Yoshiyuki Nagatomo

Person

Saitama-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Bonded body, power module substrate, power module, method for manuf...
- Patent number 12,199,006
- Issue date Jan 14, 2025
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing bonded body for insulation circuit substrat...
- Patent number 11,908,768
- Issue date Feb 20, 2024
- Mitsubishi Materials Corporation
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing insulating circuit substrate with heat sink
- Patent number 11,735,434
- Issue date Aug 22, 2023
- Mitsubishi Materials Corporation
- Ryouhei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing power module substrate board and ceramic-co...
- Patent number 11,676,882
- Issue date Jun 13, 2023
- Mitsubishi Materials Corporation
- Takeshi Kitahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing bonded body, method for producing insulated ci...
- Patent number 11,478,868
- Issue date Oct 25, 2022
- Mitsubishi Materials Corporation
- Ryouhei Yumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulated heat transfer substrate, thermoelectric conversion module...
- Patent number 11,404,622
- Issue date Aug 2, 2022
- Mitsubishi Materials Corporation
- Koya Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded body, power module substrate, power module, method for manuf...
- Patent number 11,393,738
- Issue date Jul 19, 2022
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing insulating circuit board with heatsink
- Patent number 11,355,408
- Issue date Jun 7, 2022
- Mitsubishi Materials Corporation
- Takeshi Kitahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulation circuit board with heat sink
- Patent number 11,289,390
- Issue date Mar 29, 2022
- Mitsubishi Materials Corporation
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing bonded body for insulation circuit substrat...
- Patent number 11,289,400
- Issue date Mar 29, 2022
- Mitsubishi Materials Corporation
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded body, power module substrate, method for manufacturing bonde...
- Patent number 11,062,974
- Issue date Jul 13, 2021
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Insulated circuit board
- Patent number 11,013,107
- Issue date May 18, 2021
- Mitsubishi Materials Corporation
- Takeshi Kitahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ag underlayer-attached metallic member, Ag underlayer-attached insu...
- Patent number 10,734,297
- Issue date Aug 4, 2020
- Mitsubishi Materials Corporation
- Shuji Nishimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic-aluminum conjugate, power module substrate, and power module
- Patent number 10,607,907
- Issue date Mar 31, 2020
- Mitsubishi Materials Corporation
- Yoshirou Kuromitsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded body, power module substrate with heat sink, heat sink, meth...
- Patent number 10,600,719
- Issue date Mar 24, 2020
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoelectric conversion module and thermoelectric conversion device
- Patent number 10,573,798
- Issue date Feb 25, 2020
- Mitsubishi Materials Corporation
- Yoshinobu Nakada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic/aluminum joined body, insulating circuit board, power modul...
- Patent number 10,526,252
- Issue date Jan 7, 2020
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Semiconductor device
- Patent number 10,504,749
- Issue date Dec 10, 2019
- Mitsubishi Materials Corporation
- Shuji Nishimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded body, substrate for power module with heat sink, heat sink,...
- Patent number 10,497,585
- Issue date Dec 3, 2019
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded body, substrate for power module with heat sink, heat sink,...
- Patent number 10,497,637
- Issue date Dec 3, 2019
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module substrate
- Patent number 10,453,783
- Issue date Oct 22, 2019
- Mitsubishi Materials Corporation
- Toyo Ohashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded body, substrate for power module with heat sink, heat sink,...
- Patent number 10,410,951
- Issue date Sep 10, 2019
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing bonded body and process for producing power m...
- Patent number 10,370,303
- Issue date Aug 6, 2019
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module substrate, power module substrate with heat sink, powe...
- Patent number 10,375,825
- Issue date Aug 6, 2019
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded body, substrate for power module with heat sink, heat sink,...
- Patent number 10,319,664
- Issue date Jun 11, 2019
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded body, power module substrate with heat sink, heat sink, meth...
- Patent number 10,283,431
- Issue date May 7, 2019
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing bonded body and method for manufacturing p...
- Patent number 10,199,237
- Issue date Feb 5, 2019
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Bonded body and power module substrate
- Patent number 10,173,282
- Issue date Jan 8, 2019
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper-ceramic bonded body and power module substrate
- Patent number 10,103,035
- Issue date Oct 16, 2018
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu/ceramic bonded body, method for manufacturing Cu/ceramic bonded...
- Patent number 10,016,956
- Issue date Jul 10, 2018
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COPPER ALLOY POWDER
- Publication number 20250051882
- Publication date Feb 13, 2025
- MITSUBISHI MATERIALS CORPORATION
- Yuki Ito
- B22 - CASTING POWDER METALLURGY
Information Patent Application
ANTIMICROBIAL MEMBER
- Publication number 20230115585
- Publication date Apr 13, 2023
- MITSUBISHI MATERIALS CORPORATION
- Yuki Ito
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
