Youngbae Kim

Person

Gyeonggi-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,119,288
- Issue date Oct 15, 2024
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module heatspreading lid having integrated separators...
- Patent number 11,776,866
- Issue date Oct 3, 2023
- Samsung Electronics Co., Ltd.
- Shle-Ge Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film package and method of fabricating package module
- Patent number 11,527,470
- Issue date Dec 13, 2022
- Samsung Electronics Co., Ltd.
- Shle-Ge Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device
- Patent number 11,367,714
- Issue date Jun 21, 2022
- Samsung Electronics Co., Ltd.
- Jangwoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board including warpage offset regions and semicond...
- Patent number 11,140,772
- Issue date Oct 5, 2021
- Samsung Electronics Co., Ltd.
- Shle-Ge Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nonvolatile memory device
- Patent number 10,985,213
- Issue date Apr 20, 2021
- Samsung Electronics Co., Ltd.
- Si-Ho Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable resistance memory device including symmetrical memory cell...
- Patent number 10,971,548
- Issue date Apr 6, 2021
- Samsung Electronics Co., Ltd.
- Sung-Ho Eun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 10,720,211
- Issue date Jul 21, 2020
- Samsung Electronics Co., Ltd.
- Sungwoo Kim
- G11 - INFORMATION STORAGE
Information Patent Grant
Computer-implemented method, processor-implemented system, and non-...
- Patent number 10,699,056
- Issue date Jun 30, 2020
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor devices
- Patent number 10,580,469
- Issue date Mar 3, 2020
- Samsung Electronics Co., Ltd.
- Sungwoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board including warpage offset regions and semicond...
- Patent number 10,506,706
- Issue date Dec 10, 2019
- Samsung Electronics Co., Ltd.
- Shle-Ge Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor devices
- Patent number 10,446,560
- Issue date Oct 15, 2019
- Samsung Electronics Co., Ltd.
- Sungwoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 10,410,722
- Issue date Sep 10, 2019
- Samsung Electronics Co., Ltd.
- Sungwoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 10,395,706
- Issue date Aug 27, 2019
- Samsung Electronics Co., Ltd.
- Sungwoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including an adhesive pattern
- Patent number 10,043,789
- Issue date Aug 7, 2018
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor chips having heat dissipation layers and gro...
- Patent number 9,978,661
- Issue date May 22, 2018
- Samsung Electronics Co., Ltd.
- Yunhyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having residual stress layers and methods of...
- Patent number 9,741,668
- Issue date Aug 22, 2017
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nonvolatile memory device having variable resistance memory cells a...
- Patent number 9,552,879
- Issue date Jan 24, 2017
- Samsung Electronics Co., Ltd.
- Yongkyu Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor packages having residual stress layers and methods of...
- Patent number 9,530,741
- Issue date Dec 27, 2016
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable resistance memory device
- Patent number 9,514,807
- Issue date Dec 6, 2016
- Samsung Electronics Co., Ltd.
- YounSeon Kang
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of manufacturing device substrate and display device manufac...
- Patent number 9,500,890
- Issue date Nov 22, 2016
- Samsung Display Co., Ltd.
- TaeHwan Kim
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
PHOTONIC IC CHIP, OPTICAL DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20250105232
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Youngbae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250087541
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Youngbae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250046692
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250022824
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250006648
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240421093
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH BANDWIDTH MEMORY STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240421080
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240421136
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240395650
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING TEST PATTERN AND METHOD OF FABRICAT...
- Publication number 20240213104
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Youngbae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240088003
- Publication date Mar 14, 2024
- Samsung Electronics Co., Ltd.
- Narae SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240079300
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240071895
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Seoeun KYUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE HAVING THE SAME
- Publication number 20240071845
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Jaesun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM PACKAGE AND PACKAGE MODULE INCLUDING THE SAME
- Publication number 20240032195
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240006282
- Publication date Jan 4, 2024
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230317625
- Publication date Oct 5, 2023
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220415758
- Publication date Dec 29, 2022
- Samsung Electronics Co., Ltd.
- YOUNGBAE KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE INCLUDING A HEAT RADIATION STRUCTURE
- Publication number 20210183724
- Publication date Jun 17, 2021
- Samsung Electronics Co., Ltd.
- SHLE-GE LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM PACKAGE AND METHOD OF FABRICATING PACKAGE MODULE
- Publication number 20210104452
- Publication date Apr 8, 2021
- Samsung Electronics Co., Ltd.
- SHLE-GE LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE
- Publication number 20210043612
- Publication date Feb 11, 2021
- Samsung Electronics Co., Ltd.
- JANGWOO LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NONVOLATILE MEMORY DEVICE
- Publication number 20200381478
- Publication date Dec 3, 2020
- Samsung Electronics Co., Ltd.
- SI-HO SONG
- G11 - INFORMATION STORAGE
Information Patent Application
COMPUTER-IMPLEMENTED METHOD, PROCESSOR-IMPLEMENTED SYSTEM, AND NON-...
- Publication number 20200233934
- Publication date Jul 23, 2020
- Samsung Electronics Co., Ltd.
- YOUNGBAE KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD INCLUDING WARPAGE OFFSET REGIONS AND SEMICOND...
- Publication number 20200092989
- Publication date Mar 19, 2020
- Samsung Electronics Co., Ltd.
- Shle-Ge Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARIABLE RESISTANCE MEMORY DEVICE INCLUDING SYMMETRICAL MEMORY CELL...
- Publication number 20200027925
- Publication date Jan 23, 2020
- Samsung Electronics Co., Ltd.
- SUNG-HO EUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20190325930
- Publication date Oct 24, 2019
- Samsung Electronics Co., Ltd.
- SUNGWOO KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20190325960
- Publication date Oct 24, 2019
- Samsung Electronics Co., Ltd.
- SUNGWOO KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD INCLUDING WARPAGE OFFESET REGIONS AND SEMICON...
- Publication number 20190124761
- Publication date Apr 25, 2019
- Samsung Electronics Co., Ltd.
- Shle-Ge Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20190027200
- Publication date Jan 24, 2019
- Samsung Electronics Co., Ltd.
- SUNGWOO KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20190027482
- Publication date Jan 24, 2019
- Samsung Electronics Co., Ltd.
- SUNGWOO KIM
- H01 - BASIC ELECTRIC ELEMENTS

