufacturing method thereof

Acceleration sensor chip package

Semiconductor chip and semiconductor device including lamination of...

Semiconductor device include relay chip connecting semiconductor ch...

Rearrangement sheet, semiconductor device and method of manufacturi...

Semiconductor device

Patents Applicationslast 30 patents

OCCUPANT POSITION DETECTION SYSTEM

TEMPERATURE ENVIRONMENT REGULATING SYSTEM, TEMPERATURE PREFERENCE E...

METHOD FOR SETTING CONDITIONS FOR HEATING SEMICONDUCTOR CHIP DURING...

VEHICLE HEAT MANAGEMENT DEVICE

Semiconductor device fabricating method and fabricating apparatus

Semiconductor device

METHOD OF PRODUCING SEMICONDUCTOR DEVICE

Semiconductor device fabricating method and fabricating apparatus

Rearrangement sheet, semiconductor device and method of manufacturi...

Semiconductor device

Semiconductor device

Acceleration sensor chip package and method of producing the same

Semiconductor chip and semiconductor device

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Jig for manufacturing semiconductor devices and method for manufact...

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

METHOD FOR LAMINATING CHIPS AND METHOD FOR MANUFACTURING SEMICONDUC...

Method for manufacturing a semiconductor device

Acceleration sensor chip package and method of producing the same

Electrical inspection method and apparatus for printed wiring board...

Semi conductor device

Semiconductor chip and semiconductor device

Rearrangemet sheet, semiconductor device and method of manufacturin...

Semiconductor device and method of producing the same

Semiconductor device

Rearrangement sheet, semiconductor device and method of manufacturi...