Yoshiki Nakashima

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Functional element built-in substrate and wiring substrate
- Patent number 8,929,090
- Issue date Jan 6, 2015
- NEC Corporation
- Yoshiki Nakashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 8,872,334
- Issue date Oct 28, 2014
- NEC Corporation
- Shintaro Yamamichi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor element-embedded substrate, and method of manufacturi...
- Patent number 8,810,008
- Issue date Aug 19, 2014
- NEC Corporation
- Kentaro Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board with built-in semiconductor element
- Patent number 8,766,440
- Issue date Jul 1, 2014
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor element-embedded wiring substrate
- Patent number 8,710,639
- Issue date Apr 29, 2014
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device manufacture in which minimum wiring pitch of c...
- Patent number 8,710,669
- Issue date Apr 29, 2014
- NEC Corporation
- Kentaro Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board capable of containing functional element and method fo...
- Patent number 8,692,135
- Issue date Apr 8, 2014
- NEC Corporation
- Takuo Funaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,692,364
- Issue date Apr 8, 2014
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,569,892
- Issue date Oct 29, 2013
- NEC Corporation
- Kentaro Mori
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FUNCTIONAL ELEMENT BUILT-IN SUBSTRATE AND WIRING SUBSTRATE
- Publication number 20150053474
- Publication date Feb 26, 2015
- NEC Corporation
- Yoshiki Nakashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20150034373
- Publication date Feb 5, 2015
- NEC Corporation
- Yoshiki Nakashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20140024177
- Publication date Jan 23, 2014
- NEC Corporation
- KENTARO MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE BUILT-IN SUBSTRATE
- Publication number 20130127037
- Publication date May 23, 2013
- NEC Corporation
- Kentaro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH BUILT-IN FUNCTIONAL ELEMENT
- Publication number 20130088841
- Publication date Apr 11, 2013
- NEC Corporation
- Daisuke Ohshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUNCTIONAL DEVICE-EMBEDDED SUBSTRATE
- Publication number 20130050967
- Publication date Feb 28, 2013
- NEC Corporation
- Daisuke Ohshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20130026653
- Publication date Jan 31, 2013
- NEC Corporation
- Shintaro Yamamichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT-EMBEDDED WIRING SUBSTRATE
- Publication number 20130026632
- Publication date Jan 31, 2013
- NEC Corporation
- Katsumi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT-EMBEDDED SUBSTRATE, AND METHOD OF MANUFACTURI...
- Publication number 20130009325
- Publication date Jan 10, 2013
- NEC Corporation
- Kentaro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD WITH BUILT-IN SEMICONDUCTOR ELEMENT
- Publication number 20120319254
- Publication date Dec 20, 2012
- NEC Corporation
- Katsumi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUNCTIONAL ELEMENT BUILT-IN SUBSTRATE AND WIRING SUBSTRATE
- Publication number 20120300425
- Publication date Nov 29, 2012
- NEC Corporation
- Yoshiki Nakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120133052
- Publication date May 31, 2012
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120068359
- Publication date Mar 22, 2012
- Kentaro Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR ELEMENT-EMBEDDED WIRING SUBSTRATE
- Publication number 20110215478
- Publication date Sep 8, 2011
- NEC Corporation
- Shintaro YAMAMICHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20110175213
- Publication date Jul 21, 2011
- Kentaro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD CAPABLE OF CONTAINING FUNCTIONAL ELEMENT AND METHOD FO...
- Publication number 20110155433
- Publication date Jun 30, 2011
- Takuo Funaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Yoshiki Nakashima

Person

Patents Grantslast 30 patents

Functional element built-in substrate and wiring substrate

Method for manufacturing semiconductor device

Semiconductor element-embedded substrate, and method of manufacturi...

Wiring board with built-in semiconductor element

Semiconductor element-embedded wiring substrate

Semiconductor device manufacture in which minimum wiring pitch of c...

Wiring board capable of containing functional element and method fo...

Semiconductor device and method for manufacturing the same

Semiconductor device and manufacturing method thereof

Patents Applicationslast 30 patents

FUNCTIONAL ELEMENT BUILT-IN SUBSTRATE AND WIRING SUBSTRATE

WIRING STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE BUILT-IN SUBSTRATE

SUBSTRATE WITH BUILT-IN FUNCTIONAL ELEMENT

FUNCTIONAL DEVICE-EMBEDDED SUBSTRATE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR ELEMENT-EMBEDDED WIRING SUBSTRATE

SEMICONDUCTOR ELEMENT-EMBEDDED SUBSTRATE, AND METHOD OF MANUFACTURI...

WIRING BOARD WITH BUILT-IN SEMICONDUCTOR ELEMENT

FUNCTIONAL ELEMENT BUILT-IN SUBSTRATE AND WIRING SUBSTRATE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR ELEMENT-EMBEDDED WIRING SUBSTRATE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

WIRING BOARD CAPABLE OF CONTAINING FUNCTIONAL ELEMENT AND METHOD FO...