Yoshiyuki Satoh

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Compression-bonding apparatus
- Patent number 8,381,963
- Issue date Feb 26, 2013
- Fujitsu Limited
- Kimio Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic part with affixed MEMS
- Patent number 8,169,075
- Issue date May 1, 2012
- Fujitsu Limited
- Tetsuya Takahashi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic apparatus manufacturing method
- Patent number 7,687,314
- Issue date Mar 30, 2010
- Fujitsu Limited
- Shuichi Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT AND MANUFACTURE METHOD THEREOF
- Publication number 20130249087
- Publication date Sep 26, 2013
- Fujitsu Limited
- Kimio Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, PORTABLE ELECTRONIC TERMINAL, AND METHOD OF MANU...
- Publication number 20120230001
- Publication date Sep 13, 2012
- Fujitsu Limited
- Tetsuya TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE
- Publication number 20120080219
- Publication date Apr 5, 2012
- Fujitsu Limited
- Shuichi TAKEUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, CIRCUIT BOARD, AND MANUFACTURING METHOD OF ELECT...
- Publication number 20120080220
- Publication date Apr 5, 2012
- Fujitsu Limited
- Kimio NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD
- Publication number 20110079896
- Publication date Apr 7, 2011
- Fujitsu Limited
- Yoshiyuki Satoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND MANUFACTURE METHOD THEREOF
- Publication number 20100327435
- Publication date Dec 30, 2010
- FUJITSU LIMITED
- Kimio Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPRESSION-BONDING APPARATUS
- Publication number 20100327043
- Publication date Dec 30, 2010
- FUJITSU LIMITED
- Kimio NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PART WITH AFFIXED MEMS
- Publication number 20090243006
- Publication date Oct 1, 2009
- FUJITSU LIMITED
- Tetsuya TAKAHASHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC APPARATUS MANUFACTURING METHOD
- Publication number 20090170245
- Publication date Jul 2, 2009
- FUJITSU LIMITED
- Shuichi TAKEUCHI
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Yoshiyuki Satoh

Person

Patents Grantslast 30 patents

Compression-bonding apparatus

Electronic part with affixed MEMS

Electronic apparatus manufacturing method

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT AND MANUFACTURE METHOD THEREOF

ELECTRONIC DEVICE, PORTABLE ELECTRONIC TERMINAL, AND METHOD OF MANU...

METHOD OF MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE

ELECTRONIC DEVICE, CIRCUIT BOARD, AND MANUFACTURING METHOD OF ELECT...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD

ELECTRONIC COMPONENT AND MANUFACTURE METHOD THEREOF

COMPRESSION-BONDING APPARATUS

ELECTRONIC PART WITH AFFIXED MEMS

ELECTRONIC APPARATUS MANUFACTURING METHOD