You-Hsien LIN

Person

Hefei, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Signal transmission circuit and method, and integrated circuit (IC)
- Patent number 11,994,553
- Issue date May 28, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- You-Hsien Lin
- G01 - MEASURING TESTING
Information Patent Grant
Tester and method for calibrating probe card and device under testi...
- Patent number 11,852,657
- Issue date Dec 26, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- You-Hsien Lin
- G01 - MEASURING TESTING
Information Patent Grant
Through-silicon via detecting circuit, detecting methods and integr...
- Patent number 11,614,481
- Issue date Mar 28, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- You-Hsien Lin
- G01 - MEASURING TESTING
Information Patent Grant
Through-silicon via crack detecting apparatus, detecting method, an...
- Patent number 11,531,057
- Issue date Dec 20, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- You-Hsien Lin
- G01 - MEASURING TESTING
Information Patent Grant
Through-silicon via detecting circuit, method and integrated circui...
- Patent number 11,408,929
- Issue date Aug 9, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- You-Hsien Lin
- G01 - MEASURING TESTING
Information Patent Grant
Through-silicon via (TSV) test circuit, TSV test method and integra...
- Patent number 11,114,417
- Issue date Sep 7, 2021
- Changxin Memory Technologies, Inc.
- You-Hsien Lin
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SIGNAL TRANSMISSION CIRCUIT AND METHOD, AND INTEGRATED CIRCUIT (IC)
- Publication number 20210270889
- Publication date Sep 2, 2021
- Changxin Memory Technologies, Inc.
- You-Hsien LIN
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
TESTER AND METHOD FOR CALIBRATING PROBE CARD AND DEVICE UNDER TESTI...
- Publication number 20210270868
- Publication date Sep 2, 2021
- Changxin Memory Technologies, Inc.
- You-Hsien LIN
- G01 - MEASURING TESTING
Information Patent Application
THROUGH-SILICON VIA DETECTING CIRCUIT, DETECTING METHODS AND INTEGR...
- Publication number 20210239751
- Publication date Aug 5, 2021
- Changxin Memory Technologies, Inc.
- You-Hsien LIN
- G01 - MEASURING TESTING
Information Patent Application
THROUGH-SILICON VIA DETECTING CIRCUIT, METHOD AND INTEGRATED CIRCUI...
- Publication number 20210215755
- Publication date Jul 15, 2021
- Changxin Memory Technologies, Inc.
- You-Hsien LIN
- G01 - MEASURING TESTING
Information Patent Application
THROUGH-SILICON VIA CRACK DETECTING APPARATUS, DETECTING METHOD, AN...
- Publication number 20210088576
- Publication date Mar 25, 2021
- Changxin Memory Technologies, Inc.
- You-Hsien LIN
- G01 - MEASURING TESTING
Information Patent Application
THROUGH-SILICON VIA (TSV) TEST CIRCUIT, TSV TEST METHOD AND INTEGRA...
- Publication number 20210074680
- Publication date Mar 11, 2021
- Changxin Memory Technologies, Inc.
- You-Hsien LIN
- H01 - BASIC ELECTRIC ELEMENTS

You-Hsien LIN

Person

Patents Grantslast 30 patents

Signal transmission circuit and method, and integrated circuit (IC)

Tester and method for calibrating probe card and device under testi...

Through-silicon via detecting circuit, detecting methods and integr...

Through-silicon via crack detecting apparatus, detecting method, an...

Through-silicon via detecting circuit, method and integrated circui...

Through-silicon via (TSV) test circuit, TSV test method and integra...

Patents Applicationslast 30 patents

SIGNAL TRANSMISSION CIRCUIT AND METHOD, AND INTEGRATED CIRCUIT (IC)

TESTER AND METHOD FOR CALIBRATING PROBE CARD AND DEVICE UNDER TESTI...

THROUGH-SILICON VIA DETECTING CIRCUIT, DETECTING METHODS AND INTEGR...

THROUGH-SILICON VIA DETECTING CIRCUIT, METHOD AND INTEGRATED CIRCUI...

THROUGH-SILICON VIA CRACK DETECTING APPARATUS, DETECTING METHOD, AN...

THROUGH-SILICON VIA (TSV) TEST CIRCUIT, TSV TEST METHOD AND INTEGRA...