TREA

Youngchan KO

Follow

Person

  • Suwon-si, KR
People

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING A SUBSTRATE WI...
    • Publication number 20250192013
    • Publication date Jun 12, 2025
    • Samsung Electronics Co., Ltd.
    • Wooseok PARK
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER AND METHOD FOR MANUFACTU...
    • Publication number 20250192018
    • Publication date Jun 12, 2025
    • Samsung Electronics Co., Ltd.
    • Byung Ho KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER AND METHOD FOR MANUFACTU...
    • Publication number 20250192019
    • Publication date Jun 12, 2025
    • Samsung Electronics Co., Ltd.
    • Byung Ho Kim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20250118646
    • Publication date Apr 10, 2025
    • Samsung Electronics Co., Ltd.
    • MYUNGSAM KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE WITH IMPROVED STRUCTURAL STABILITY
    • Publication number 20250062240
    • Publication date Feb 20, 2025
    • Samsung Electronics Co., Ltd.
    • MyungDo Cho
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
    • Publication number 20250062221
    • Publication date Feb 20, 2025
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
    • Publication number 20250006696
    • Publication date Jan 2, 2025
    • Samsung Electronics Co., Ltd.
    • Yongkoon LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240421034
    • Publication date Dec 19, 2024
    • Samsung Electronics Co., LTD
    • Byungho KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240347468
    • Publication date Oct 17, 2024
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240321728
    • Publication date Sep 26, 2024
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME
    • Publication number 20240222280
    • Publication date Jul 4, 2024
    • Samsung Electronics Co., Ltd.
    • MyungDo CHO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
    • Publication number 20240063070
    • Publication date Feb 22, 2024
    • Samsung Electronics Co., Ltd.
    • Youngchan Ko
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240055338
    • Publication date Feb 15, 2024
    • Samsung Electronics Co., Ltd.
    • Byungho KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240021531
    • Publication date Jan 18, 2024
    • Samsung Electronics Co., Ltd.
    • Yongkoon Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20240014197
    • Publication date Jan 11, 2024
    • Samsung Electronics Co., Ltd.
    • Yongkoon Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE
    • Publication number 20240006325
    • Publication date Jan 4, 2024
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230230917
    • Publication date Jul 20, 2023
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE DEVICE
    • Publication number 20230197596
    • Publication date Jun 22, 2023
    • Samsung Electronics Co., Ltd.
    • Jeongseok KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGES
    • Publication number 20230187399
    • Publication date Jun 15, 2023
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230178492
    • Publication date Jun 8, 2023
    • Samsung Electronics Co., Ltd.
    • Kyungdon MUN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230154836
    • Publication date May 18, 2023
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230144454
    • Publication date May 11, 2023
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230148143
    • Publication date May 11, 2023
    • Samsung Electronics Co., Ltd.
    • Yongkoon LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGES HAVING WIRING PATTERNS
    • Publication number 20230131240
    • Publication date Apr 27, 2023
    • Samsung Electronics Co., Ltd.
    • Youngchan KO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230075027
    • Publication date Mar 9, 2023
    • Samsung Electronics Co., Ltd.
    • Myungsam Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230016061
    • Publication date Jan 19, 2023
    • Samsung Electronics Co., Ltd.
    • Yongkoon LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20220352061
    • Publication date Nov 3, 2022
    • Samsung Electronics Co., Ltd.
    • MYUNGSAM KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FAN-OUT TYPE SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE...
    • Publication number 20220344319
    • Publication date Oct 27, 2022
    • Samsung Electronics Co., Ltd.
    • Myungsam Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20220262748
    • Publication date Aug 18, 2022
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
    • Publication number 20220199520
    • Publication date Jun 23, 2022
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS