Yoshio OKA

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Flexible printed circuit board and method of manufacturing flexible...
- Patent number 12,177,977
- Issue date Dec 24, 2024
- Sumitomo Electric Industries, Ltd.
- Koji Nitta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board and method of manufacturing same
- Patent number 11,950,365
- Issue date Apr 2, 2024
- Sumitomo Electric Industries, Ltd.
- Shoichiro Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board and method of manufacturing flexible...
- Patent number 11,889,624
- Issue date Jan 30, 2024
- Sumitomo Electric Printed Circuits, Inc.
- Yoshio Oka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board and method of manufacturing flexible...
- Patent number 11,696,401
- Issue date Jul 4, 2023
- Sumitomo Electric Industries, Ltd.
- Koji Nitta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board and method of manufacturing flexible...
- Patent number 11,659,662
- Issue date May 23, 2023
- Sumitomo Electric Industries, Ltd.
- Koji Nitta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board
- Patent number 11,483,928
- Issue date Oct 25, 2022
- Sumitomo Electric Printed Circuits, Inc.
- Yoshiro Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for printed circuit board, printed circuit board, and met...
- Patent number 11,375,615
- Issue date Jun 28, 2022
- Sumitomo Electric Industries, Ltd.
- Yuichiro Yamanaka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of making printed circuit board and laminated structure
- Patent number 11,343,918
- Issue date May 24, 2022
- Sumitomo Electric Industries, Ltd.
- Shigeaki Uemura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing flexible printed interconnect board
- Patent number 11,245,237
- Issue date Feb 8, 2022
- Sumitomo Electric Printed Circuits, Inc.
- Yoshiro Adachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit board
- Patent number 11,051,399
- Issue date Jun 29, 2021
- Sumitomo Electric Industries, Ltd.
- Yoshio Oka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Base material for printed circuit board and printed circuit board
- Patent number 11,013,113
- Issue date May 18, 2021
- Sumitomo Electric Industries, Ltd.
- Motohiko Sugiura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Board with terminal
- Patent number 10,965,046
- Issue date Mar 30, 2021
- Autonetworks Technologies, Ltd.
- Takanobu Shimada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin film, substrate for printed wiring board, and printed wiring...
- Patent number 10,889,086
- Issue date Jan 12, 2021
- Sumitomo Electric Industries, Ltd.
- Kayo Hashizume
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Base material for printed circuit board and printed circuit board
- Patent number 10,842,027
- Issue date Nov 17, 2020
- Sumitomo Electric Industries, Ltd.
- Kazuhiro Miyata
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Coating liquid for forming conductive layer, method for producing c...
- Patent number 10,796,812
- Issue date Oct 6, 2020
- Sumitomo Electric Industries, Ltd.
- Motohiko Sugiura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit board
- Patent number 10,709,016
- Issue date Jul 7, 2020
- Sumitomo Electric Industries, Ltd.
- Yoshio Oka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Powder for conductive material, ink for conductive material, conduc...
- Patent number 10,610,928
- Issue date Apr 7, 2020
- Sumitomo Electric Industries, Ltd.
- Issei Okada
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Substrate for printed circuit board and printed circuit board
- Patent number 10,596,782
- Issue date Mar 24, 2020
- Sumitomo Electric Industries, Ltd.
- Kayo Hashizume
- B32 - LAYERED PRODUCTS
Information Patent Grant
Metal powder, ink, sintered body, substrate for printed circuit boa...
- Patent number 10,307,825
- Issue date Jun 4, 2019
- Sumitomo Electric Industries, Ltd.
- Issei Okada
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Substrate for printed circuit board, printed circuit board, and met...
- Patent number 10,292,265
- Issue date May 14, 2019
- Sumitomo Electric Industries, Ltd.
- Takashi Kasuga
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Substrate for printed wiring board and method for producing the sam...
- Patent number 10,244,627
- Issue date Mar 26, 2019
- Sumitomo Electric Industries, Ltd.
- Kayo Hashizume
- B32 - LAYERED PRODUCTS
Information Patent Grant
Substrate for printed circuit board, printed circuit board, and met...
- Patent number 10,237,976
- Issue date Mar 19, 2019
- Sumitomo Electric Industries, Ltd.
- Takashi Kasuga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for printed circuit board, printed circuit board, and met...
- Patent number 10,225,931
- Issue date Mar 5, 2019
- Sumitomo Electric Industries, Ltd.
- Kayo Hashizume
- B32 - LAYERED PRODUCTS
Information Patent Grant
Substrate for printed circuit board and method for producing substr...
- Patent number 10,143,083
- Issue date Nov 27, 2018
- Sumitomo Electric Industries, Ltd.
- Motohiko Sugiura
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Substrate for printed circuit board, printed circuit board, and met...
- Patent number 10,076,028
- Issue date Sep 11, 2018
- Sumitomo Electric Industries, Ltd.
- Takashi Kasuga
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate for printed circuit board, printed circuit board, and met...
- Patent number 10,076,032
- Issue date Sep 11, 2018
- Sumitomo Electric Industries, Ltd.
- Takashi Kasuga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for printed circuit board, printed circuit board, and met...
- Patent number 9,967,976
- Issue date May 8, 2018
- Sumitomo Electric Industries, Ltd.
- Kazuhiro Miyata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 8,866,027
- Issue date Oct 21, 2014
- Sumitomo Electric Industries, Ltd.
- Yoshio Oka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive paste and multilayer printed wiring board using the same
- Patent number 8,617,688
- Issue date Dec 31, 2013
- Sumitomo Electric Industries, Ltd.
- Yoshio Oka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive paste and method for manufacturing multilayer printed wi...
- Patent number 8,597,459
- Issue date Dec 3, 2013
- Sumitomo Electric Industries, Ltd.
