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Yoshiyasu Ando
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Nishio, JP
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last 30 patents
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Patent Grant
Semiconductor pressure sensor and method for bonding semiconductor...
Patent number
4,986,861
Issue date
Jan 22, 1991
Nippon Soken, Inc.
Minoru Nishida
G01 - MEASURING TESTING
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Patent Grant
Semiconductor pressure sensor with method diaphragm
Patent number
4,840,067
Issue date
Jun 20, 1989
Nippon Soken, Inc.
Minoru Nishida
G01 - MEASURING TESTING