Yosuke Kanaoka

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Embedded die microelectronic device with molded component
- Patent number 12,087,700
- Issue date Sep 10, 2024
- Intel Corporation
- Srinivas Venkata Ramanuja Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patternable die attach materials and processes for patterning
- Patent number 11,923,312
- Issue date Mar 5, 2024
- Intel Corporation
- Bai Nie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including bridges
- Patent number 11,923,307
- Issue date Mar 5, 2024
- Intel Corporation
- Bai Nie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric filler material in conductive material that functions as...
- Patent number 11,527,484
- Issue date Dec 13, 2022
- Intel Corporation
- Jesse C. Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die microelectronic device with molded component
- Patent number 11,081,448
- Issue date Aug 3, 2021
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die placement and coupling apparatus
- Patent number 11,062,933
- Issue date Jul 13, 2021
- Intel Corporation
- Jesse C. Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric filler material in conductive material that functions as...
- Patent number 10,847,471
- Issue date Nov 24, 2020
- Intel Corporation
- Jesse C. Jones
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND APPARATUS TO CONNECT INTERCONNECT BRIDGES TO PACKAGE SU...
- Publication number 20250112161
- Publication date Apr 3, 2025
- Intel Corporation
- Minglu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP CAVITY METALLIZATION AND FIDUCIAL ARRANGEMENTS FOR EMBEDDED DI...
- Publication number 20250112162
- Publication date Apr 3, 2025
- Intel Corporation
- Zheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILIC...
- Publication number 20250105209
- Publication date Mar 27, 2025
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILIC...
- Publication number 20250105222
- Publication date Mar 27, 2025
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING A PHOTOIMAGEABLE DIELECTRIC FO...
- Publication number 20250006645
- Publication date Jan 2, 2025
- Intel Corporation
- Xiao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR REAL-TIME OFFSET ADJUSTMENT OF A SEMICONDUCTO...
- Publication number 20240312819
- Publication date Sep 19, 2024
- Intel Corporation
- Hong Seung YEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURES WITH HETEROGENEOUS INTEGRATION OF VARIOUS DEV...
- Publication number 20240222219
- Publication date Jul 4, 2024
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU UV CURE PLACEMENT TOOL FOR ROOM TEMPERATURE CHIP/GLASS DEVI...
- Publication number 20240186279
- Publication date Jun 6, 2024
- Intel Corporation
- Minglu LIU
- B32 - LAYERED PRODUCTS
Information Patent Application
OVERLYING FIDUCIAL DESIGN FOR GLASS PLACEMENT ACCURACY IMPROVEMENT
- Publication number 20240178151
- Publication date May 30, 2024
- Intel Corporation
- Minglu LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECTLY COUPLED OPTICAL INTERPOSER
- Publication number 20240111090
- Publication date Apr 4, 2024
- Intel Corporation
- Robert A. May
- G02 - OPTICS
Information Patent Application
PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING
- Publication number 20240088052
- Publication date Mar 14, 2024
- Intel Corporation
- Bai NIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR IMPROVED FIDUCIAL MARKER DETECTION
- Publication number 20240078702
- Publication date Mar 7, 2024
- Intel Corporation
- Yi LI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DAM SURROUNDING A DIE ON A SUBSTRATE
- Publication number 20230086920
- Publication date Mar 23, 2023
- Intel Corporation
- Liang HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO EMBED HOST DIES IN A SUBSTRATE
- Publication number 20230092903
- Publication date Mar 23, 2023
- Intel Corporation
- Sameer Paital
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIDUCIAL FOR AN ELECTRONIC DEVICE
- Publication number 20230089684
- Publication date Mar 23, 2023
- Intel Corporation
- Yosuke Kanaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS TO MINIMIZE DIE SHIFT IN EMBEDDED HETEROGENEOUS...
- Publication number 20230078395
- Publication date Mar 16, 2023
- Intel Corporation
- Robin Mcree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- Publication number 20210391263
- Publication date Dec 16, 2021
- Intel Corporation
- Bai Nie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DIE MICROELECTRONIC DEVICE WITH MOLDED COMPONENT
- Publication number 20210366835
- Publication date Nov 25, 2021
- Intel Corporation
- Srinivas Venkata Ramanuja Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC FILLER MATERIAL IN CONDUCTIVE MATERIAL THAT FUNCTIONS AS...
- Publication number 20210043580
- Publication date Feb 11, 2021
- Intel Corporation
- Jesse C. Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING
- Publication number 20200312771
- Publication date Oct 1, 2020
- Intel Corporation
- Bai NIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIDUCIAL FOR AN ELECTRONIC DEVICE
- Publication number 20200027841
- Publication date Jan 23, 2020
- Intel Corporation
- Jesse C. Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PLACEMENT AND COUPLING APPARATUS
- Publication number 20200027775
- Publication date Jan 23, 2020
- Intel Corporation
- Jesse C. Jones
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
EMBEDDED DIE MICROELECTRONIC DEVICE WITH MOLDED COMPONENT
- Publication number 20190333861
- Publication date Oct 31, 2019
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS

Yosuke Kanaoka

Person

Patents Grantslast 30 patents

Embedded die microelectronic device with molded component

Patternable die attach materials and processes for patterning

Microelectronic structures including bridges

Dielectric filler material in conductive material that functions as...

Embedded die microelectronic device with molded component

Die placement and coupling apparatus

Dielectric filler material in conductive material that functions as...

Patents Applicationslast 30 patents

METHODS AND APPARATUS TO CONNECT INTERCONNECT BRIDGES TO PACKAGE SU...

DEEP CAVITY METALLIZATION AND FIDUCIAL ARRANGEMENTS FOR EMBEDDED DI...

HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILIC...

HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILIC...

MICROELECTRONIC ASSEMBLIES INCLUDING A PHOTOIMAGEABLE DIELECTRIC FO...

DEVICE AND METHOD FOR REAL-TIME OFFSET ADJUSTMENT OF A SEMICONDUCTO...

PACKAGE ARCHITECTURES WITH HETEROGENEOUS INTEGRATION OF VARIOUS DEV...

IN-SITU UV CURE PLACEMENT TOOL FOR ROOM TEMPERATURE CHIP/GLASS DEVI...

OVERLYING FIDUCIAL DESIGN FOR GLASS PLACEMENT ACCURACY IMPROVEMENT

DIRECTLY COUPLED OPTICAL INTERPOSER

PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING

DEVICE AND METHOD FOR IMPROVED FIDUCIAL MARKER DETECTION

DAM SURROUNDING A DIE ON A SUBSTRATE

METHODS AND APPARATUS TO EMBED HOST DIES IN A SUBSTRATE

FIDUCIAL FOR AN ELECTRONIC DEVICE

DEVICES AND METHODS TO MINIMIZE DIE SHIFT IN EMBEDDED HETEROGENEOUS...

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

EMBEDDED DIE MICROELECTRONIC DEVICE WITH MOLDED COMPONENT

DIELECTRIC FILLER MATERIAL IN CONDUCTIVE MATERIAL THAT FUNCTIONS AS...

PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING

FIDUCIAL FOR AN ELECTRONIC DEVICE

DIE PLACEMENT AND COUPLING APPARATUS

EMBEDDED DIE MICROELECTRONIC DEVICE WITH MOLDED COMPONENT