Yoshimichi Sogawa

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Encapsulating package, printed circuit board, electronic device and...
- Patent number 8,525,323
- Issue date Sep 3, 2013
- NEC Corporation
- Takao Yamazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device package, module, and electronic device
- Patent number 8,411,450
- Issue date Apr 2, 2013
- NEC Corporation
- Takao Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package device, module, and electronic apparatus
- Patent number 7,812,440
- Issue date Oct 12, 2010
- NEC Corporation
- Takao Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum package and manufacturing process thereof
- Patent number 7,795,585
- Issue date Sep 14, 2010
- NEC Corporation
- Yoshimichi Sogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same, circuit...
- Patent number 7,594,644
- Issue date Sep 29, 2009
- NEC Corporation
- Takao Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and laminated semiconductor package
- Patent number 7,230,328
- Issue date Jun 12, 2007
- NEC Corporation
- Ichiro Hazeyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same, circuit...
- Patent number 6,998,704
- Issue date Feb 14, 2006
- NEC Corporation
- Takao Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ENCAPSULATING PACKAGE, PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE AND...
- Publication number 20130291380
- Publication date Nov 7, 2013
- NEC Corporation
- TAKAO YAMAZAKI
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME, WIRING BOARD...
- Publication number 20130234295
- Publication date Sep 12, 2013
- RENESAS ELECTRONICS CORPORATION
- Yoshimichi Sogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, WIRING BOARD...
- Publication number 20110304029
- Publication date Dec 15, 2011
- Yoshimichi Sogawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ENCAPSULATING PACKAGE, PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE AND...
- Publication number 20110114840
- Publication date May 19, 2011
- Takao Yamazaki
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC DEVICE PACKAGE, MODULE, AND ELECTRONIC DEVICE
- Publication number 20100246144
- Publication date Sep 30, 2010
- NEC Corporation
- Takao Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE
- Publication number 20090174052
- Publication date Jul 9, 2009
- NEC Corporation
- Yoshimichi Sogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VACUUM PACKAGE AND MANUFACTURING PROCESS THEREOF
- Publication number 20090140146
- Publication date Jun 4, 2009
- NEC Corporation
- Yoshimichi SOGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Package Device, Module, and Electronic Apparatus
- Publication number 20090065921
- Publication date Mar 12, 2009
- NEC Corporation
- Takao Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacturing Same, Wiring Board...
- Publication number 20080224271
- Publication date Sep 18, 2008
- NEC Corporation
- Yoshimichi Sogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Manufacturing Method Thereof, Semiconducto...
- Publication number 20080001288
- Publication date Jan 3, 2008
- Yoshimichi Sogawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor device and method for manufacturing the same, circuit...
- Publication number 20060055053
- Publication date Mar 16, 2006
- NEC Corporation
- Takao Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and laminated semiconductor package
- Publication number 20060049495
- Publication date Mar 9, 2006
- NEC Corporation
- Ichiro Hazeyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same, circuit...
- Publication number 20040115920
- Publication date Jun 17, 2004
- NEC Corporation
- Takao Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS

Yoshimichi Sogawa

Person

Patents Grantslast 30 patents

Encapsulating package, printed circuit board, electronic device and...

Electronic device package, module, and electronic device

Electronic package device, module, and electronic apparatus

Vacuum package and manufacturing process thereof

Semiconductor device and method for manufacturing the same, circuit...

Semiconductor package and laminated semiconductor package

Semiconductor device and method for manufacturing the same, circuit...

Patents Applicationslast 30 patents

ENCAPSULATING PACKAGE, PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE AND...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME, WIRING BOARD...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, WIRING BOARD...

ENCAPSULATING PACKAGE, PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE AND...

ELECTRONIC DEVICE PACKAGE, MODULE, AND ELECTRONIC DEVICE

ELECTRONIC COMPONENT, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE

VACUUM PACKAGE AND MANUFACTURING PROCESS THEREOF

Electronic Package Device, Module, and Electronic Apparatus

Semiconductor Device and Method of Manufacturing Same, Wiring Board...

Semiconductor Device and Manufacturing Method Thereof, Semiconducto...

Semiconductor device and method for manufacturing the same, circuit...

Semiconductor package and laminated semiconductor package

Semiconductor device and method for manufacturing the same, circuit...