BONDED BODY, POWER MODULE SUBSTRATE, POWER MODULE, METHOD FOR MANUF...
- Publication number 20220278019
- Publication date Sep 1, 2022
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki TERASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOELECTRIC CONVERSION MODULE
- Publication number 20220181533
- Publication date Jun 9, 2022
- MITSUBISHI MATERIALS CORPORATION
- Koya Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING BONDED BODY FOR INSULATION CIRCUIT SUBSTRAT...
- Publication number 20220173010
- Publication date Jun 2, 2022
- MITSUBISHI MATERIALS CORPORATION
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOELECTRIC CONVERSION MODULE AND METHOD FOR PRODUCING THERMOELE...
- Publication number 20210265552
- Publication date Aug 26, 2021
- MITSUBISHI MATERIALS CORPORATION
- Koya Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATED HEAT TRANSFER SUBSTRATE, THERMOELECTRIC CONVERSION MODULE...
- Publication number 20210175401
- Publication date Jun 10, 2021
- MITSUBISHI MATERIALS CORPORATION
- Koya Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING INSULATING CIRCUIT SUBSTRATE WITH HEAT SINK
- Publication number 20210134609
- Publication date May 6, 2021
- MITSUBISHI MATERIALS CORPORATION
- Ryouhei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION CIRCUIT BOARD WITH HEAT SINK
- Publication number 20210118769
- Publication date Apr 22, 2021
- MITSUBISHI MATERIALS CORPORATION
- Ryohei YUMOTO
- B32 - LAYERED PRODUCTS
Information Patent Application
THERMOELECTRIC CONVERSION MODULE AND METHOD FOR PRODUCING THERMOELE...
- Publication number 20210111327
- Publication date Apr 15, 2021
- MITSUBISHI MATERIALS CORPORATION
- Koya Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, POWE...
- Publication number 20210068251
- Publication date Mar 4, 2021
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING POWER MODULE SUBSTRATE BOARD AND CERAMIC-CO...
- Publication number 20210050278
- Publication date Feb 18, 2021
- MITSUBISHI MATERIALS CORPORATION
- Takeshi Kitahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED BODY, POWER MODULE SUBSTRATE, POWER MODULE, METHOD FOR MANUF...
- Publication number 20210043540
- Publication date Feb 11, 2021
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki TERASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING BONDED BODY FOR INSULATION CIRCUIT SUBSTRAT...
- Publication number 20210028086
- Publication date Jan 28, 2021
- MITSUBISHI MATERIALS CORPORATION
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION CIRCUIT BOARD WITH HEAT SINK
- Publication number 20210020530
- Publication date Jan 21, 2021
- MITSUBISHI MATERIALS CORPORATION
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING INSULATING CIRCUIT BOARD WITH HEATSINK
- Publication number 20210020536
- Publication date Jan 21, 2021
- MITSUBISHI MATERIALS CORPORATION
- Takeshi Kitahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATED CIRCUIT BOARD
- Publication number 20210007217
- Publication date Jan 7, 2021
- MITSUBISHI MATERIALS CORPORATION
- Takeshi Kitahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATED CIRCUIT BOARD
- Publication number 20200413534
- Publication date Dec 31, 2020
- MITSUBISHI MATERIALS CORPORATION
- Takeshi Kitahara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING BONDED BODY, METHOD FOR PRODUCING INSULATED CI...
- Publication number 20200009671
- Publication date Jan 9, 2020
- MITSUBISHI MATERIALS CORPORATION
- Ryouhei Yumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER MODULE SUBSTRATE
- Publication number 20190189548
- Publication date Jun 20, 2019
- MITSUBISHI MATERIALS CORPORATION
- Toyo OHASHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOELECTRIC CONVERSION MODULE AND THERMOELECTRIC CONVERSION DEVICE
- Publication number 20190044042
- Publication date Feb 7, 2019
- MITSUBISHI MATERIALS CORPORATION
- Yoshinobu Nakada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED BODY, POWER MODULE SUBSTRATE, METHOD FOR MANUFACTURING BONDE...
- Publication number 20190035710
- Publication date Jan 31, 2019
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Ag UNDERLAYER- ATTACHED METALLIC MEMBER, Ag UNDERLAYER- ATTACHED IN...
- Publication number 20190035703
- Publication date Jan 31, 2019
- MITSUBISHI MATERIALS CORPORATION
- Shuji Nishimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190027380
- Publication date Jan 24, 2019
- MITSUBISHI MATERIALS CORPORATION
- Shuji Nishimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC/ALUMINUM JOINED BODY, INSULATING CIRCUIT BOARD, POWER MODUL...
- Publication number 20180346387
- Publication date Dec 6, 2018
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
CERAMIC-ALUMINUM CONJUGATE, POWER MODULE SUBSTRATE, AND POWER MODULE
- Publication number 20180323122
- Publication date Nov 8, 2018
- MITSUBISHI MATERIALS CORPORATION
- Yoshirou Kuromitsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDED BODY, SUBSTRATE FOR POWER MODULE WITH HEAT SINK, HEAT SINK,...
- Publication number 20180108593
- Publication date Apr 19, 2018
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDED BODY, SUBSTRATE FOR POWER MODULE WITH HEAT SINK, HEAT SINK,...
- Publication number 20180090413
- Publication date Mar 29, 2018
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki TERASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED BODY, SUBSTRATE FOR POWER MODULE WITH HEAT SINK, HEAT SINK,...
- Publication number 20180068871
- Publication date Mar 8, 2018
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki TERASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR JUNCTION, MANUFACTURING METHOD FOR SUBSTRA...
- Publication number 20180040533
- Publication date Feb 8, 2018
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki TERASAKI
- H01 - BASIC ELECTRIC ELEMENTS

Yoshiyuki Nagatomo

Person

Patents Grantslast 30 patents

Bonded body, power module substrate, power module, method for manuf...

