Yoshikazu Takahashi

Person

Nagano, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,315,854
- Issue date Apr 26, 2022
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 10,355,089
- Issue date Jul 16, 2019
- Fuji Electric Co., Ltd.
- Takashi Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 10,128,166
- Issue date Nov 13, 2018
- Fuji Electric Co., Ltd.
- Motohito Hori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 10,079,155
- Issue date Sep 18, 2018
- Fuji Electric Co., Ltd.
- Tsunehiro Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unit for semiconductor device
- Patent number 9,854,708
- Issue date Dec 26, 2017
- Fuji Electric Co., Ltd.
- Takafumi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 9,741,587
- Issue date Aug 22, 2017
- Fuji Electric Co., Ltd.
- Tsunehiro Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,673,129
- Issue date Jun 6, 2017
- Fuji Electric Co., Ltd.
- Motohito Hori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Custom paper information converter
- Patent number 9,405,497
- Issue date Aug 2, 2016
- Canon USA Inc.
- Shin Fukuda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for producing semiconductor device
- Patent number 9,269,644
- Issue date Feb 23, 2016
- Fuji Electric Co., Ltd.
- Yoshitaka Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor module
- Patent number 9,209,099
- Issue date Dec 8, 2015
- Fuji Electric Co., Ltd.
- Motohito Hori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,035,453
- Issue date May 19, 2015
- Octec, Inc.
- Katsuya Okumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Quarantine network system, server apparatus, and program
- Patent number 8,984,634
- Issue date Mar 17, 2015
- NEC Corporation
- Yoshikazu Takahashi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Unit for semiconductor device and semiconductor device
- Patent number 8,907,477
- Issue date Dec 9, 2014
- Fuji Electric Co., Ltd.
- Takafumi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching hub, a system, a method of the switching hub and a progra...
- Patent number 8,732,817
- Issue date May 20, 2014
- NEC Corporation
- Yoshikazu Takahashi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for manufacturing a semiconductor device
- Patent number 8,673,691
- Issue date Mar 18, 2014
- Fuji Electric Co., Ltd.
- Yoshinari Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,450,845
- Issue date May 28, 2013
- Fuji Electric Co., Ltd.
- Yoshinari Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, electrode member and electrode member fabrica...
- Patent number 8,324,726
- Issue date Dec 4, 2012
- Octec, Inc.
- Katsuya Okumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip on film package with dummy patterns and manufact...
- Patent number 8,242,615
- Issue date Aug 14, 2012
- Oki Semiconductor Co., Ltd.
- Yoshikazu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a chip-size package
- Patent number 8,154,124
- Issue date Apr 10, 2012
- Oki Electric Industry Co., Ltd.
- Yoshikazu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor device using a solder alloy
- Patent number 7,816,249
- Issue date Oct 19, 2010
- Fuji Electric Systems Co., Ltd.
- Akira Morozumi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 7,667,305
- Issue date Feb 23, 2010
- Oki Semiconductor Co., Ltd.
- Yoshikazu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing chip size package semiconductor device with...
- Patent number 7,528,005
- Issue date May 5, 2009
- Oki Semiconductor Co., Ltd.
- Yoshikazu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a chip-size package
- Patent number 7,335,970
- Issue date Feb 26, 2008
- Oki Electric Industry Co., Ltd.
- Yoshikazu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape carrier package having stacked semiconductor elements, and sho...
- Patent number 7,049,687
- Issue date May 23, 2006
- Oki Electric Industry Co., Ltd.
- Yoshikazu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and the method for manufacturing the same
- Patent number 6,765,299
- Issue date Jul 20, 2004
- Oki Electric Industry Co., Ltd.
- Yoshikazu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a chip-size package
- Patent number 6,710,437
- Issue date Mar 23, 2004
- Oki Electric Industry Co., Ltd.
- Yoshikazu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape carrier package having stacked semiconductor elements, and sho...
- Patent number 6,664,618
- Issue date Dec 16, 2003
- Oki Electric Industry Co., Ltd.
- Yoshikazu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for manufacturing the same, and method...
- Patent number 6,589,817
- Issue date Jul 8, 2003
- Oki Electric Industry Co., Ltd.
- Yoshikazu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus with pressure contact semiconductor chips
- Patent number 6,373,129
- Issue date Apr 16, 2002
- Fuji Electric Co., Ltd.
- Kazuaki Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and process for manufacturing the same
- Patent number 6,320,250
- Issue date Nov 20, 2001
- Oki Electric Industry Co., Ltd.
- Yoshikazu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210066158
- Publication date Mar 4, 2021
- Fuji Electric Co., Ltd.
- Ryoichi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20170309496
- Publication date Oct 26, 2017
- FUJI ELECTRIC CO., LTD.
- Tsunehiro NAKAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20170053871
- Publication date Feb 23, 2017
- Fuji Electric Co., Ltd.
- Tsunehiro NAKAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20160343641
- Publication date Nov 24, 2016
- Fuji Electric Co., Ltd.
- Motohito HORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150380338
- Publication date Dec 31, 2015
- Fuji Electric Co., Ltd.
- Motohito HORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20150372095
- Publication date Dec 24, 2015
- Fuji Electric Co., Ltd.
- Takashi SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20150340297
- Publication date Nov 26, 2015
- Fuji Electric Co., Ltd.
- Motohito HORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIT FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20150109738
- Publication date Apr 23, 2015
- Fuji Electric Co., Ltd.
- Takafumi YAMADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING THE SAME
- Publication number 20140080262
- Publication date Mar 20, 2014
- Fuji Electric Co., Ltd.
- Yoshitaka NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20130267064
- Publication date Oct 10, 2013
- Fuji Electric Co., Ltd.
- Yoshinari IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRODE MEMBER, AND ELECTRODE MEMBER FABRIC...
- Publication number 20130093082
- Publication date Apr 18, 2013
- Octec, Inc.
- Katsuya OKUMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUARANTINE NETWORK SYSTEM, SERVER APPARATUS, AND PROGRAM
- Publication number 20130081139
- Publication date Mar 28, 2013
- NEC Corporation
- Yoshikazu TAKAHASHI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Switching hub, a system, a method of the switching hub and a progra...
- Publication number 20120254980
- Publication date Oct 4, 2012
- NEC Corporation
- Yoshikazu Takahashi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
UNIT FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20120241953
- Publication date Sep 27, 2012
- FUJI ELECTRIC CO., LTD
- Takafumi Yamada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE
- Publication number 20120244697
- Publication date Sep 27, 2012
- Octec, Inc.
- Katsuya Okumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CUSTOM PAPER INFORMATION CONVERTER
- Publication number 20110109933
- Publication date May 12, 2011
- Canon U.S.A., Inc.
- Shin Fukuda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20110037166
- Publication date Feb 17, 2011
- Fuji Electric Systems Co., Ltd.
- Yoshinari Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC ELECTROLUMINESCENT DISPLAY PANEL
- Publication number 20100026166
- Publication date Feb 4, 2010
- Yoshikazu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a chip-size package
- Publication number 20090146287
- Publication date Jun 11, 2009
- Oki Electric Industry Co., Ltd.
- Yoshikazu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20090115034
- Publication date May 7, 2009
- Oki Electric Industry Co., Ltd.
- Yoshikazu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing a semiconductor device using a solder alloy
- Publication number 20090093109
- Publication date Apr 9, 2009
- Fuji Electric Device Technology Co., LTD.
- Akira Morozumi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20080203563
- Publication date Aug 28, 2008
- Yoshikazu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder alloy and a semiconductor device using the solder alloy
- Publication number 20060263235
- Publication date Nov 23, 2006
- Fuji Electric Device Technology Co., LTD.
- Akira Morozumi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Semiconductor device, electrode member and electrode member fabrica...
- Publication number 20060192253
- Publication date Aug 31, 2006
- Octec, Inc.
- Katsuya Okumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method for producing the same
- Publication number 20060157862
- Publication date Jul 20, 2006
- Fuji Electric Device Technology, Co., Ltd.
- Yoshitaka Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Carrier tape, a method of manufacturing an electronic device with t...
- Publication number 20050252828
- Publication date Nov 17, 2005
- Yoshikazu Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing chip size package semiconductor device with...
- Publication number 20040219717
- Publication date Nov 4, 2004
- Yoshikazu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a chip-size package
- Publication number 20040150085
- Publication date Aug 5, 2004
- Oki Electric Industry Co., Ltd.
- Yoshikazu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tape carrier package having stacked semiconductor elements, and sho...
- Publication number 20040113271
- Publication date Jun 17, 2004
- Yoshikazu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, method for manufacturing the same, and method...
- Publication number 20030109078
- Publication date Jun 12, 2003
- Yoshikazu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS

