Yoshinori TAKENAKA

Person

Ibi-gun, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,010,796
- Issue date Jun 11, 2024
- Ibiden Co., Ltd.
- Yoshinori Takenaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 11,715,698
- Issue date Aug 1, 2023
- Ibiden Co., Ltd.
- Tomoyuki Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board
- Patent number 10,271,426
- Issue date Apr 23, 2019
- Ibiden Co., Ltd.
- Hiroyasu Noto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 10,271,427
- Issue date Apr 23, 2019
- Ibiden Co., Ltd.
- Hiroyasu Noto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 10,070,511
- Issue date Sep 4, 2018
- Ibiden Co., Ltd.
- Yoshinori Takenaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing wiring board
- Patent number 9,888,581
- Issue date Feb 6, 2018
- Ibiden Co., Ltd.
- Yoshinori Takenaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing same
- Patent number 9,113,569
- Issue date Aug 18, 2015
- Ibiden Co., Ltd.
- Yoshinori Takenaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 8,993,894
- Issue date Mar 31, 2015
- Ibiden Co., Ltd.
- Hideyuki Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board and method for manufacturing multil...
- Patent number 8,853,552
- Issue date Oct 7, 2014
- Ibiden Co., Ltd.
- Yoshinori Takenaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 8,263,878
- Issue date Sep 11, 2012
- Ibiden Co., Ltd.
- Yoshinori Takenaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a multilayer printed wiring board
- Patent number 8,156,647
- Issue date Apr 17, 2012
- Ibiden Co., Ltd.
- Yoshinori Takenaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20230008582
- Publication date Jan 12, 2023
- IBIDEN CO., LTD.
- Yoshinori TAKENAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20230011786
- Publication date Jan 12, 2023
- IBIDEN CO., LTD.
- Yoshinori TAKENAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20220386461
- Publication date Dec 1, 2022
- IBIDEN CO., LTD.
- Yoshinori TAKENAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20220223532
- Publication date Jul 14, 2022
- IBIDEN CO., LTD.
- Tomoyuki IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20180213644
- Publication date Jul 26, 2018
- IBIDEN CO., LTD.
- Hiroyasu NOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20180084640
- Publication date Mar 22, 2018
- IBIDEN CO., LTD.
- Hiroyasu NOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20180084641
- Publication date Mar 22, 2018
- IBIDEN CO., LTD.
- Hiroyasu NOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180054885
- Publication date Feb 22, 2018
- IBIDEN CO., LTD.
- Yoshinori TAKENAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20150319866
- Publication date Nov 5, 2015
- IBIDEN CO., LTD.
- Yoshinori TAKENAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140116769
- Publication date May 1, 2014
- IBIDEN CO., LTD.
- Yoshinori Takenaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20120314389
- Publication date Dec 13, 2012
- IBIDEN CO., LTD.
- Yoshinori TAKENAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20120306608
- Publication date Dec 6, 2012
- IBIDEN CO., LTD.
- Yoshinori TAKENAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120250281
- Publication date Oct 4, 2012
- IBIDEN CO., LTD.
- Hideyuki KAWAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTIL...
- Publication number 20120073868
- Publication date Mar 29, 2012
- IBIDEN CO., LTD.
- Yoshinori TAKENAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTIL...
- Publication number 20100139968
- Publication date Jun 10, 2010
- IBIDEN CO., LTD.
- Yoshinori TAKENAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100006334
- Publication date Jan 14, 2010
- IBIDEN CO., LTD.
- Yoshinori Takenaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND ASSOCIATED MANUFACTURING METHODOLOGY
- Publication number 20090242261
- Publication date Oct 1, 2009
- IBIDEN CO., LTD.
- Yoshinori Takenaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Yoshinori TAKENAKA

Person

Patents Grantslast 30 patents

Wiring substrate and method for manufacturing wiring substrate

Wiring substrate

Printed wiring board

Printed wiring board

Wiring board and method for manufacturing the same

Method for manufacturing wiring board

Wiring board and method for manufacturing same

Printed wiring board and method for manufacturing the same

Multilayer printed wiring board and method for manufacturing multil...

Printed wiring board

Method for manufacturing a multilayer printed wiring board

Patents Applicationslast 30 patents

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

WIRING SUBSTRATE

PRINTED WIRING BOARD

PRINTED WIRING BOARD

PRINTED WIRING BOARD

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING SAME

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING SAME

WIRING BOARD AND METHOD FOR MANUFACTURING SAME

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTIL...

MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTIL...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD AND ASSOCIATED MANUFACTURING METHODOLOGY