Method of manufacturing bonded body for insulation circuit substrat...

Method for producing insulating circuit substrate with heat sink

Method of manufacturing power module substrate board and ceramic-co...

Method for producing bonded body, method for producing insulated ci...

Insulated heat transfer substrate, thermoelectric conversion module...

Bonded body, power module substrate, power module, method for manuf...

Method of manufacturing insulating circuit board with heatsink

Insulation circuit board with heat sink

Method of manufacturing bonded body for insulation circuit substrat...

Bonded body, power module substrate, method for manufacturing bonde...

Insulated circuit board

Ag underlayer-attached metallic member, Ag underlayer-attached insu...

Ceramic-aluminum conjugate, power module substrate, and power module

Bonded body, power module substrate with heat sink, heat sink, meth...

Thermoelectric conversion module and thermoelectric conversion device

Ceramic/aluminum joined body, insulating circuit board, power modul...

Semiconductor device

Bonded body, substrate for power module with heat sink, heat sink,...

Bonded body, substrate for power module with heat sink, heat sink,...

Power module substrate

Bonded body, substrate for power module with heat sink, heat sink,...

Process for producing bonded body and process for producing power m...

Power module substrate, power module substrate with heat sink, powe...

Bonded body, substrate for power module with heat sink, heat sink,...

Bonded body, power module substrate with heat sink, heat sink, meth...

Method for manufacturing bonded body and method for manufacturing p...

Bonded body and power module substrate

Copper-ceramic bonded body and power module substrate

Cu/ceramic bonded body, method for manufacturing Cu/ceramic bonded...

Patents Applicationslast 30 patents

COPPER ALLOY POWDER

ANTIMICROBIAL MEMBER

BONDED BODY, POWER MODULE SUBSTRATE, POWER MODULE, METHOD FOR MANUF...

THERMOELECTRIC CONVERSION MODULE

METHOD OF MANUFACTURING BONDED BODY FOR INSULATION CIRCUIT SUBSTRAT...

THERMOELECTRIC CONVERSION MODULE AND METHOD FOR PRODUCING THERMOELE...

INSULATED HEAT TRANSFER SUBSTRATE, THERMOELECTRIC CONVERSION MODULE...

METHOD FOR PRODUCING INSULATING CIRCUIT SUBSTRATE WITH HEAT SINK

INSULATION CIRCUIT BOARD WITH HEAT SINK

THERMOELECTRIC CONVERSION MODULE AND METHOD FOR PRODUCING THERMOELE...

POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, POWE...

METHOD OF MANUFACTURING POWER MODULE SUBSTRATE BOARD AND CERAMIC-CO...

BONDED BODY, POWER MODULE SUBSTRATE, POWER MODULE, METHOD FOR MANUF...

METHOD OF MANUFACTURING BONDED BODY FOR INSULATION CIRCUIT SUBSTRAT...

INSULATION CIRCUIT BOARD WITH HEAT SINK

METHOD OF MANUFACTURING INSULATING CIRCUIT BOARD WITH HEATSINK

INSULATED CIRCUIT BOARD

INSULATED CIRCUIT BOARD

METHOD FOR PRODUCING BONDED BODY, METHOD FOR PRODUCING INSULATED CI...

POWER MODULE SUBSTRATE

THERMOELECTRIC CONVERSION MODULE AND THERMOELECTRIC CONVERSION DEVICE

BONDED BODY, POWER MODULE SUBSTRATE, METHOD FOR MANUFACTURING BONDE...

Ag UNDERLAYER- ATTACHED METALLIC MEMBER, Ag UNDERLAYER- ATTACHED IN...

SEMICONDUCTOR DEVICE

CERAMIC/ALUMINUM JOINED BODY, INSULATING CIRCUIT BOARD, POWER MODUL...

CERAMIC-ALUMINUM CONJUGATE, POWER MODULE SUBSTRATE, AND POWER MODULE

BONDED BODY, SUBSTRATE FOR POWER MODULE WITH HEAT SINK, HEAT SINK,...

BONDED BODY, SUBSTRATE FOR POWER MODULE WITH HEAT SINK, HEAT SINK,...

BONDED BODY, SUBSTRATE FOR POWER MODULE WITH HEAT SINK, HEAT SINK,...

MANUFACTURING METHOD FOR JUNCTION, MANUFACTURING METHOD FOR SUBSTRA...