Youngbae Kim

Person

Patents Grantslast 30 patents

Semiconductor package

Semiconductor module heatspreading lid having integrated separators...

Film package and method of fabricating package module

Semiconductor package device

Printed circuit board including warpage offset regions and semicond...

Nonvolatile memory device

Variable resistance memory device including symmetrical memory cell...

Semiconductor devices

Computer-implemented method, processor-implemented system, and non-...

Semiconductor devices

Printed circuit board including warpage offset regions and semicond...

Semiconductor devices

Semiconductor devices

Semiconductor devices

Semiconductor packages including an adhesive pattern

Packaged semiconductor chips having heat dissipation layers and gro...

Semiconductor packages having residual stress layers and methods of...

Nonvolatile memory device having variable resistance memory cells a...

Semiconductor packages having residual stress layers and methods of...

Variable resistance memory device

Method of manufacturing device substrate and display device manufac...

Patents Applicationslast 30 patents

PHOTONIC IC CHIP, OPTICAL DEVICE AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

HIGH BANDWIDTH MEMORY STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING TEST PATTERN AND METHOD OF FABRICAT...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE HAVING THE SAME

FILM PACKAGE AND PACKAGE MODULE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR MODULE INCLUDING A HEAT RADIATION STRUCTURE

FILM PACKAGE AND METHOD OF FABRICATING PACKAGE MODULE

SEMICONDUCTOR PACKAGE DEVICE

NONVOLATILE MEMORY DEVICE

COMPUTER-IMPLEMENTED METHOD, PROCESSOR-IMPLEMENTED SYSTEM, AND NON-...

PRINTED CIRCUIT BOARD INCLUDING WARPAGE OFFSET REGIONS AND SEMICOND...

VARIABLE RESISTANCE MEMORY DEVICE INCLUDING SYMMETRICAL MEMORY CELL...

SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICES

PRINTED CIRCUIT BOARD INCLUDING WARPAGE OFFESET REGIONS AND SEMICON...

SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICES