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Youngchan KO

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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
    • Publication number 20240063070
    • Publication date Feb 22, 2024
    • Samsung Electronics Co., Ltd.
    • Youngchan Ko
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240055338
    • Publication date Feb 15, 2024
    • Samsung Electronics Co., Ltd.
    • Byungho KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240021531
    • Publication date Jan 18, 2024
    • Samsung Electronics Co., Ltd.
    • Yongkoon Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20240014197
    • Publication date Jan 11, 2024
    • Samsung Electronics Co., Ltd.
    • Yongkoon Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE
    • Publication number 20240006325
    • Publication date Jan 4, 2024
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230230917
    • Publication date Jul 20, 2023
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE DEVICE
    • Publication number 20230197596
    • Publication date Jun 22, 2023
    • Samsung Electronics Co., Ltd.
    • Jeongseok KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGES
    • Publication number 20230187399
    • Publication date Jun 15, 2023
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230178492
    • Publication date Jun 8, 2023
    • Samsung Electronics Co., Ltd.
    • Kyungdon MUN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230154836
    • Publication date May 18, 2023
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230144454
    • Publication date May 11, 2023
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230148143
    • Publication date May 11, 2023
    • Samsung Electronics Co., Ltd.
    • Yongkoon LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGES HAVING WIRING PATTERNS
    • Publication number 20230131240
    • Publication date Apr 27, 2023
    • Samsung Electronics Co., Ltd.
    • Youngchan KO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230075027
    • Publication date Mar 9, 2023
    • Samsung Electronics Co., Ltd.
    • Myungsam Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230016061
    • Publication date Jan 19, 2023
    • Samsung Electronics Co., Ltd.
    • Yongkoon LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20220352061
    • Publication date Nov 3, 2022
    • Samsung Electronics Co., Ltd.
    • MYUNGSAM KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FAN-OUT TYPE SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE...
    • Publication number 20220344319
    • Publication date Oct 27, 2022
    • Samsung Electronics Co., Ltd.
    • Myungsam Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20220262748
    • Publication date Aug 18, 2022
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
    • Publication number 20220199520
    • Publication date Jun 23, 2022
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FAN-OUT TYPE SEMICONDUCTOR PACKAGE
    • Publication number 20220068784
    • Publication date Mar 3, 2022
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20220068822
    • Publication date Mar 3, 2022
    • Samsung Electronics Co., Ltd.
    • Kyungdon MUN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20220059440
    • Publication date Feb 24, 2022
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20220052006
    • Publication date Feb 17, 2022
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
    • Publication number 20220045008
    • Publication date Feb 10, 2022
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20220013465
    • Publication date Jan 13, 2022
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20220013454
    • Publication date Jan 13, 2022
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20210265251
    • Publication date Aug 26, 2021
    • Samsung Electronics Co., Ltd.
    • Kyungdon MUN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE
    • Publication number 20210233826
    • Publication date Jul 29, 2021
    • Samsung Electronics Co., Ltd.
    • YONGJIN PARK
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FAN-OUT TYPE SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE...
    • Publication number 20210210476
    • Publication date Jul 8, 2021
    • Samsung Electronics Co., Ltd.
    • Myungsam Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20210210427
    • Publication date Jul 8, 2021
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS