Yoshiyuki Tsuru

Person

Shimodate, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Optical circuit board and method of manufacturing the same
- Patent number 6,529,650
- Issue date Mar 4, 2003
- Hitachi Chemical Company, Ltd.
- Yoshiyuki Tsuru
- G02 - OPTICS
Information Patent Grant
Substrate for mounting semiconductor chips
- Patent number 6,281,450
- Issue date Aug 28, 2001
- Hitachi Chemical Company, Ltd.
- Naoyuki Urasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component parts device
- Patent number 6,184,577
- Issue date Feb 6, 2001
- Hitachi Chemical Company, Ltd.
- Kenzo Takemura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit boards using heat resistant resin for adhesive layers
- Patent number 6,121,553
- Issue date Sep 19, 2000
- Hitachi Chemical Company, Ltd.
- Eiichi Shinada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple wire printed circuit board and process for making the same
- Patent number 6,042,685
- Issue date Mar 28, 2000
- Hitachi Chemical Company, Ltd.
- Eiichi Shinada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition and its use in production of multilayer printed c...
- Patent number 5,935,452
- Issue date Aug 10, 1999
- Hitachi Chemical Company, Ltd.
- Teiichi Inada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Heat resistant resin composition and adhesive sheet using the same
- Patent number 5,932,351
- Issue date Aug 3, 1999
- Hitachi Chemical Company, Ltd.
- Eiichi Shinada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Multiple wire printed circuit board and process for making the same
- Patent number 5,928,757
- Issue date Jul 27, 1999
- Hitachi Chemical Company, Ltd.
- Eiichi Shinada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip fuse and process for production thereof
- Patent number 5,914,649
- Issue date Jun 22, 1999
- Hitachi Chemical Company, Ltd.
- Tadashi Isono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing multilayer printed circuit board for wire bon...
- Patent number 5,879,568
- Issue date Mar 9, 1999
- Hitachi, Ltd.
- Naoyuki Urasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer printed circuit board with epoxy resin and carboxylated...
- Patent number 5,874,009
- Issue date Feb 23, 1999
- Hitachi Chemical Company, Ltd.
- Teiichi Inada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for producing multilayer printed circuit board
- Patent number 5,690,837
- Issue date Nov 25, 1997
- Hitachi Chemical Company, Ltd.
- Akishi Nakaso
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board
- Patent number 5,688,408
- Issue date Nov 18, 1997
- Hitachi Chemical Company Ltd.
- Yoshiyuki Tsuru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer printed wiring board
- Patent number 5,562,971
- Issue date Oct 8, 1996
- Hitachi Chemical Company, Ltd.
- Yoshiyuki Tsuru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-organic macromolecular synthetic resin composite and process...
- Patent number 5,178,962
- Issue date Jan 12, 1993
- Hitachi, Ltd.
- Toshio Miyamoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Process for forming metallic film on inorganic material
- Patent number 4,842,899
- Issue date Jun 27, 1989
- Hitachi Chemical Co., Ltd.
- Yoshiyuki Tsuru
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless copper deposition solution
- Patent number 4,548,644
- Issue date Oct 22, 1985
- Hitachi Chemical Company, Ltd.
- Akishi Nakaso
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of producing a multistylus head device
- Patent number 4,219,927
- Issue date Sep 2, 1980
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Yoshiyuki Tsuru

Person

Patents Grantslast 30 patents

Optical circuit board and method of manufacturing the same

Substrate for mounting semiconductor chips

Electronic component parts device

Circuit boards using heat resistant resin for adhesive layers

Multiple wire printed circuit board and process for making the same

Resin composition and its use in production of multilayer printed c...

Heat resistant resin composition and adhesive sheet using the same

Multiple wire printed circuit board and process for making the same

Chip fuse and process for production thereof

Process for producing multilayer printed circuit board for wire bon...

Multilayer printed circuit board with epoxy resin and carboxylated...

Process for producing multilayer printed circuit board

Multilayer printed wiring board

Multilayer printed wiring board

Metal-organic macromolecular synthetic resin composite and process...

Process for forming metallic film on inorganic material

Electroless copper deposition solution

Method of producing a multistylus head device