Younes BOUTALEB

Person

Grenoble, FR

People

Patents Grantslast 30 patents

Information Patent Grant
Optical package
- Patent number 12,292,607
- Issue date May 6, 2025
- STMicroelectronics (Alps) SAS
- Deborah Cogoni
- G02 - OPTICS
Information Patent Grant
Integrated circuit package with heat sink and manufacturing method...
- Patent number 12,278,155
- Issue date Apr 15, 2025
- STMicroelectronics (Grenoble 2) SAS
- Younes Boutaleb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical package of an integrated circuit
- Patent number 11,656,121
- Issue date May 23, 2023
- STMicroelectronics (Grenoble 2) SAS
- Romain Coffy
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20250239496
- Publication date Jul 24, 2025
- STMicroelectronics International N.V.
- Younes BOUTALEB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH HEAT SINK AND MANUFACTURING METHOD...
- Publication number 20250218884
- Publication date Jul 3, 2025
- STMicroelectronics (Grenoble 2) SAS
- Younes BOUTALEB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL PACKAGE COMPRISING A COATING BETWEEN AN OPTICAL ELEMENT AND...
- Publication number 20250142991
- Publication date May 1, 2025
- STMicroelectronics International N.V.
- Younes BOUTALEB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT COMPRISING AN ASSEMBLY OF AN ELECTRONIC CHIP, AN...
- Publication number 20240168245
- Publication date May 23, 2024
- STMicroelectronics (Grenoble 2) SAS
- Romain COFFY
- G02 - OPTICS
Information Patent Application
CHIP PACKAGE AND ITS METHOD OF FABRICATION
- Publication number 20240162259
- Publication date May 16, 2024
- STMicroelectronics (Grenoble 2) SAS
- Younes BOUTALEB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QFN PACKAGE COMPRISING TWO ELECTRONIC CHIPS WITH DIFFERENT SUBSTRATES
- Publication number 20240153880
- Publication date May 9, 2024
- STMicroelectroncis (Grenoble 2) SAS
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20240079363
- Publication date Mar 7, 2024
- STMicroelectronics (Grenoble 2) SAS
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20240047407
- Publication date Feb 8, 2024
- STMicroelectronics (Grenoble 2) SAS
- Younes BOUTALEB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE, FOR EXAMPLE AN OPTICAL PACKAGE, FOR AN INTEGRATED CIRCUIT
- Publication number 20230403791
- Publication date Dec 14, 2023
- STMicroelectronics (Grenoble 2) SAS
- Romain COFFY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TIME-OF-FLIGHT SENSOR
- Publication number 20230266441
- Publication date Aug 24, 2023
- STMicroelectronics (Grenoble 2) SAS
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING OF AN ELECTRONIC DEVICE
- Publication number 20230137239
- Publication date May 4, 2023
- STMicroelectronics (Grenoble 2) SAS
- Younes BOUTALEB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING OF AN ELECTRONIC DEVICE
- Publication number 20230140705
- Publication date May 4, 2023
- STMicroelectronics (Grenoble 2) SAS
- Younes BOUTALEB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR SEVERAL INTEGRATED CIRCUITS
- Publication number 20230069969
- Publication date Mar 9, 2023
- STMicroelectronics (Grenoble 2) SAS
- Younes BOUTALEB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20230060870
- Publication date Mar 2, 2023
- STMicroelectronics (Grenoble 2) SAS
- Younes BOUTALEB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT OPTICAL PACKAGE
- Publication number 20220392820
- Publication date Dec 8, 2022
- STMicroelectronics (Grenoble 2) SAS
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL PACKAGE
- Publication number 20220357536
- Publication date Nov 10, 2022
- STMicroelectronics (Alps) SAS
- Deborah COGONI
- G02 - OPTICS
Information Patent Application
OPTICAL PACKAGE OF AN INTEGRATED CIRCUIT
- Publication number 20220187123
- Publication date Jun 16, 2022
- STMicroelectronics (Grenoble 2) SAS
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH HEAT SINK AND MANUFACTURING METHOD...
- Publication number 20220157683
- Publication date May 19, 2022
- STMicroelectronics (Grenoble 2) SAS
- Younes BOUTALEB
- H01 - BASIC ELECTRIC ELEMENTS

Younes BOUTALEB

Person

Patents Grantslast 30 patents

Optical package

Integrated circuit package with heat sink and manufacturing method...

Optical package of an integrated circuit

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGE

INTEGRATED CIRCUIT PACKAGE WITH HEAT SINK AND MANUFACTURING METHOD...

OPTICAL PACKAGE COMPRISING A COATING BETWEEN AN OPTICAL ELEMENT AND...

INTEGRATED CIRCUIT COMPRISING AN ASSEMBLY OF AN ELECTRONIC CHIP, AN...

CHIP PACKAGE AND ITS METHOD OF FABRICATION

QFN PACKAGE COMPRISING TWO ELECTRONIC CHIPS WITH DIFFERENT SUBSTRATES

INTEGRATED CIRCUIT PACKAGE

INTEGRATED CIRCUIT PACKAGE

PACKAGE, FOR EXAMPLE AN OPTICAL PACKAGE, FOR AN INTEGRATED CIRCUIT

TIME-OF-FLIGHT SENSOR

COOLING OF AN ELECTRONIC DEVICE

COOLING OF AN ELECTRONIC DEVICE

PACKAGE FOR SEVERAL INTEGRATED CIRCUITS

INTEGRATED CIRCUIT PACKAGE

INTEGRATED CIRCUIT OPTICAL PACKAGE

OPTICAL PACKAGE

OPTICAL PACKAGE OF AN INTEGRATED CIRCUIT

INTEGRATED CIRCUIT PACKAGE WITH HEAT SINK AND MANUFACTURING METHOD...