TREA

Yoshikatsu Umeda

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  • Beppu-shi, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Protruding TSV tips for enhanced heat dissipation for IC devices
    • Patent number 8,294,261
    • Issue date Oct 23, 2012
    • Texas Instruments Incorporated
    • Kazuaki Mawatari
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Spot heat wirebonding
    • Patent number 7,926,698
    • Issue date Apr 19, 2011
    • Texas Instruments Incorporated
    • Norihiro Kawakami
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Spot heat wirebonding
    • Patent number 7,677,432
    • Issue date Mar 16, 2010
    • Texas Instruments Incorporated
    • Norihiro Kawakami
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Semiconductor device and method of manufacturing same
    • Patent number 6,713,881
    • Issue date Mar 30, 2004
    • Texas Instruments Incorporated
    • Norito Umehara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device
    • Patent number 6,268,644
    • Issue date Jul 31, 2001
    • Texas Instruments Incorporated
    • Norito Umehara
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    PROTRUDING TSV TIPS FOR ENHANCED HEAT DISSIPATION FOR IC DEVICES
    • Publication number 20110186990
    • Publication date Aug 4, 2011
    • TEXAS INSTRUMENTS INCORPORATED
    • Kazuaki Mawatari
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Spot Heat Wirebonding
    • Publication number 20100140327
    • Publication date Jun 10, 2010
    • TEXAS INSTRUMENTS INCORPORATED
    • Norihiro KAWAKAMI
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Spot heat wirebonding
    • Publication number 20060249561
    • Publication date Nov 9, 2006
    • Norihiro Kawakami
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Method and system for improved wire bonding
    • Publication number 20050275073
    • Publication date Dec 15, 2005
    • TEXAS INSTRUMENTS INCORPORATED
    • Norihiro Kawakami
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Semiconductor device and method of manufacturing same
    • Publication number 20020125584
    • Publication date Sep 12, 2002
    • Norito Umehara
    • H01 - BASIC ELECTRIC ELEMENTS