You Ge

Person

Tianjin, CN

People

Patents Grantslast 30 patents

Information Patent Grant
QFN semiconductor package, semiconductor package and lead frame
- Patent number 12,051,642
- Issue date Jul 30, 2024
- NXP USA, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity formed in a molding compound of a semiconductor package to r...
- Patent number 11,984,408
- Issue date May 14, 2024
- NXP USA, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power die package
- Patent number 11,515,238
- Issue date Nov 29, 2022
- NXP USA, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making flexible semiconductor device with graphene tape
- Patent number 11,456,188
- Issue date Sep 27, 2022
- NXP USA, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with lead frame that accommodates various die...
- Patent number 11,171,077
- Issue date Nov 9, 2021
- NXP USA, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible semiconductor device with graphene tape
- Patent number 10,692,802
- Issue date Jun 23, 2020
- NXP USA, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and lead frame with high density lead array
- Patent number 10,217,697
- Issue date Feb 26, 2019
- NXP B.V.
- Zhijie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Woven signal-routing substrate for wearable electronic devices
- Patent number 10,041,195
- Issue date Aug 7, 2018
- NXP USA, INC.
- You Ge
- D10 - INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEX...
Information Patent Grant
IC package having non-horizontal die pad and flexible substrate the...
- Patent number 9,548,255
- Issue date Jan 17, 2017
- FREESCALE SEMICONDUCTOR, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with heat spreader
- Patent number 9,484,289
- Issue date Nov 1, 2016
- FREESCALE SEMICONDUCTOR, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with deflecting tie bar for IC package
- Patent number 9,449,901
- Issue date Sep 20, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Zhijie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package having non-horizontal die pad and lead frame therefor
- Patent number 9,379,035
- Issue date Jun 28, 2016
- FREESCALE SEMICONDUCTOR, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with heat-dissipating lead frame
- Patent number 9,355,945
- Issue date May 31, 2016
- FREESCALE SEMICONDUCTOR, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with stress relief and heat spreader
- Patent number 9,196,576
- Issue date Nov 24, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Kai Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with tube based heat spreader
- Patent number 9,190,343
- Issue date Nov 17, 2015
- FREESCALE SEMICONDUCTOR, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame based semiconductor device with routing substrate
- Patent number 8,980,690
- Issue date Mar 17, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Penglin Mei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with integral heat sink
- Patent number 8,901,722
- Issue date Dec 2, 2014
- FREESCALE SEMICONDUCTOR, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with staggered leads
- Patent number 8,643,153
- Issue date Feb 4, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Shunan Qiu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
QFN PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MAKING THEREOF
- Publication number 20250006596
- Publication date Jan 2, 2025
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING
- Publication number 20240413030
- Publication date Dec 12, 2024
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
- Publication number 20240413065
- Publication date Dec 12, 2024
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY FORMED IN A MOLDING COMPOUND OF A SEMICONDUCTOR PACKAGE TO R...
- Publication number 20230124619
- Publication date Apr 20, 2023
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING
- Publication number 20230110402
- Publication date Apr 13, 2023
- NXP USA, Inc.
- YOU GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE QFN PACKAGE AND METHOD OF MAKING THEREOF
- Publication number 20230115182
- Publication date Apr 13, 2023
- NXP USA, Inc.
- Meng Kong Lye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Type of bumpless and wireless semiconductor device
- Publication number 20230097173
- Publication date Mar 30, 2023
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE, LEADFRAME AND METHOD FOR IMPROVED BO...
- Publication number 20230068886
- Publication date Mar 2, 2023
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QFN SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE AND LEAD FRAME
- Publication number 20220077052
- Publication date Mar 10, 2022
- NXP USA, Inc.
- YOU GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH LEAD FRAME THAT ACCOMMODATES VARIOUS DIE...
- Publication number 20210013137
- Publication date Jan 14, 2021
- NXP USA, Inc.
- YOU GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DIE PACKAGE
- Publication number 20200411423
- Publication date Dec 31, 2020
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE SEMICONDUCTOR DEVICE WITH GRAPHENE TAPE
- Publication number 20200312751
- Publication date Oct 1, 2020
- NXP USA, Inc.
- YOU GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND LEAD FRAME WITH HIGH DENSITY LEAD ARRAY
- Publication number 20180102305
- Publication date Apr 12, 2018
- NXP USA, Inc.
- ZHIJIE WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE SEMICONDUCTOR DEVICE WITH GRAPHENE TAPE
- Publication number 20170358525
- Publication date Dec 14, 2017
- NXP USA, Inc.
- YOU GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WOVEN SIGNAL-ROUTING SUBSTRATE FOR WEARABLE ELECTRONIC DEVICES
- Publication number 20170009387
- Publication date Jan 12, 2017
- FREESCALE SEMICONDUCTOR, INC.
- You Ge
- D03 - WEAVING
Information Patent Application
LEAD FRAME WITH DEFLECTING TIE BAR FOR IC PACKAGE
- Publication number 20160293526
- Publication date Oct 6, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Zhijie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH HEAT SPREADER
- Publication number 20150108625
- Publication date Apr 23, 2015
- FREESCALE SEMICONDUCTOR, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH STRESS RELIEF AND HEAT SPREADER
- Publication number 20150084169
- Publication date Mar 26, 2015
- Kai Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTEGRAL HEAT SINK
- Publication number 20140239476
- Publication date Aug 28, 2014
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH STAGGERED LEADS
- Publication number 20120286406
- Publication date Nov 15, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Shunan QIU
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

