Youngja KIM

Person

Cheonan-si, KR

People

Patents Applicationslast 30 patents

Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240363579
- Publication date Oct 31, 2024
- Samsung Electronics Co., Ltd.
- Seungyeop Oh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240355640
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- Youngja Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240293884
- Publication date Sep 5, 2024
- Samsung Electronics Co., Ltd.
- Youngja Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BALL ATTACHMENT APPARATUS
- Publication number 20240207961
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Youngja KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240178181
- Publication date May 30, 2024
- Samsung Electronics Co., Ltd.
- Youngja KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE MANUFACTURING METHOD AND A BONDING DEVICE FOR...
- Publication number 20240170448
- Publication date May 23, 2024
- Samsung Electronics Co.,Ltd.
- Sanghyeon Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REFLOW APPARATUS AND SOLDER REFLOW METHOD
- Publication number 20240145259
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Youngja KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REFLOW APPARATUS
- Publication number 20240128229
- Publication date Apr 18, 2024
- Samsung Electronics Co., LTD
- Byungkeun Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REFLOW SYSTEM AND SOLDER REFLOW METHOD USING THE SAME
- Publication number 20240120310
- Publication date Apr 11, 2024
- Samsung Electronics Co., Ltd.
- Youngja KIM
- B08 - CLEANING
Information Patent Application
SOLDER REFLOW APPARATUS
- Publication number 20240113067
- Publication date Apr 4, 2024
- Samsung Electronics Co., Ltd.
- Youngja KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...
- Publication number 20240047410
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Youngja KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...
- Publication number 20240047411
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Junga LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...
- Publication number 20240049400
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Youngja KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE SAME
- Publication number 20230180381
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Kanggyune Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING BLADE INCLUDING DIAMOND PARTICLES
- Publication number 20230039736
- Publication date Feb 9, 2023
- Samsung Electronics Co., Ltd.
- Youngja KIM
- C01 - INORGANIC CHEMISTRY
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MODULE INCLUDING TH...
- Publication number 20210111094
- Publication date Apr 15, 2021
- Samsung Electronics Co., Ltd.
- Youngja KIM
- H01 - BASIC ELECTRIC ELEMENTS

Youngja KIM

Person

Patents Applicationslast 30 patents

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

BALL ATTACHMENT APPARATUS

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE MANUFACTURING METHOD AND A BONDING DEVICE FOR...

SOLDER REFLOW APPARATUS AND SOLDER REFLOW METHOD

SOLDER REFLOW APPARATUS

SOLDER REFLOW SYSTEM AND SOLDER REFLOW METHOD USING THE SAME

SOLDER REFLOW APPARATUS

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE SAME

DICING BLADE INCLUDING DIAMOND PARTICLES

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MODULE INCLUDING TH...