- Yoshio Oka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240251508
- Publication date Jul 25, 2024
- Sumitomo Electric Industries, Ltd.
- Masamichi YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COIL DEVICE
- Publication number 20240221998
- Publication date Jul 4, 2024
- Sumitomo Electric Industries, Ltd.
- Maki IKEBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD OF MANUFACTURING PRINTED WIRING BOARD
- Publication number 20240008175
- Publication date Jan 4, 2024
- Sumitomo Electric Industries, Ltd.
- Yoshio OKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING FLEXIBLE...
- Publication number 20230247763
- Publication date Aug 3, 2023
- Sumitomo Electric Industries, Ltd.
- Koji NITTA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING SAME
- Publication number 20220295637
- Publication date Sep 15, 2022
- Sumitomo Electric Industries, Ltd.
- Shoichiro SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING FLEXIBLE...
- Publication number 20210219425
- Publication date Jul 15, 2021
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Yoshio OKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING FLEXIBLE...
- Publication number 20210219424
- Publication date Jul 15, 2021
- Sumitomo Electric Industries, Ltd.
- Koji NITTA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING PRINTED CIRCUIT BOARD AND LAMINATED STRUCTURE
- Publication number 20210045250
- Publication date Feb 11, 2021
- Sumitomo Electric Industries, Ltd.
- Shigeaki UEMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING FLEXIBLE PRINTED INTERCONNECT BOARD
- Publication number 20210044067
- Publication date Feb 11, 2021
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Yoshiro ADACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20210037642
- Publication date Feb 4, 2021
- Sumitomo Electric Industries, Ltd.
- Yoshio OKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BASE MATERIAL FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD
- Publication number 20210022245
- Publication date Jan 21, 2021
- Sumitomo Electric Industries, Ltd.
- Motohiko SUGIURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN FILM, SUBSTRATE FOR PRINTED WIRING BOARD, AND PRINTED WIRING...
- Publication number 20200376810
- Publication date Dec 3, 2020
- Sumitomo Electric Industries, Ltd.
- Kayo HASHIZUME
- B32 - LAYERED PRODUCTS
Information Patent Application
BOARD WITH TERMINAL
- Publication number 20200366009
- Publication date Nov 19, 2020
- AUTONETWORKS TECHNOLOGIES, LTD.
- Takanobu SHIMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BASE MATERIAL FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD
- Publication number 20200288578
- Publication date Sep 10, 2020
- Sumitomo Electric Industries, Ltd.
- Kazuhiro MIYATA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20200214129
- Publication date Jul 2, 2020
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Yoshiro ADACHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20200113046
- Publication date Apr 9, 2020
- Sumitomo Electric Industries, Ltd.
- Yoshio OKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COATING LIQUID FOR FORMING CONDUCTIVE LAYER, METHOD FOR PRODUCING C...
- Publication number 20190077974
- Publication date Mar 14, 2019
- Sumitomo Electric Industries, Ltd.
- Motohiko SUGIURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POWDER FOR CONDUCTIVE MATERIAL, INK FOR CONDUCTIVE MATERIAL, CONDUC...
- Publication number 20190054524
- Publication date Feb 21, 2019
- Sumitomo Electric Industries, Ltd.
- Issei OKADA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
BASE FILM FOR PRINTED CIRCUIT BOARD, SUBSTRATE FOR PRINTED CIRCUIT...
- Publication number 20180371191
- Publication date Dec 27, 2018
- Sumitomo Electric Industries, Ltd.
- Kayo HASHIZUME
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
COATING DEVICE AND METHOD OF PRODUCING COATED SHEET
- Publication number 20180333739
- Publication date Nov 22, 2018
- Sumitomo Electric Industries, Ltd.
- Kazuhiro MIYATA
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
COATING LIQUID FOR FORMING CONDUCTIVE LAYER AND METHOD FOR MANUFACT...
- Publication number 20180315519
- Publication date Nov 1, 2018
- Sumitomo Electric Industries, Ltd.
- Motohiko SUGIURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING TITANIUM TRICHLORIDE SOLUTION AND DEVICE F...
- Publication number 20180305829
- Publication date Oct 25, 2018
- Sumitomo Electric Industries, Ltd.
- Issei OKADA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...
- Publication number 20180242450
- Publication date Aug 23, 2018
- Sumitomo Electric Industries, Ltd.
- Yuichiro YAMANAKA
- B32 - LAYERED PRODUCTS
Information Patent Application
SUBSTRATE FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD
- Publication number 20180147815
- Publication date May 31, 2018
- Sumitomo Electric Industries, Ltd.
- Kayo HASHIZUME
- B32 - LAYERED PRODUCTS
Information Patent Application
SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...
- Publication number 20180124925
- Publication date May 3, 2018
- Sumitomo Electric Industries, Ltd.
- Kayo HASHIZUME
- B32 - LAYERED PRODUCTS
Information Patent Application
METAL POWDER, INK, SINTERED BODY, SUBSTRATE FOR PRINTED CIRCUIT BOA...
- Publication number 20180015547
- Publication date Jan 18, 2018
- Sumitomo Electric Industries, Ltd.
- Issei OKADA
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...
- Publication number 20180014403
- Publication date Jan 11, 2018
- Sumitomo Electric Industries, Ltd.
- Takashi KASUGA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE FOR PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAM...
- Publication number 20170347464
- Publication date Nov 30, 2017
- Sumitomo Electric Industries, Ltd.
- Kayo HASHIZUME
- B32 - LAYERED PRODUCTS
Information Patent Application
SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...
- Publication number 20170347459
- Publication date Nov 30, 2017
- Sumitomo Electric Industries, Ltd.
- Kazuhiro MIYATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FOR PRINTED CIRCUIT BOARD AND METHOD FOR PRODUCING SUBSTR...
- Publication number 20170347449
- Publication date Nov 30, 2017
- Sumitomo Electric Industries, Ltd.
- Motohiko SUGIURA
- B82 - NANO-TECHNOLOGY