Yoshikazu Takahashi

Person

Patents Grantslast 30 patents

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device and semiconductor device manufacturing method

Power semiconductor module

Semiconductor device manufacturing method

Unit for semiconductor device

Semiconductor device and semiconductor device manufacturing method

Semiconductor device

Custom paper information converter

Method for producing semiconductor device

Power semiconductor module

Semiconductor device

Quarantine network system, server apparatus, and program

Unit for semiconductor device and semiconductor device

Switching hub, a system, a method of the switching hub and a progra...

Method for manufacturing a semiconductor device

Semiconductor device

Semiconductor device, electrode member and electrode member fabrica...

Semiconductor chip on film package with dummy patterns and manufact...

Semiconductor device having a chip-size package

Method for producing a semiconductor device using a solder alloy

Semiconductor device

Method of manufacturing chip size package semiconductor device with...

Semiconductor device having a chip-size package

Tape carrier package having stacked semiconductor elements, and sho...

Semiconductor device and the method for manufacturing the same

Semiconductor device having a chip-size package

Tape carrier package having stacked semiconductor elements, and sho...

Semiconductor device, method for manufacturing the same, and method...

Semiconductor apparatus with pressure contact semiconductor chips

Semiconductor package and process for manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

POWER SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

POWER SEMICONDUCTOR MODULE

UNIT FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

METHOD FOR PRODUCING THE SAME

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, ELECTRODE MEMBER, AND ELECTRODE MEMBER FABRIC...

QUARANTINE NETWORK SYSTEM, SERVER APPARATUS, AND PROGRAM

Switching hub, a system, a method of the switching hub and a progra...

UNIT FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE

CUSTOM PAPER INFORMATION CONVERTER

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

ORGANIC ELECTROLUMINESCENT DISPLAY PANEL

Semiconductor device having a chip-size package

Semiconductor device

Method for producing a semiconductor device using a solder alloy

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Solder alloy and a semiconductor device using the solder alloy

Semiconductor device, electrode member and electrode member fabrica...

Semiconductor device and method for producing the same

Carrier tape, a method of manufacturing an electronic device with t...

Method of manufacturing chip size package semiconductor device with...

Semiconductor device having a chip-size package

Tape carrier package having stacked semiconductor elements, and sho...

Semiconductor device, method for manufacturing the same, and method...