Number | Date | Country | Kind |
---|---|---|---|
9-287461 | Oct 1997 | JP |
Number | Name | Date | Kind |
---|---|---|---|
5386624 | George et al. | Feb 1995 | |
5628919 | Tomura et al. | May 1997 | |
5641996 | Omoya et al. | Jun 1997 | |
5856212 | Chun | Jan 1999 | |
5965948 | Okamoto | Oct 1999 |
Number | Date | Country |
---|---|---|
2-251146 | Oct 1990 | JP |
Entry |
---|
IBM Technical Disclosure Bulletin Bulletin “Unique Pad For Optimum Solder Application” Jun. 1991. |