QFN semiconductor package, semiconductor package and lead frame

Cavity formed in a molding compound of a semiconductor package to r...

Power die package

Method of making flexible semiconductor device with graphene tape

Semiconductor device with lead frame that accommodates various die...

Flexible semiconductor device with graphene tape

Semiconductor device and lead frame with high density lead array

Woven signal-routing substrate for wearable electronic devices

IC package having non-horizontal die pad and flexible substrate the...

Semiconductor device with heat spreader

Lead frame with deflecting tie bar for IC package

IC package having non-horizontal die pad and lead frame therefor

Semiconductor device with heat-dissipating lead frame

Semiconductor package with stress relief and heat spreader

Semiconductor device with tube based heat spreader

Lead frame based semiconductor device with routing substrate

Semiconductor device with integral heat sink

Semiconductor device with staggered leads

Patents Applicationslast 30 patents

QFN PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MAKING THEREOF

PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING

PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME

CAVITY FORMED IN A MOLDING COMPOUND OF A SEMICONDUCTOR PACKAGE TO R...

SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING

SEMICONDUCTOR DEVICE QFN PACKAGE AND METHOD OF MAKING THEREOF

Type of bumpless and wireless semiconductor device

PACKAGED SEMICONDUCTOR DEVICE, LEADFRAME AND METHOD FOR IMPROVED BO...

QFN SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE AND LEAD FRAME

SEMICONDUCTOR DEVICE WITH LEAD FRAME THAT ACCOMMODATES VARIOUS DIE...

POWER DIE PACKAGE

FLEXIBLE SEMICONDUCTOR DEVICE WITH GRAPHENE TAPE

SEMICONDUCTOR DEVICE AND LEAD FRAME WITH HIGH DENSITY LEAD ARRAY

FLEXIBLE SEMICONDUCTOR DEVICE WITH GRAPHENE TAPE

WOVEN SIGNAL-ROUTING SUBSTRATE FOR WEARABLE ELECTRONIC DEVICES

LEAD FRAME WITH DEFLECTING TIE BAR FOR IC PACKAGE

SEMICONDUCTOR DEVICE WITH HEAT SPREADER

SEMICONDUCTOR PACKAGE WITH STRESS RELIEF AND HEAT SPREADER

SEMICONDUCTOR DEVICE WITH INTEGRAL HEAT SINK

SEMICONDUCTOR DEVICE WITH STAGGERED LEADS