Person

Patents Grantslast 30 patents

Flexible printed circuit board and method of manufacturing flexible...

Flexible printed circuit board and method of manufacturing same

Flexible printed circuit board and method of manufacturing flexible...

Flexible printed circuit board and method of manufacturing flexible...

Flexible printed circuit board and method of manufacturing flexible...

Flexible printed circuit board

Substrate for printed circuit board, printed circuit board, and met...

Method of making printed circuit board and laminated structure

Method of manufacturing flexible printed interconnect board

Flexible printed circuit board

Base material for printed circuit board and printed circuit board

Board with terminal

Resin film, substrate for printed wiring board, and printed wiring...

Base material for printed circuit board and printed circuit board

Coating liquid for forming conductive layer, method for producing c...

Flexible printed circuit board

Powder for conductive material, ink for conductive material, conduc...

Substrate for printed circuit board and printed circuit board

Metal powder, ink, sintered body, substrate for printed circuit boa...

Substrate for printed circuit board, printed circuit board, and met...

Substrate for printed wiring board and method for producing the sam...

Substrate for printed circuit board, printed circuit board, and met...

Substrate for printed circuit board, printed circuit board, and met...

Substrate for printed circuit board and method for producing substr...

Substrate for printed circuit board, printed circuit board, and met...

Substrate for printed circuit board, printed circuit board, and met...

Substrate for printed circuit board, printed circuit board, and met...

Printed wiring board and method for manufacturing the same

Conductive paste and multilayer printed wiring board using the same

Conductive paste and method for manufacturing multilayer printed wi...

Patents Applicationslast 30 patents

PRINTED WIRING BOARD

COIL DEVICE

PRINTED WIRING BOARD AND METHOD OF MANUFACTURING PRINTED WIRING BOARD

FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING FLEXIBLE...

FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING SAME

FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING FLEXIBLE...

FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING FLEXIBLE...

METHOD OF MAKING PRINTED CIRCUIT BOARD AND LAMINATED STRUCTURE

METHOD OF MANUFACTURING FLEXIBLE PRINTED INTERCONNECT BOARD

FLEXIBLE PRINTED CIRCUIT BOARD

BASE MATERIAL FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD

RESIN FILM, SUBSTRATE FOR PRINTED WIRING BOARD, AND PRINTED WIRING...

BOARD WITH TERMINAL

BASE MATERIAL FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD

FLEXIBLE PRINTED CIRCUIT BOARD

FLEXIBLE PRINTED CIRCUIT BOARD

COATING LIQUID FOR FORMING CONDUCTIVE LAYER, METHOD FOR PRODUCING C...

POWDER FOR CONDUCTIVE MATERIAL, INK FOR CONDUCTIVE MATERIAL, CONDUC...

BASE FILM FOR PRINTED CIRCUIT BOARD, SUBSTRATE FOR PRINTED CIRCUIT...

COATING DEVICE AND METHOD OF PRODUCING COATED SHEET

COATING LIQUID FOR FORMING CONDUCTIVE LAYER AND METHOD FOR MANUFACT...

METHOD FOR MANUFACTURING TITANIUM TRICHLORIDE SOLUTION AND DEVICE F...

SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...

SUBSTRATE FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD

SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...

METAL POWDER, INK, SINTERED BODY, SUBSTRATE FOR PRINTED CIRCUIT BOA...

SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...

SUBSTRATE FOR PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAM...

SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...

SUBSTRATE FOR PRINTED CIRCUIT BOARD AND METHOD FOR PRODUCING SUBSTR...