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Younes BOUTALEB

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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    INTEGRATED CIRCUIT COMPRISING AN ASSEMBLY OF AN ELECTRONIC CHIP, AN...
    • Publication number 20240168245
    • Publication date May 23, 2024
    • STMicroelectronics (Grenoble 2) SAS
    • Romain COFFY
    • G02 - OPTICS
  • Information Patent Application

    CHIP PACKAGE AND ITS METHOD OF FABRICATION
    • Publication number 20240162259
    • Publication date May 16, 2024
    • STMicroelectronics (Grenoble 2) SAS
    • Younes BOUTALEB
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    QFN PACKAGE COMPRISING TWO ELECTRONIC CHIPS WITH DIFFERENT SUBSTRATES
    • Publication number 20240153880
    • Publication date May 9, 2024
    • STMicroelectroncis (Grenoble 2) SAS
    • Romain COFFY
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED CIRCUIT PACKAGE
    • Publication number 20240079363
    • Publication date Mar 7, 2024
    • STMicroelectronics (Grenoble 2) SAS
    • Romain COFFY
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED CIRCUIT PACKAGE
    • Publication number 20240047407
    • Publication date Feb 8, 2024
    • STMicroelectronics (Grenoble 2) SAS
    • Younes BOUTALEB
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE, FOR EXAMPLE AN OPTICAL PACKAGE, FOR AN INTEGRATED CIRCUIT
    • Publication number 20230403791
    • Publication date Dec 14, 2023
    • STMicroelectronics (Grenoble 2) SAS
    • Romain COFFY
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    TIME-OF-FLIGHT SENSOR
    • Publication number 20230266441
    • Publication date Aug 24, 2023
    • STMicroelectronics (Grenoble 2) SAS
    • Romain COFFY
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COOLING OF AN ELECTRONIC DEVICE
    • Publication number 20230137239
    • Publication date May 4, 2023
    • STMicroelectronics (Grenoble 2) SAS
    • Younes BOUTALEB
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COOLING OF AN ELECTRONIC DEVICE
    • Publication number 20230140705
    • Publication date May 4, 2023
    • STMicroelectronics (Grenoble 2) SAS
    • Younes BOUTALEB
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE FOR SEVERAL INTEGRATED CIRCUITS
    • Publication number 20230069969
    • Publication date Mar 9, 2023
    • STMicroelectronics (Grenoble 2) SAS
    • Younes BOUTALEB
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED CIRCUIT PACKAGE
    • Publication number 20230060870
    • Publication date Mar 2, 2023
    • STMicroelectronics (Grenoble 2) SAS
    • Younes BOUTALEB
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED CIRCUIT OPTICAL PACKAGE
    • Publication number 20220392820
    • Publication date Dec 8, 2022
    • STMicroelectronics (Grenoble 2) SAS
    • Romain COFFY
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    OPTICAL PACKAGE
    • Publication number 20220357536
    • Publication date Nov 10, 2022
    • STMicroelectronics (Alps) SAS
    • Deborah COGONI
    • G02 - OPTICS
  • Information Patent Application

    OPTICAL PACKAGE OF AN INTEGRATED CIRCUIT
    • Publication number 20220187123
    • Publication date Jun 16, 2022
    • STMicroelectronics (Grenoble 2) SAS
    • Romain COFFY
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED CIRCUIT PACKAGE WITH HEAT SINK AND MANUFACTURING METHOD...
    • Publication number 20220157683
    • Publication date May 19, 2022
    • STMicroelectronics (Grenoble 2) SAS
    • Younes BOUTALEB
    • H01 - BASIC ELECTRIC ELEMENTS