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Yoshinobu Maeno
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Kawasaki, JP
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Patents Grants
last 30 patents
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Patent Grant
Packaging structure for a semiconductor element flip-chip mounted o...
Patent number
6,222,738
Issue date
Apr 24, 2001
Fujitsu Limited
Yoshinobu Maeno
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
PRINTED CIRCUIT BOARD AND SOLDERING METHOD
Publication number
20160254241
Publication date
Sep 1, 2016
Fujitsu Limited
Yoshinobu MAENO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE UNIT, INFORMATION PROCESSOR AND METHOD OF MANUFACTURING S...
Publication number
20100101848
Publication date
Apr 29, 2010
Fujitsu Limited
Yoshinobu Maeno
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Patent Application
Electronic apparatus and mounting method
Publication number
20080205009
Publication date
Aug 28, 2008
Fujitsu Limited
Yoshinobu Maeno
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...